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    • 45. 发明授权
    • Recessed contact for multi-gate FET optimizing series resistance
    • 嵌入式多栅极FET优化串联电阻
    • US08362568B2
    • 2013-01-29
    • US12583933
    • 2009-08-28
    • Chung-Hsun LinJosephine B. Chang
    • Chung-Hsun LinJosephine B. Chang
    • H01L29/94
    • H01L29/66795H01L29/66636H01L29/785
    • A transistor, which can be referred to as a multi-gate transistor or as a FinFET, includes a gate structure having a length, a width and a height. The transistor further includes at least one electrically conductive channel or fin between a source region and a drain region that passes through the width of the gate structure. The channel has a first height (h1) within the gate structure that is less than the height of the gate structure, and has a second height (h2) external to the gate structure, where h2 is less than h1. The transistor further includes a silicide layer disposed at least partially over the at least one channel external to the gate structure. Reducing the fin height external to the gate structure is shown to beneficially reduce parasitic resistance.
    • 可以称为多栅极晶体管或FinFET的晶体管包括具有长度,宽度和高度的栅极结构。 晶体管还包括通过栅极结构的宽度的源极区域和漏极区域之间的至少一个导电沟道或鳍。 通道在门结构内具有小于栅极结构的高度的第一高度(h1),并且具有栅极结构外部的第二高度(h2),其中h2小于h1。 晶体管还包括至少部分地设置在栅极结构外部的至少一个沟道上的硅化物层。 降低栅极结构外部的翅片高度被显示有利地减少寄生电阻。
    • 46. 发明申请
    • MULTI-GATE TRANSISTOR HAVING SIDEWALL CONTACTS
    • 具有端子接触器的多栅极晶体管
    • US20120326236A1
    • 2012-12-27
    • US13604340
    • 2012-09-05
    • Josephine B. ChangDechao GuoShu-Jen HanChung-Hsun Lin
    • Josephine B. ChangDechao GuoShu-Jen HanChung-Hsun Lin
    • H01L29/78
    • H01L29/785H01L29/66795H01L2029/7858
    • A multi-gate transistor having a plurality of sidewall contacts and a fabrication method that includes forming a semiconductor fin on a semiconductor substrate and etching a trench within the semiconductor fin, depositing an oxide material within the etched trench, and etching the oxide material to form a dummy oxide layer along exposed walls within the etched trench; and forming a spacer dielectric layer along vertical sidewalls of the dummy oxide layer. The method further includes removing exposed dummy oxide layer in a channel region in the semiconductor fin and beneath the spacer dielectric layer, forming a high-k material liner along sidewalls of the channel region in the semiconductor fin, forming a metal gate stack within the etched trench, and forming a plurality of sidewall contacts within the semiconductor fin along adjacent sidewalls of the dummy oxide layer.
    • 一种具有多个侧壁触点的多栅极晶体管及其制造方法,包括在半导体衬底上形成半导体鳍片并蚀刻半导体鳍片内的沟槽,在蚀刻沟槽内沉积氧化物材料,并蚀刻氧化物材料以形成 沿着蚀刻沟槽内的暴露壁的虚拟氧化物层; 以及沿所述虚拟氧化物层的垂直侧壁形成间隔电介质层。 该方法还包括去除半导体鳍片中的沟道区域中的暴露的虚拟氧化物层并且在间隔物电介质层下方形成沿着半导体鳍片中的沟道区域的侧壁形成高k材料衬垫,在蚀刻 沟槽,并且在半导体鳍片内沿虚拟氧化物层的相邻侧壁形成多个侧壁接触。
    • 47. 发明申请
    • Formation of Field Effect Transistor Devices
    • 场效应晶体管器件的形成
    • US20120306000A1
    • 2012-12-06
    • US13118689
    • 2011-05-31
    • Josephine B. ChangPaul C. ChangMichael A. GuillornJeffrey W. Sleight
    • Josephine B. ChangPaul C. ChangMichael A. GuillornJeffrey W. Sleight
    • H01L29/792H01L21/336
    • H01L27/0207H01L29/66545
    • A method includes defining active regions on a substrate, forming a dummy gate stack material over exposed portions of the active regions of the substrate and non-active regions of the substrate, removing portions of the dummy gate stack material to expose portions of the active regions and non-active regions of the substrate and define dummy gate stacks, forming a gap-fill dielectric material over the exposed portions of the substrate and the source and drain regions, removing portions of the gap-fill dielectric material to expose the dummy gate stacks, removing the dummy gate stacks to form dummy gate trenches, forming dividers within the dummy gate trenches, depositing gate stack material inside the dummy gate trenches, over the dividers, and the gap-fill dielectric material, and removing portions of the gate stack material to define gate stacks.
    • 一种方法包括在衬底上限定有源区域,在衬底的有源区域和衬底的非有源区域的暴露部分上形成虚拟栅极堆叠材料,去除虚拟栅极堆叠材料的部分以暴露部分有源区域 和非活性区域,并且限定伪栅极堆叠,在衬底和源极和漏极区域的暴露部分上形成间隙填充电介质材料,去除间隙填充电介质材料的部分以暴露伪栅极堆叠 ,去除虚拟栅极堆叠以形成伪栅极沟槽,在虚拟栅极沟槽内形成分隔线,在虚拟栅极沟槽内部,在分隔器上方形成栅极堆叠材料,以及间隙填充电介质材料,以及去除栅极堆叠材料的部分 定义栅极堆叠。