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    • 46. 发明授权
    • NAND-type non-volatile memory devices having a stacked structure
    • 具有堆叠结构的NAND型非易失性存储器件
    • US07626228B2
    • 2009-12-01
    • US11637686
    • 2006-12-12
    • Jae-Kwan ParkKi-Nam KimSoon-Moon Jung
    • Jae-Kwan ParkKi-Nam KimSoon-Moon Jung
    • H01L29/792H01L23/48H01L23/52
    • H01L27/115G11C16/0483H01L27/11568H01L27/11578
    • A NAND-type nonvolatile memory device includes a semiconductor substrate and a first ground selection line and a first string selection line disposed on the substrate in parallel to each other. A plurality of parallel first word lines are interposed on the substrate between the first ground selection line and the first string selection line. A first impurity-doped region is formed in the semiconductor substrate adjacent to the first word lines, the first ground selection line, and the first string selection line. A first interlayer dielectric layer is disposed on the first ground selection line, the first string selection line, the plurality of first word lines, and the semiconductor substrate. An epitaxial contact plug contacts the semiconductor substrate through the first interlayer dielectric layer. A single crystalline semiconductor layer is disposed on the first interlayer dielectric layer that contacts the epitaxial contact plug. A plurality of parallel second word lines is disposed on the single crystalline semiconductor layer. A second impurity-doped region formed in the single crystalline semiconductor layer adjacent to the second word lines. A second interlayer dielectric layer is disposed on the plurality of second word lines and the single crystalline semiconductor layer.
    • NAND型非易失性存储器件包括半导体衬底和彼此平行地布置在衬底上的第一接地选择线和第一串选择线。 在第一接地选择线和第一串选择线之间的基板上插入多个平行的第一字线。 在与第一字线,第一地选择线和第一串选择线相邻的半导体衬底中形成第一杂质掺杂区。 第一层间介电层设置在第一接地选择线,第一串选择线,多个第一字线和半导体衬底上。 外延接触插塞通过第一层间介电层与半导体衬底接触。 单晶半导体层设置在与外延接触插塞接触的第一层间电介质层上。 多个平行的第二字线布置在单晶半导体层上。 形成在与第二字线相邻的单晶半导体层中的第二杂质掺杂区。 第二层间介电层设置在多个第二字线和单晶半导体层上。