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41. 发明申请

US20070293038A1 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate 审中-公开
公开(公告)号：US20070293038A1
公开(公告)日：2007-12-20
申请号：US11890892
申请日：2007-08-08
申请人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
发明人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
IPC分类号： H01L21/4763
CPC分类号： H05K3/4694 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2924/0002 , H01L2924/09701 , H05K3/0023 , H05K3/205 , H05K3/4617 , H05K3/4623 , H05K2201/0195 , H05K2201/09536 , H05K2201/09881 , H05K2201/09972 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

42. 发明申请

US20070290343A1 Electronic component, semiconductor device employing same, and method for manufacturing electronic component 有权
标题翻译：电子部件，使用该半导体装置的半导体装置及电子部件的制造方法
公开(公告)号：US20070290343A1
公开(公告)日：2007-12-20
申请号：US11810070
申请日：2007-06-04
申请人： Yoshimichi Harada , Akiyoshi Aoyagi , Hiroshi Asami
发明人： Yoshimichi Harada , Akiyoshi Aoyagi , Hiroshi Asami
IPC分类号： H01L23/48
CPC分类号： H01L24/11 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/12 , H01L2224/02126 , H01L2224/02255 , H01L2224/03019 , H01L2224/0401 , H01L2224/05018 , H01L2224/05027 , H01L2224/05082 , H01L2224/0555 , H01L2224/05552 , H01L2224/05556 , H01L2224/05557 , H01L2224/05558 , H01L2224/05559 , H01L2224/05572 , H01L2224/05624 , H01L2224/10126 , H01L2224/1147 , H01L2224/11902 , H01L2224/13007 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Herein disclosed an electronic component having a passivation layer in which an opening that exposes a part of a pad electrode is formed, an underlying metal layer formed on the pad electrode and the passivation layer, and a barrier metal layer formed on the underlying metal layer for an external connection electrode, the electronic component including a recess or/and a projection configured to be provided under the barrier metal layer outside or/and inside the opening, the underlying metal layer being formed on the recess or/and the projection and having a surface shape that follows the recess or/and the projection.
摘要翻译：这里公开了一种具有钝化层的电子部件，其中形成有露出焊盘电极的一部分的开口，形成在焊盘电极和钝化层上的下面的金属层以及形成在下面的金属层上的阻挡金属层外部连接电极，所述电子部件包括凹部或/和突出部，所述突起构造成设置在所述阻挡金属层的下方或/或所述开口内侧，所述下部金属层形成在所述凹部或/和所述突起上，并且具有跟随凹部或/和突起的表面形状。

43. 发明授权

US06831357B2 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same 有权
公开(公告)号：US06831357B2
公开(公告)日：2004-12-14
申请号：US10397608
申请日：2003-03-26
申请人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
发明人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
IPC分类号： H01L2348
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/49833 , H01L2221/68345 , H01L2221/68359 , H01L2224/16 , H01L2924/01078 , H01L2924/01087 , H01L2924/09701 , H01L2924/19041 , H05K3/0052 , H05K3/20 , H05K3/4602 , H05K3/4614 , H05K3/467 , H05K3/4682 , H05K3/4694 , H05K2201/0352 , H05K2201/09536 , H05K2203/061
摘要： A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

44. 发明授权

US06210610B1 Method of manufacturing lens, injection mold for molding of lens, and molded lens 失效
标题翻译：制造镜片的方法，用于模制镜片的注射模具和模制透镜
公开(公告)号：US06210610B1
公开(公告)日：2001-04-03
申请号：US09101945
申请日：1998-07-17
申请人： Kiyohiro Saito , Hiroshi Asami
发明人： Kiyohiro Saito , Hiroshi Asami
IPC分类号： B29D1100
CPC分类号： B29C45/2708 , B29C45/2701 , B29C45/2703 , B29D11/00413 , B29L2011/0016 , Y10S425/808
摘要： A gate top member 23 is placed to a gate 22 opened toward the circumferential edge of a molding spectacle-lens cavity 13 formed between inserts 11 and 12. The plural gate top members 23 each having a different height are previously prepared, and attached with a bolt to be exchanged. In pilot production, it is checked for each of various lenses which opening configuration of the gate 22 can form a spectacle lens with defined great-precision by exchanging the gate top member 23 in order to obtain each gate opening configuration changed by exchanging the gate top member 23.
摘要翻译：门顶构件23被放置到朝向在插入件11和12之间形成的成型眼镜镜腔13的周缘开口的门22上。预先准备了各自具有不同高度的多个门顶构件23，螺栓要交换。在先导生产中，通过更换栅极顶部构件23来检查各种透镜中的各个透镜的打开构造可以形成具有确定的高精度的眼镜镜片，以便获得通过更换门顶部而改变的每个开口构造会员23。

45. 发明授权

US4120759A Constant current density plating method 失效
标题翻译：恒流密度电镀法
公开(公告)号：US4120759A
公开(公告)日：1978-10-17
申请号：US832907
申请日：1977-09-13
申请人： Hiroshi Asami , Masao Kaji
发明人： Hiroshi Asami , Masao Kaji
IPC分类号： C25D21/12 , C25D1/00 , C25C1/20 , G05F1/10
CPC分类号： C25D21/12 , Y10S204/07
摘要： In the present plating method the bath contains an electrolyte solution having a uniform ion concentration. A common electrode, a plating electrode and a standard electrode are arranged in the bath. A direct current source is connected between the common electrode and the plating electrode. A further, constant, direct current source is connected between the common electrode and the standard electrode. A potentiometer device is arranged for detecting resistance changes between these electrodes due to variations in the ion concentration and in the mobility of the electrolyte solution between the electrodes. A control is responsive to the potentiometer device for regulating the plating current supplied by the direct current source as a function of the potential difference detected by the potentiometer device, whereby a constant plating current density is achieved.
摘要翻译：在本电镀方法中，浴含有具有均匀离子浓度的电解液。浴中配置有公共电极，电镀电极和标准电极。在公共电极和电镀电极之间连接有直流电源。在公共电极和标准电极之间连接另外恒定的直流电源。布置电位器装置，用于检测电极之间的电离变化，这是由于离子浓度的变化和电极间的电解质溶液的迁移率。控制器响应于电位器装置，用于调节由直流电源提供的电镀电流作为由电位计装置检测的电位差的函数，从而实现恒定的电镀电流密度。

46. 发明授权

US3965913A Cash dispensing system 失效
标题翻译：现金分配系统
公开(公告)号：US3965913A
公开(公告)日：1976-06-29
申请号：US440659
申请日：1974-02-08
申请人： Katsuyuki Tokura , Shuichi Maeda , Takeshi Endo , Kenji Yoichizono , Hiroshi Asami
发明人： Katsuyuki Tokura , Shuichi Maeda , Takeshi Endo , Kenji Yoichizono , Hiroshi Asami
IPC分类号： G07D1/00 , G07D11/00 , B65H29/14
CPC分类号： G07D11/0018 , G07D11/0039
摘要： A cash dispensing system capable of automatically counting and dispensing cash of the amount requested by a customer to be withdrawn is disclosed. Where an error occurs in a cash dispensing process, cash dispensing is stopped and the cash dispensing operation is repeated from the beginning. Where the error occurs a predetermined number of times, the cash dispensing operation is entirely stopped.
摘要翻译：公开了一种能够自动计数和分配由客户要求提取的金额的现金分配系统。如果现金分配过程发生错误，则停止现金分发，并从头开始重复现金分发操作。在发生错误预定次数的情况下，完全停止现金分发操作。

47. 发明授权

US10642070B2 Progressive addition lens 有权
公开(公告)号：US10642070B2
公开(公告)日：2020-05-05
申请号：US15311358
申请日：2015-06-03
申请人： HOYA LENS THAILAND LTD. , Tadashi Kaga , Toshihide Shinohara , Ayumu Ito , Hiroshi Asami
发明人： Tadashi Kaga , Toshihide Shinohara , Ayumu Ito , Hiroshi Asami
IPC分类号： G02C7/06
CPC分类号： G02C7/068 , G02C7/06 , G02C7/066
摘要： Progressive addition lens includes a near portion having a power for viewing a near field, a distance portion having a power for viewing a distance field further than the near field, and an intermediate portion connecting the distance portion and the near portion. The progressive addition lens includes an aspherical object-side surface and an aspherical eyeball-side surface and is formed in rotational symmetry with respect to a center of design of the progressive addition lens. The object-side surface includes a first stable region formed in rotational symmetry with respect to the center of design and including the center of design, and an aspherical region arranged outside of the first stable region to contact the first stable region and formed in rotational symmetry with respect to the center of design. A Peak to Valley value of a mean surface refractive power in the first stable region is 0.12 D or less.

48. 发明授权

US08263871B2 Mount board and semiconductor module 有权
标题翻译：安装板和半导体模块
公开(公告)号：US08263871B2
公开(公告)日：2012-09-11
申请号：US12620216
申请日：2009-11-17
申请人： Hiroshi Asami , Osamu Yamagata
发明人： Hiroshi Asami , Osamu Yamagata
IPC分类号： H05K1/00 , H01L23/34
CPC分类号： H05K1/0203 , H01L21/4857 , H01L23/13 , H01L23/49816 , H01L23/49822 , H01L23/5383 , H01L23/5384 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/00014 , H01L2924/01025 , H01L2924/01078 , H01L2924/16195 , H01L2924/19105 , H05K1/117 , H05K2201/066 , H05K2201/09472 , H05K2201/09845 , H05K2201/10371 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mount board includes a laminated wiring section including a plurality of wiring layers formed on a surface of a substrate in a laminated manner, wherein a portion of an inner wiring layer is exposed to the outside, the inner wiring layer being any of the plurality of wiring layers excluding an uppermost wiring layer.
摘要翻译：一种安装板包括层叠布线部分，其包括以层叠的方式形成在基板的表面上的多个布线层，其中内部布线层的一部分暴露于外部，内部布线层是多个不包括最上面布线层的布线层。

49. 发明授权

US07939360B2 Semiconductor device and manufacturing method therefor 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07939360B2
公开(公告)日：2011-05-10
申请号：US12364072
申请日：2009-02-02
申请人： Hiroshi Asami , Yoshihiro Nabe , Akihiro Morimoto
发明人： Hiroshi Asami , Yoshihiro Nabe , Akihiro Morimoto
IPC分类号： H01L21/00 , H01L31/0203
CPC分类号： H01L27/14687 , H01L24/48 , H01L27/14618 , H01L31/0203 , H01L2224/48 , H01L2924/00014 , H01L2924/16195 , H01L2924/181 , H01L2224/48091 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substrate is bonded to the spacer via a second adhesive and disposed above the light-reception area. A first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and the first projection abuts on the semiconductor chip.
摘要翻译：一种半导体器件，包括形成有光接收区域的半导体芯片，间隔物和透明基板。间隔物通过第一粘合剂结合到半导体芯片并且围绕光接收区域。透明基板通过第二粘合剂粘合到间隔件上并设置在光接收区域的上方。具有预定高度的第一突起形成在半导体芯片一侧的间隔物的表面上，第一突起抵接在半导体芯片上。

50. 发明申请

US20100244270A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件和半导体器件的制造方法
公开(公告)号：US20100244270A1
公开(公告)日：2010-09-30
申请号：US12727804
申请日：2010-03-19
申请人： Hiroshi Asami , Masaki Hatano , Akihiro Morimoto
发明人： Hiroshi Asami , Masaki Hatano , Akihiro Morimoto
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L27/14636 , H01L21/486 , H01L23/49827 , H01L24/83 , H01L27/1464 , H01L27/1469 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/00 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01083 , H01L2224/13111 , H01L2924/00012 , H01L2224/13109 , H01L2924/00014
摘要： A semiconductor device includes: a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.
摘要翻译：半导体器件包括：半导体器件的元件衬底; 设置在所述部件基板的一个表面上的电极焊盘; 增强部件基板的支撑板材料; 在支撑板材料上形成的通孔; 填充在通孔中的导电材料; 以及插入在电极焊盘和导电材料之间并将部件基板和支撑板材料接合的接合部件。

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