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41. 发明授权

US07339146B2 Low cost microwave over components manufactured from conductively doped resin-based materials 有权
标题翻译：低成本微波超过由导电掺杂的树脂基材料制造的部件
公开(公告)号：US07339146B2
公开(公告)日：2008-03-04
申请号：US11328977
申请日：2006-01-10
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： H05B6/46 , H01J25/50
CPC分类号： H05B6/66
摘要： Microwave oven components are formed of a conductively doped resin-based material. The conductively doped resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductively doped resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
摘要翻译：微波炉部件由导电掺杂的树脂基材料形成。导电掺杂的树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。导电粉末，导电纤维或其组合的重量百分数为导电掺杂树脂基材料重量的约20％至50％。微米导电粉末是金属或导电非金属或非金属镀金属。微米导电纤维可以是金属纤维或金属镀覆的纤维。此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。可以使用任何可镀纤维作为非金属纤维的芯。在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

42. 发明授权

US07326463B2 Conductive circuits or cables manufactured from conductive loaded resin-based materials 有权
标题翻译：由导电负载的树脂基材料制成的导电电路或电缆
公开(公告)号：US07326463B2
公开(公告)日：2008-02-05
申请号：US11057534
申请日：2005-02-14
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： D02G3/00
CPC分类号： H05K3/101 , B29C45/0001 , B29C45/0013 , B29K2995/0005 , B29L2031/3456 , G06K19/07749 , H05K1/095 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113 , Y10T428/2913 , Y10T428/292 , Y10T428/2927 , Y10T428/2998 , Y10T428/31609
摘要： Circuit conductors and cables are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
摘要翻译：电路导体和电缆由导电负载的树脂基材料形成。导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或或者由非金属，电镀或与金属粉末组合的组合。微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

43. 发明申请

US20070278924A1 Low cost spark plug manufactured from conductive loaded resin-based materials 有权
公开(公告)号：US20070278924A1
公开(公告)日：2007-12-06
申请号：US11796521
申请日：2007-04-28
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： H01T13/39
CPC分类号： H01T13/39 , H01T13/20 , Y10T428/249928
摘要： Spark plug devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

44. 发明授权

US07273135B2 Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials 有权
标题翻译：由导电负载的树脂基材料制造的低成本磁性制动器和运动控制装置
公开(公告)号：US07273135B2
公开(公告)日：2007-09-25
申请号：US11121666
申请日：2005-05-04
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： F16F15/03
CPC分类号： H05K3/101 , B29C45/0001 , B29C45/0013 , B29K2995/0005 , B29L2031/3456 , G06K19/07749 , H05K1/095 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113
摘要： Magnetic brake components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
摘要翻译：磁性制动器部件由导电负载的树脂基材料形成。导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或或者由非金属，电镀或与金属粉末组合的组合。微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

45. 发明授权

US07223144B2 Low cost spark plug manufactured from conductive loaded resin-based materials 有权
标题翻译：由导电负载的树脂基材料制成的低成本火花塞
公开(公告)号：US07223144B2
公开(公告)日：2007-05-29
申请号：US11131525
申请日：2005-05-18
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： H01T4/04
CPC分类号： H01T13/20 , B29C45/0001 , B29C45/0013 , B29K2995/0005 , B29L2031/3456 , G06K19/07749 , H01Q1/1271 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q9/0407 , H01Q9/16 , H01Q9/30 , H01T13/39 , H01T21/02 , H05K1/095 , H05K3/101 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113
摘要： Spark plug devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
摘要翻译：火花塞装置由导电负载的树脂基材料形成。导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。微米导电粉末是金属或导电非金属或非金属镀金属。微米导电纤维可以是金属纤维或金属镀覆的纤维。此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。可以使用任何可镀纤维作为非金属纤维的芯。在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

46. 发明授权

US07222727B2 Low cost food processing belts and other conveyances manufactured from conductive loaded resin-based materials 有权
标题翻译：低成本的食品加工带和其他由导电负载的树脂基材料制成的运输工具
公开(公告)号：US07222727B2
公开(公告)日：2007-05-29
申请号：US10823147
申请日：2004-04-13
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： B65G43/06 , G08B21/00
CPC分类号： H05K3/101 , B29C45/0001 , B29C45/0013 , B29K2995/0005 , B29L2031/3456 , B65G15/32 , B65G17/40 , H05K1/095 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113 , Y10T428/25
摘要： Conveyors, chutes, skids, guides, and ways for the transporting of material are formed of a conductive loaded resin-based material such that fragments of these structures can be detected by a metal detector. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders.
摘要翻译：用于输送材料的输送机，滑槽，滑道，导轨和方法由导电负载的树脂基材料形成，使得可以通过金属检测器检测这些结构的碎片。导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀的等，或由金属如不锈钢，镍，铜，银，也可以是金属镀，或者或者由非金属，电镀或与金属粉末组合的组合。

47. 发明授权

US07164388B2 Low cost adjustable RF resonator devices manufactured from conductive loaded resin-based materials 有权
标题翻译：由导电负载的树脂基材料制造的低成本可调RF谐振器装置
公开(公告)号：US07164388B2
公开(公告)日：2007-01-16
申请号：US10827061
申请日：2004-04-19
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： H01Q9/00
CPC分类号： H05K3/101 , B29C45/0001 , B29C45/0013 , B29K2995/0005 , B29L2031/3456 , G06K19/07749 , H01Q7/00 , H01Q11/08 , H03B5/18 , H03H5/12 , H05K1/095 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113
摘要： Inductor-capacitor (LC) RF resonator circuits are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based inductor-capacitor (LC) RF resonator circuits can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the inductor-capacitor (LC) RF resonator circuits can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.
摘要翻译：电感电容器（LC）RF谐振器电路由导电负载的树脂基材料形成。导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20和0.40之间。微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或或者由非金属，电镀或与金属粉末组合的组合。微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。导电负载的树脂基电感器 - 电容器（LC）RF谐振器电路可以使用诸如注射成型压缩成型或挤出的方法形成。用于形成电感器 - 电容器（LC）RF谐振器电路的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

48. 发明授权

US07079086B2 Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials 失效
标题翻译：由导电负载的树脂基材料制造的低成本电磁场吸收装置
公开(公告)号：US07079086B2
公开(公告)日：2006-07-18
申请号：US10863407
申请日：2004-06-08
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： H01Q1/42
CPC分类号： H05K3/101 , B29C45/0001 , B29C45/0013 , B29C70/58 , B29C70/882 , B29K2995/0005 , B29L2031/3456 , G06K19/07749 , H01Q1/243 , H01Q17/00 , H01R13/6599 , H05K1/095 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113 , Y10T428/1328 , Y10T428/249972
摘要： Electromagnetic absorbing devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.
摘要翻译：电磁吸收装置由导电负载的树脂基材料形成。导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或或者由非金属，电镀或与金属粉末组合的组合。微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

49. 发明申请

US20060131547A1 Electriplast moldable capsule and method of manufacture 失效
标题翻译：电胚成型胶囊及其制造方法
公开(公告)号：US20060131547A1
公开(公告)日：2006-06-22
申请号：US11313015
申请日：2005-12-20
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： H01B1/24
CPC分类号： H01B1/22 , H01B1/24
摘要： A method to form moldable capsules of a conductively doped resin-based material are created. The method comprises compressing a bundle of micron conductive fiber strands by passing the bundle through a compressing ring. A resin-based material is extruded/pultruded onto the compressed bundle. The resin-based material and the bundle are sectioned into moldable capsules. The micron conductive fiber comprises between about 20% and about 50% of the total weight of each moldable capsule.
摘要翻译：制造形成导电掺杂的树脂基材料的可成型胶囊的方法。该方法包括通过使束穿过压缩环来压缩一束微米导电纤维束。将树脂基材料挤出/拉挤到压缩的束上。将树脂基材料和束分成可模制胶囊。微米导电纤维占每个可模制胶囊总重量的约20％至约50％。

50. 发明申请

US20060119523A1 Low cost electronic probe devices manufactured from conductive loaded resin-based materials 有权
公开(公告)号：US20060119523A1
公开(公告)日：2006-06-08
申请号：US11343019
申请日：2006-01-30
申请人： Thomas Aisenbrey
发明人： Thomas Aisenbrey
IPC分类号： G01R29/10
CPC分类号： G01R1/06788 , G01R1/067 , G01R3/00
摘要： Electronic probe devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

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