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    • 31. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06515912B1
    • 2003-02-04
    • US10018156
    • 2001-12-10
    • Guoqiao TaoJohannes DijkstraRobertus Dominicus Joseph VerhaarThomas James Davies
    • Guoqiao TaoJohannes DijkstraRobertus Dominicus Joseph VerhaarThomas James Davies
    • G11C1600
    • G11C16/0441
    • A semiconductor device comprising a memory cell, which memory cell comprises: a write transistor (TWR) a read transistor (TRE), a sense transistor (TSE) provided with a sense transistor gate, a first sense transistor electrode (7) and a second sense transistor electrode (3), the first sense transistor electrode (7) being connected to a read transistor electrode (9), the sense transistor gate being arranged as a floating gate (FG), said floating gate being separated from the second sense electrode (3) by a sense transistor oxide layer (THINOX) and from a write transistor electrode (1) by a tunnel oxide layer (TUNOX); a voltage source arrangement (5, Vsi_p, Vsi_e) to provide the second sense transistor electrode (3) with a predetermined voltage during programming and erasing, such that no stress induced leakage current occurs in the sense transistor oxide layer (THINOX).
    • 一种包括存储单元的半导体器件,该存储单元包括:写晶体管(TWR),读晶体管(TRE),具有感测晶体管栅极的检测晶体管(TSE),第一检测晶体管电极(7) 感测晶体管电极(3),所述第一感测晶体管电极(7)连接到读取晶体管电极(9),所述感测晶体管栅极被布置为浮置栅极(FG),所述浮置栅极与所述第二感测电极 (3)通过感测晶体管氧化物层(THINOX)和由晶体管电极(1)通过隧道氧化物层(TUNOX);电压源装置(5,Vsi_p,Vsi_e),以提供第二感测晶体管电极 )在编程和擦除期间具有预定电压,使得在感测晶体管氧化物层(THINOX)中不产生应力感应泄漏电流。
    • 32. 发明授权
    • Concurrent program reconnaissance with piggyback pulses for multi-level cell flash memory designs
    • 并发程序侦察与搭载脉冲的多级单元闪存设计
    • US06496410B1
    • 2002-12-17
    • US09779764
    • 2001-02-08
    • Allan Parker
    • Allan Parker
    • G11C1600
    • G11C11/5628G11C16/12
    • A method of programming a memory cell that has 2N voltage levels where N>1 and represents the number of bits stored within the memory cell. The method includes setting a target number T of piggyback programming pulses for programming each of 2N−1 vt levels of the memory cell, applying T piggyback programming pulses to the memory cell and determining when the highest one of the 2N−1 vt levels is programmed. If it is determined that the highest one of the 2N−1 vt levels is programmed by a number M of piggyback programming pulses that is less than the target number T, then compensating the programming speed of those ones of said T number of piggyback programming pulses subsequent to the Mth piggyback programming pulse.
    • 一种编程具有2N电压电平的存储单元的方法,其中N≥1并且表示存储在存储单元中的位数。 该方法包括设置搭载编程脉冲的目标数量T,以对存储器单元的2N-1V级别的每一个进行编程,将T个搭载编程脉冲施加到存储器单元,并确定2N-1Vt级中最高的一个是否被编程 。 如果确定2N-1Vt电平中最高的一个是通过小于目标数目T的数量M的搭载编程脉冲编程的,则补偿所述T个载波编程脉冲中的那些的编程速度 在第M个背负编程脉冲之后。
    • 37. 发明授权
    • Non-volatile semiconductor memory device
    • 非易失性半导体存储器件
    • US06822900B2
    • 2004-11-23
    • US10115956
    • 2002-04-05
    • Teruhiko Kamei
    • Teruhiko Kamei
    • G11C1600
    • G11C16/3427G11C7/18G11C16/0475G11C16/0491
    • A non-volatile semiconductor memory device has a memory cell array region in which a plurality of memory cells are disposed in both column and row directions, each of the memory cells having first and second MONOS memory cells controlled by a word gate and first and second control gates. The memory cell array region is divided in the row direction into a plurality of sector regions extending longitudinally in the column direction. Each of the sector regions is divided into a plurality of large blocks, such as eight large blocks. There are eight control gate drivers for each sector region. Each of these eight control gate drivers sets potentials for first and second control gates of all the memory cells disposed within the corresponding one block of the eight large blocks.
    • 非易失性半导体存储器件具有存储单元阵列区域,其中在列和行方向上布置多个存储单元,每个存储单元具有由字门控制的第一和第二MONOS存储单元,第一和第二 控制门 存储单元阵列区域在行方向上被划分为在列方向上纵向延伸的多个扇区区域。 每个扇区被划分成多个大块,例如八个大块。 每个扇区都有八个控制栅极驱动器。 这八个控制栅极驱动器中的每一个设置了设置在八个大块的相应一个块内的所有存储单元的第一和第二控制栅极的电位。
    • 39. 发明授权
    • Non-volatile memory device with erase address register
    • 具有擦除地址寄存器的非易失性存储器件
    • US06788582B2
    • 2004-09-07
    • US10672652
    • 2003-09-26
    • Frankie F. Roohparvar
    • Frankie F. Roohparvar
    • G11C1600
    • G11C16/16G11C8/12G11C16/344
    • A non-volatile memory device includes an array of non-volatile memory cells. The memory has control circuitry to erase the non-volatile memory cells and perform erase verification operations. The memory can be arranged in numerous erasable blocks and/or sub-blocks. An erase register stores data indicating an erase state of corresponding memory sub-blocks. During erase verification, the memory programs the erase register when a non-erased memory cell is located in a corresponding sub-block. Additional erase pulses can be selectively applied to sub-blocks based upon the erase register data. Likewise, erase verification operations can be selectively performed on sub-blocks based upon the erase register data. An address register is provided to store an address of a non-erased memory cell identified during verification. The address from the register is used as a start address for subsequent verification operations on the same array location.
    • 非易失性存储器件包括非易失性存储器单元阵列。 存储器具有用于擦除非易失性存储器单元并执行擦除验证操作的控制电路。 存储器可以被布置在多个可擦除块和/或子块中。 擦除寄存器存储指示相应存储器子块的擦除状态的数据。 在擦除验证期间,当未擦除的存储单元位于相应的子块中时,存储器对擦除寄存器进行编程。 可以基于擦除寄存器数据将附加擦除脉冲选择性地施加到子块。 类似地,可以基于擦除寄存器数据在子块上选择性地执行擦除验证操作。 提供地址寄存器以存储在验证期间识别的未擦除的存储器单元的地址。 寄存器中的地址用作同一阵列位置后续验证操作的起始地址。
    • 40. 发明授权
    • High voltage regulator for low voltage integrated circuit processes
    • 用于低压集成电路工艺的高压调节器
    • US06785161B2
    • 2004-08-31
    • US10184756
    • 2002-06-28
    • Theodore T. Pekny
    • Theodore T. Pekny
    • G11C1600
    • G11C5/146
    • An improved voltage reduction circuit and method is described that incorporates an independently controllable back bias voltage for increased gate/bulk fields in isolation well voltage reduction transistors that couple to and reduce external voltages that are too high for the integrated circuit process technology limits. The improved voltage reduction circuit and method allows for a higher overall available voltage and current flow for regulation by the circuit. Additionally, the improved voltage reduction circuit and method reduces voltage reduction circuit size by allowing for efficient implementation in a single isolation well. Furthermore, the improved voltage reduction circuit and method includes a back bias voltage control circuit that turns on and regulates the back bias voltage and avoids the problem of reverse bias conditions.
    • 描述了一种改进的电压降低电路和方法,其包括独立可控的反向偏置电压,用于隔离阱电压降低晶体管中的增加的栅极/体区,其耦合到和降低对于集成电路工艺技术限制而言太高的外部电压。 改进的电压降低电路和方法允许更高的总体可用电压和电流流动以供电路调节。 此外,改进的电压降低电路和方法通过允许在单个隔离阱中的有效实现来降低电压降低电路尺寸。 此外,改进的电压降低电路和方法包括反向偏置电压控制电路,其接通和调节背偏置电压并避免反向偏置条件的问题。