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31. 发明申请

US20100116376A1 ANTI-TOMBSTONING LEAD FREE ALLOYS FOR SURFACE MOUNT REFLOW SOLDERING 审中-公开
标题翻译：防反射焊接自由合金表面安装反射焊接
公开(公告)号：US20100116376A1
公开(公告)日：2010-05-13
申请号：US12576123
申请日：2009-10-08
申请人： Benlih Huang , Ning-Cheng Lee
发明人： Benlih Huang , Ning-Cheng Lee
IPC分类号： B23K35/34 , B23K1/00
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3463 , H05K2201/10636 , Y02P70/611
摘要： A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn—Ag—Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8° C. using a 5° C./min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5%, Cu 0.3-1% balanced with Sn.
摘要翻译：公开了一种包含锡，银和铜的无铅焊料合金组合物，以及用于最小化墓碑频率的回流焊接方法。在一个具体的示例性实施例中，用于最小化本公开的墓碑效应的无铅Sn-Ag-Cu焊料合金在熔化和延长熔化期间显示高质量分数，如扩大的DSC峰所示，其允许平衡的表面张力在芯片组件的两端进行开发。根据该示例性实施方案的其它方面，合金在熔化时显示大于20％的固体的质量分数，并且使用5℃/ min扫描速率显示大于8℃的DSC峰宽。根据本示例性实施方案的其它方面，合金的重量基础为Ag 1-4.5％，Cu为0.3-1％，与Sn平衡。

32. 发明授权

US07696453B2 Chromium-free welding consumable 失效
标题翻译：无铬焊接耗材
公开(公告)号：US07696453B2
公开(公告)日：2010-04-13
申请号：US12029164
申请日：2008-02-11
申请人： Gerald S. Frankel , John C. Lippold
发明人： Gerald S. Frankel , John C. Lippold
IPC分类号： B23K35/34 , B23K35/40 , C22C19/03
CPC分类号： B23K35/3033 , B23K35/0261 , B23K35/0266 , B23K35/0272 , C22C19/03
摘要： A chromium-free welding consumable and a method of welding stainless steel to reduce the presence of chromium emissions. The consumable is made from an alloy that reduces the emission of chromium during a welding process, and include predominantly nickel, with between approximately five and ten weight percent copper, up to approximately two percent by weight of ruthenium and up to five percent non-copper alloying ingredients. Welding consumables made from the alloy are particularly well-suited for welding austenitic stainless steels, such as type 304 stainless steel. The method involves using chromium-free weld filler material with a stainless steel base material.
摘要翻译：无铬焊接材料和不锈钢焊接方法，以减少铬的排放。消耗品由合金制成，其在焊接过程中减少铬的排放，并且主要包括镍，其中约5至10重量％的铜，至多约2重量％的钌和至多5％的非铜合金成分。由合金制成的焊接材料特别适用于焊接奥氏体不锈钢，如304不锈钢。该方法涉及使用不锈钢基材的无铬焊料填充材料。

33. 发明申请

US20080156398A1 BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE 有权
标题翻译：使用金属颗粒的粘合方法和粘合材料
公开(公告)号：US20080156398A1
公开(公告)日：2008-07-03
申请号：US11965973
申请日：2007-12-28
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： B23K35/34
CPC分类号： B23K35/34 , B23K35/3612 , H01L23/3107 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29294 , H01L2224/29387 , H01L2224/29393 , H01L2224/30181 , H01L2224/32175 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/48739 , H01L2224/48839 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8384 , H01L2224/83986 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0541 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/48 , H01L2224/83205
摘要： It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 μm and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.
摘要翻译：本发明的目的是提供一种能够在与使用平均粒径不大于100nm的金属颗粒的接合材料相比在较低温度下的接合界面处通过金属接合实现接合的接合材料和接合方法。提供了一种粘合材料，其包括金属颗粒前体，金属颗粒前体是选自金属氧化物颗粒，金属碳酸盐颗粒和金属羧酸盐颗粒中的至少一种，平均粒径为1 以及由有机物构成的还原剂，其中金属颗粒前体的含量相对于每100质量份的接合材料大于50质量份且不大于99质量份。

34. 发明授权

US07380700B2 Paste composition for brazing and brazing method using the same 有权
标题翻译：用于钎焊和钎焊的组合物使用它
公开(公告)号：US07380700B2
公开(公告)日：2008-06-03
申请号：US10504270
申请日：2003-03-12
申请人： Takashi Watsuji
发明人： Takashi Watsuji
IPC分类号： B23K31/02 , B23K35/34
CPC分类号： B23K35/025 , B23K35/30 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K35/322 , B23K35/3613
摘要： The invention provides a paste composition for brazing, which upon brazing, does not cause brazing insufficiency such as residual carbon in any type of industrial brazing furnace, can achieve an excellent outward appearance of a brazed portion after brazing and can be applied to any existing industrial brazing furnaces, as well as a brazing method using the same. The paste composition for brazing comprises a brazing powder, butyl rubber and an organic solvent, wherein the brazing powder comprises at least one member selected from the group consisting of copper brazing powder, brass brazing powder, silver brazing powder, phosphorus copper brazing powder, nickel brazing powder, gold brazing powder, palladium brazing powder, copper-manganese brazing powder, silver-manganese brazing powder and cobalt brazing powder. The paste composition for brazing is applied onto at least a part of a surface of one base material and then the one base material is brazed onto the other base material.
摘要翻译：本发明提供一种用于钎焊的糊剂组合物，其在钎焊时不会引起钎焊不足，例如任何类型的工业钎焊炉中的残留碳，可以在钎焊后实现钎焊部分的优异外观，并且可以应用于任何现有的工业钎焊炉，以及使用该钎焊炉的钎焊方法。用于钎焊的糊料组合物包括钎焊粉末，丁基橡胶和有机溶剂，其中钎焊粉末包括选自铜钎焊粉末，黄铜钎焊粉末，银钎焊粉末，磷铜钎焊粉末，镍钎焊粉末，金钎焊粉末，钯钎焊粉末，铜锰钎焊粉末，银锰钎焊粉末和钴钎焊粉末。将用于钎焊的糊料组合物施加到一个基材的表面的至少一部分上，然后将一个基材钎焊到另一个基材上。

35. 发明申请

US20070277909A1 Solder Paste and Electronic Device Using Same 审中-公开
标题翻译：焊膏和电子设备使用相同
公开(公告)号：US20070277909A1
公开(公告)日：2007-12-06
申请号：US11660552
申请日：2005-09-06
申请人： Norihito Tsukahara , Kazuhiro Nishikawa
发明人： Norihito Tsukahara , Kazuhiro Nishikawa
IPC分类号： B23K35/34
CPC分类号： B23K35/362 , B23K35/0244 , B23K35/262 , B23K35/3613 , H05K3/3484 , H05K3/3489 , H05K2201/0224 , H05K2203/111
摘要： This invention provides such solder paste that prevents, when a minute-size passive component or a semiconductor integrated circuit element having a small terminal pitch is soldered by the solder paste, the solder particles from being oxidized to provide highly-reliable solder joint even when the solder paste is used in a very small amount. Specifically, solder paste obtained by mixing solder alloy powders with flux is structured so that the flux has, at a pre-heating temperature in a heating/melting step, a high temperature retention property by which the flux covers the surface of the solder alloy powders.
摘要翻译：本发明提供了这样一种焊锡膏，当通过焊膏焊接具有小端子间距的微小的无源部件或半导体集成电路元件时，即使当焊料粒子被焊膏的使用量很少。特别地，通过将焊剂合金粉末与焊剂混合而获得的焊膏被构造成使得焊剂在加热/熔融步骤中的预热温度下具有保持焊剂覆盖焊料合金粉末表面的高温保持性能。

36. 发明授权

US07300528B2 Flux binder system 失效
标题翻译：助焊剂系统
公开(公告)号：US07300528B2
公开(公告)日：2007-11-27
申请号：US11048413
申请日：2005-02-01
申请人： Dennis D. Crockett
发明人： Dennis D. Crockett
IPC分类号： B23K35/34 , B23K1/20
CPC分类号： B23K35/362 , B23K35/3601
摘要： A welding flux that includes a flux agent and a binder. The binder includes a colloidal binder formed from small particles of silicon dioxide. The binder can be dried at lower temperatures to thereby for a greater range of fluxing agents and/or metal alloys to be included in the welding flux. The colloidal binder can constitute 100 percent of binder or form only part of the binder.
摘要翻译：包括助焊剂和粘合剂的焊剂。粘合剂包括由二氧化硅的小颗粒形成的胶体粘合剂。粘合剂可以在较低的温度下干燥，从而可以在焊剂中包含较大范围的助熔剂和/或金属合金。胶体粘合剂可以构成100％的粘合剂或仅形成粘合剂的一部分。

37. 发明申请

US20060163231A1 Ferritic stainless steel welding wire and manufacturing method thereof 有权
标题翻译：铁素体不锈钢焊丝及其制造方法
公开(公告)号：US20060163231A1
公开(公告)日：2006-07-27
申请号：US11338075
申请日：2006-01-24
申请人： Masaaki Kobayashi , Satoru Nonaka , Yukio Agata , Teiichiro Saito , Tadashi Ito
发明人： Masaaki Kobayashi , Satoru Nonaka , Yukio Agata , Teiichiro Saito , Tadashi Ito
IPC分类号： B23K35/34
CPC分类号： C22C38/42 , B23K35/308 , B23K35/40 , C21D8/065 , C22C38/44 , C22C38/50
摘要： The present invention provides a ferritic stainless steel welding wire which allows prevention of wire breaking, fine refining of crystal grains, and increased cracking resistance. A wire rod used essentially consists of, in mass %, 0.03% or less of C, 3% or less of B, 3% or less of Mn, 2% or less of Ni, 11 to 20% of Zr, 3% or less of Mo, 1% or less of Co, 2% or less of Cu, 0.02 to 2.0% of Al, 0.2 to 1.0% of Ti, 0.02% or less of O, 0.04% or less of N, at least one of Nb and Ta, the mass % thereof being eight times the total mass % of the C and N to 1.0 mass %, and the balance of Fe and unavoidable impurities. When the number of crystals per square mm (mm2) of a cross section of the wire rod is defined as m, a grain number of the crystal expressed by an exponent (G) in an expression of m=8×2G is set to 3 to 10 by the heat treatment.
摘要翻译：本发明提供一种铁素体不锈钢焊丝，其能够防止断线，晶粒细化，耐龟裂性提高。使用的线材基本上以质量％计含有0.03％以下的C，3％以下的B，3％以下的Mn，2％以下的Ni，11〜20％的Zr，3％以下较少的Mo，1％以下的Co，2％以下的Cu，0.02〜2.0％的Al，0.2〜1.0％的Ti，0.02％以下的O，0.04％以下的N， Nb和Ta，其质量％为C的总质量％的8倍，N为1.0质量％，余量由Fe和不可避免的杂质构成。当线材横截面的每平方毫米（mm 2）的晶体数定义为m时，由m表示的指数（G）表示的晶体的晶粒数通过热处理将= 8×2 设定为3〜10。

38. 发明授权

US06968990B2 Fabrication and utilization of metallic powder prepared without melting 失效
标题翻译：金属粉末的制备和利用，不熔化
公开(公告)号：US06968990B2
公开(公告)日：2005-11-29
申请号：US10350668
申请日：2003-01-23
申请人： Eric Allen Ott , Andrew Philip Woodfield , Clifford Earl Shamblen
发明人： Eric Allen Ott , Andrew Philip Woodfield , Clifford Earl Shamblen
IPC分类号： B22F9/28 , B23K1/00 , B23K26/34 , B23K35/02 , B23K35/24 , B23K35/32 , B23K35/34 , C23C4/12 , C23C10/28 , C23C24/08 , C23C24/10 , C23C26/00 , C23C26/02 , B23K20/24
CPC分类号： C22C1/0458 , B22F9/20 , B22F9/28 , B22F2998/00 , B23K1/0008 , B23K26/32 , B23K26/34 , B23K26/342 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/0255 , B23K35/24 , B23K35/325 , B23K35/34 , B23K2101/001 , B23K2103/50 , C22C14/00 , C23C24/04 , C23C24/087 , C23C24/106 , B22F3/001 , B22F2207/01
摘要： A metallic alloy made of metallic constituent elements is fabricated and utilized by first furnishing a mixture of nonmetallic precursor compounds of the metallic constituent elements, and thereafter chemically reducing the mixture of nonmetallic precursor compounds to produce a metallic alloy as a metallic alloy powder, without melting the metallic alloy. The metallic alloy powder is applied to a surface of a substrate article, preferably in a coating, joining, or deposition application.
摘要翻译：通过首先提供金属组成元素的非金属前体化合物的混合物，然后化学还原非金属前体化合物的混合物，制造金属合金作为金属合金粉末，而不熔化，制造和利用由金属构成元素制成的金属合金金属合金。将金属合金粉末涂覆在基材制品的表面上，优选涂布，接合或沉积应用。

39. 发明申请

US20050241731A1 Flux composition and techniques for use thereof 失效
标题翻译：助焊剂组合物及其使用技术
公开(公告)号：US20050241731A1
公开(公告)日：2005-11-03
申请号：US10834293
申请日：2004-04-28
申请人： Eric Duchesne , Michael Gaynes , Timothy Gosselin , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duchesne , Michael Gaynes , Timothy Gosselin , Kang-Wook Lee , Valerie Oberson
IPC分类号： B23K35/34 , B23K35/36 , H05K3/34
CPC分类号： B23K35/3618 , B23K35/3615 , B23K35/3616 , H05K3/3484 , H05K3/3489
摘要： The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.
摘要翻译：本发明涉及用于其中的焊接技术和组合物。一方面，提供助焊剂组合物。助熔剂组合物包含助熔剂，其包含有机酸，有机粘合剂和有机润湿剂。另一方面，提供了一种用于连接物体的焊接方法，包括以下步骤。将助焊剂组合物和焊料化合物施加到一个或多个物体的至少一部分上。助熔剂组合物包含助熔剂，其包含有机酸，有机粘合剂和有机润湿剂。然后连接对象。

40. 发明申请

US20050082343A1 Method of joining using reactive multilayer foils with enhanced control of molten joining materials 审中-公开
标题翻译：使用反应性多层膜连接的方法，具有增强的熔融接合材料的控制
公开(公告)号：US20050082343A1
公开(公告)日：2005-04-21
申请号：US10898650
申请日：2004-07-23
申请人： Jiaping Wang , Omar Knio , Timothy Weihs
发明人： Jiaping Wang , Omar Knio , Timothy Weihs
IPC分类号： B23K1/00 , B23K20/00 , B23K20/06 , B23K20/08 , B23K28/00 , B23K31/02 , B23K31/12 , B23K35/02 , B23K35/34 , B32B15/01 , C06B21/00 , C06B45/14 , C23C14/14 , F24V30/00 , G05B17/02 , H05K3/34 , B23K20/12
CPC分类号： G05B17/02 , B23K1/0006 , B23K1/0016 , B23K20/00 , B23K20/06 , B23K20/08 , B23K20/165 , B23K28/00 , B23K31/02 , B23K31/12 , B23K35/0233 , B23K35/0238 , B23K35/34 , B23K2101/40 , B23K2103/05 , B23K2103/10 , B32B15/01 , B32B15/017 , C06B21/0083 , C06B45/14 , C23C14/14 , F24V30/00 , H05K3/3463 , H05K3/3494 , H05K2203/0405 , H05K2203/1163 , Y10T428/12632
摘要： In accordance with the invention, bodies of materials are joined by disposing between them a reactive multilayer foil and one or more layers of meltable joining material such as braze or solder. The bodies are pressed together against the foil and joining material, and the foil is ignited to melt the joining material. The pressing is near the critical pressure and typically produces a joint having a strength of at least 70-85% the maximum strength producible at practical maximum pressures. Thus for example, reactively formed stainless steel soldered joints that were heretofore made at an applied pressure of about 100 MPa can be made with substantially the same strength at a critical applied pressure of about 10 kPa. Advantages of the process include minimization of braze or solder extrusion and reduced equipment and processing costs, especially in the joining of large bodies.
摘要翻译：根据本发明，通过在它们之间设置反应性多层箔和一层或多层可熔融连接材料如钎焊或焊料来连接材料体。主体被压在一起抵靠箔和接合材料，并且箔被点燃以熔化接合材料。压力接近临界压力，并且通常产生具有至少70-85％的强度的接头，该最大强度在实际最大压力下可产生。因此，例如，在约100MPa的施加压力下制造的反应形成的不锈钢焊接接头可以在约10kPa的临界施加压力下具有基本上相同的强度。该方法的优点包括最小化钎焊或焊料挤出，并减少设备和加工成本，特别是在大体积的连接中。

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