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    • 37. 发明申请
    • WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME
    • 接线板及安装结构
    • US20130192882A1
    • 2013-08-01
    • US13750801
    • 2013-01-25
    • KYOCERA SLC Technologies Corporation
    • Takayuki NEJIMEMasaaki HARAZONOYoshihiro HOSOI
    • H05K1/03
    • H05K1/038H01L2224/16225H05K1/036H05K3/0044H05K2203/025H05K2203/1572
    • A wiring board of the present invention includes a substrate including a woven fabric formed of a plurality of glass fibers and a resin covering the woven fabric; a plurality of through holes T penetrating through the substrate in a thickness direction thereof; and a plurality of through hole conductors adhered to inner walls of the through holes T respectively. The through holes T include a first through hole and a second through hole, and, in the woven fabric, the number of the glass fibers through which the first through hole penetrates is larger than the number of the glass fibers through which the second through hole penetrates. In the first and second through holes, portions thereof having narrowest widths are surrounded by the woven fabric, and the narrow width portion of the first through hole is smaller than the narrow width portion of the second through hole.
    • 本发明的布线基板包括:基材,其具有由多根玻璃纤维形成的织布和覆盖该织物的树脂; 多个通孔T,其贯穿基板的厚度方向; 以及多个通孔导体分别粘附到通孔T的内壁。 通孔T包括第一通孔和第二通孔,并且在机织织物中,第一通孔穿过的玻璃纤维的数量大于第二通孔所通过的玻璃纤维的数量 渗透 在第一和第二通孔中,具有最窄宽度的部分被织物包围,并且第一通孔的窄宽度部分小于第二通孔的窄宽度部分。