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31. 发明授权

US09736935B2 Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board 有权
公开(公告)号：US09736935B2
公开(公告)日：2017-08-15
申请号：US14446650
申请日：2014-07-30
申请人： PANASONIC CORPORATION
发明人： Hiroharu Inoue , Shingo Yoshioka
IPC分类号： B32B37/16 , B32B37/26 , C08L79/08 , H05K1/05 , H05K1/03 , C08L63/00 , C08J5/24 , C09D163/00 , C09D179/08 , C08G59/24 , C08G59/62
CPC分类号： H05K1/0373 , B32B2311/00 , B32B2457/08 , C08G59/245 , C08G59/621 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08J2433/00 , C08L63/00 , C08L79/08 , C08L2203/20 , C08L2205/03 , C09D163/00 , C09D179/08 , H05K1/0346 , H05K1/0353 , H05K1/0366 , H05K2201/0162 , H05K2201/09136 , Y10T156/10 , Y10T428/31529 , C08L33/08
摘要： The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

32. 发明授权

US09683132B2 Process for protecting an electronic device by selective deposition of polymer coatings 有权
公开(公告)号：US09683132B2
公开(公告)日：2017-06-20
申请号：US15261624
申请日：2016-09-09
申请人： Syed Taymur Ahmad , Bruce Acton
发明人： Syed Taymur Ahmad , Bruce Acton
IPC分类号： H05K1/00 , C09D183/04 , H05K3/28 , H05K7/14 , H05K1/03 , C09D133/16 , H01R12/71 , H05K3/40
CPC分类号： C09D183/04 , C09D133/16 , H01R12/716 , H05K1/0353 , H05K3/282 , H05K3/284 , H05K3/285 , H05K3/40 , H05K7/1427 , H05K2201/0162 , H05K2201/0187 , H05K2203/1173 , H05K2203/121 , H05K2203/1322 , H05K2203/1338 , H05K2203/1361 , H05K2203/1366 , H05K2203/1572
摘要： Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying a first polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a second polymer, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers, without the need for multilayer coatings on any component. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.

33. 发明申请

US20170136779A1 METHOD OF AEROSOL PRINTING A SOLDER MASK INK COMPOSITION 审中-公开
公开(公告)号：US20170136779A1
公开(公告)日：2017-05-18
申请号：US15409923
申请日：2017-01-19
申请人： XEROX CORPORATION
发明人： Yiliang Wu , Kurt Halfyard
IPC分类号： B41J2/215 , H05K3/34 , H05K3/28 , H05K1/03 , C09D11/102 , C09D11/033
CPC分类号： B41J2/215 , B41J2/01 , C09D11/033 , C09D11/102 , G03F1/68 , H05K1/0353 , H05K3/285 , H05K3/3452 , H05K2201/2081 , H05K2203/0545 , H05K2203/0783
摘要： A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.

34. 发明申请

US20170135197A1 Electronic Circuit Device Having a Protective Backing for Low-Velocity Impacts and High-Velocity Impacts 有权
公开(公告)号：US20170135197A1
公开(公告)日：2017-05-11
申请号：US15299406
申请日：2016-10-20
申请人： Polyera Corporation
发明人： Hjalmar Edzer Ayco Huitema
IPC分类号： H05K1/02 , H05K1/03 , H05K5/00
CPC分类号： H05K1/0393 , H05K1/0271 , H05K1/028 , H05K1/0353 , H05K5/0017 , H05K2201/0133
摘要： An electronic circuit device having a circuit stack, such as an electronic display device with a display stack, includes a protective backing having multiple layers or with a graded layer that protects the electronic circuits from both low velocity impacts and high velocity impacts. The protective backing may have an elastic layer and a viscoelastic layer or have a graded layer with a graded structure that gradually transitions between an elastic region on a first side and a viscoelastic region on a second side. The elastic first layer or region protects the display stack from low velocity impacts while the viscoelastic layer or region protects the display stack from high velocity impacts. The elastic layer or region may be arranged such that it does not add substantial stiffness to the overall circuit stack when it is flexed relatively slowly under normal use.

35. 发明授权

US09609747B2 Wiring board 有权
公开(公告)号：US09609747B2
公开(公告)日：2017-03-28
申请号：US14661665
申请日：2015-03-18
申请人： FUJIFILM Corporation
发明人： Yasuaki Matsushita , Tokihiko Matsumura
IPC分类号： H05K1/03 , H05K3/24 , H05K1/09
CPC分类号： H05K1/0353 , H05K1/092 , H05K3/247 , H05K2201/0769
摘要： A wiring board includes: an insulating substrate; and a wiring layer including a first metal layer disposed on the insulating substrate and a second metal layer disposed so as to cover a surface of the first metal layer, the surface not being in contact with the insulating substrate, wherein the thickness of the second metal layer is 1/10 of the total thickness of the wiring layer, the wiring layer contains a migration inhibitor, and the mass Y of the migration inhibitor contained in the second metal layer is greater than the mass X of the migration inhibitor contained in the first metal layer.

36. 发明授权

US09606430B2 Method of aerosol printing a solder mask ink composition 有权
公开(公告)号：US09606430B2
公开(公告)日：2017-03-28
申请号：US14471967
申请日：2014-08-28
申请人： Xerox Corporation
发明人： Yiliang Wu , Kurt Halfyard
IPC分类号： B41J2/21 , G03F1/68 , B41J2/01 , H05K3/34 , H05K3/28
CPC分类号： B41J2/215 , B41J2/01 , C09D11/033 , C09D11/102 , G03F1/68 , H05K1/0353 , H05K3/285 , H05K3/3452 , H05K2201/2081 , H05K2203/0545 , H05K2203/0783
摘要： A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.

37. 发明授权

US09596754B2 Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate 有权
标题翻译：干膜，使用其的印刷线路板，制造印刷线路板的方法和倒装芯片安装基板
公开(公告)号：US09596754B2
公开(公告)日：2017-03-14
申请号：US14367611
申请日：2012-12-18
申请人： TAIYO INK MFG. CO., LTD.
发明人： Gento Iwayama , Arata Endo , Shoji Minegishi , Masao Arima
IPC分类号： H05K1/00 , B32B7/02 , B32B27/38 , G06F7/00 , H01L21/00 , H05K1/03 , H01L21/56 , H05K3/28 , H01L23/498 , G03F7/40 , H05K3/00 , H05K3/46 , B32B27/08 , B32B27/16 , B32B27/20 , H05K3/34
CPC分类号： H05K1/0353 , B32B27/08 , B32B27/16 , B32B27/20 , B32B2264/102 , B32B2264/104 , B32B2307/202 , B32B2307/206 , B32B2457/08 , G03F7/40 , H01L21/563 , H01L23/49816 , H01L23/49894 , H01L2224/73204 , H01L2224/92125 , H05K1/036 , H05K1/0373 , H05K3/0082 , H05K3/281 , H05K3/3436 , H05K3/4611 , H05K2201/0195 , H05K2201/10674 , H05K2201/10977 , Y10T428/24975 , Y10T428/31515
摘要： A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.
摘要翻译：干膜包括载体膜，热固性树脂组合物层和形成在载体膜和热固性树脂组合物层之间的光固化树脂组合物层。热固性树脂组合物层通过涂布和干燥热固性树脂组合物形成。可光固化树脂组合物层通过涂布和干燥光固化性树脂组合物而形成。印刷书写板的制造方法包括：以热固化性树脂组合物层和光固化性树脂组合物层的表面侧的顺序，在基板上形成树脂绝缘层，该树脂绝缘层包括热固性树脂组合物层和光固化性树脂组合物层通过光刻法构图树脂绝缘层，并通过激光加工对树脂绝缘层进行图案化。

38. 发明授权

US09595754B2 Patterned conductive structure and method for forming the same 有权
标题翻译：图案导电结构及其形成方法
公开(公告)号：US09595754B2
公开(公告)日：2017-03-14
申请号：US14583446
申请日：2014-12-26
申请人： Wistron NeWeb Corp.
发明人： Babak Radi , Yong-Jyun Lu , Ming-Chi Chiu , Chien-Min Hsu , Shih-Hong Chen
IPC分类号： H01Q1/38 , H05K3/04 , H05K3/14 , H05K3/16 , H05K1/03 , H05K3/38 , H01Q1/22
CPC分类号： H01Q1/38 , H01Q1/22 , H05K1/0326 , H05K1/0346 , H05K1/0353 , H05K3/048 , H05K3/146 , H05K3/16 , H05K3/381 , H05K2201/0129 , H05K2203/0769 , H05K2203/0783 , H05K2203/107 , H05K2203/1184 , H05K2203/308
摘要： A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.
摘要翻译：提供了一种用于形成图案化导电结构的方法。该方法包括在基底表面上形成可溶层，其中可溶层具有露出表面粗糙部分的开口。第一导电层形成在可溶层上，其中第一导电层延伸到开口中的粗糙部分上。可溶层和可溶层上的第一导电层被去除，其中对应于粗糙部分的第一导电层的一部分残留在基底上。还提供了通过该方法形成的图案化导电结构。

39. 发明授权

US09585248B2 Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board 有权
标题翻译：树脂组合物，树脂清漆，预浸料，金属包覆层压板和印刷线路板
公开(公告)号：US09585248B2
公开(公告)日：2017-02-28
申请号：US14988085
申请日：2016-01-05
申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
发明人： Hiroharu Inoue , Shingo Yoshioka
IPC分类号： B32B15/08 , B32B15/09 , B32B15/092 , B32B15/098 , B32B27/04 , C09J163/00 , H05K1/03 , C08L63/00 , C08J5/24 , C08L79/08 , C09D163/00 , C09D179/08 , C08G59/24 , C08G59/62
CPC分类号： H05K1/0373 , B32B2311/00 , B32B2457/08 , C08G59/245 , C08G59/621 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08J2433/00 , C08L63/00 , C08L79/08 , C08L2203/20 , C08L2205/03 , C09D163/00 , C09D179/08 , H05K1/0346 , H05K1/0353 , H05K1/0366 , H05K2201/0162 , H05K2201/09136 , Y10T156/10 , Y10T428/31529 , C08L33/08
摘要： A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
摘要翻译：通过以999μm/分钟拉伸，当应变量从0％增加到0.3％时，成为表现出力响应性能使得由拉伸应力 - 应变曲线f1（x）包围的面积的固化产物的树脂组合物而当x轴上的应变量和y轴上的拉伸应力也被x轴包围时，大于应变应变曲线f2（x）所包围的面积，当应变量减小时 0.3％，并且在施加拉伸应力之前和之后，由x轴包围，拉伸应力为0时的应变量的变化量为0.05％以下。

40. 发明申请

US20170048974A1 RESIN COMPOSITION FOR PERMANENT INSULATING FILM, PERMANENT INSULATING FILM, MULTILAYER PRINTED WIRING BOARD, AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：用于永久绝缘膜，永久绝缘膜，多层印刷线路板的树脂组合物及其制造方法
公开(公告)号：US20170048974A1
公开(公告)日：2017-02-16
申请号：US15306300
申请日：2015-03-19
申请人： TAIYO INK MFG. CO., LTD.
发明人： Touko SHIINA , Shoji MINEGISHI
IPC分类号： H05K1/03 , H05K3/00 , H05K3/46 , H05K3/42 , H05K1/02 , H05K1/11
CPC分类号： H05K1/0353 , H05K1/0298 , H05K1/0373 , H05K1/115 , H05K3/0047 , H05K3/184 , H05K3/429 , H05K3/46 , H05K3/4602 , H05K2201/0212 , H05K2201/0236
摘要： A resin composition for a permanent insulating film is provided, by which, in particular, partial through-holes obtained by partitioning a through-hole can be easily and precisely formed as designed without a deposition of catalytic species (seed) in a plating resist portion. The present invention provides a resin composition for a permanent insulating film, including a thermosetting resin, a resin filler, and a compound containing at least one atom selected from a sulfur atom and a nitrogen atom. The present invention also provides a multilayer printed wiring board in which conductive layers having a circuit pattern and insulation layers are alternately overlaid with each other, and a through-hole enabling electric conductivity among conductive layers via a through-hole. The through-hole includes a plating resist portion provided on either of an interlaminar part between the conductive layer and the insulation layer or another interlaminar part between the insulation layers, or both. The plating portion(s) is/are provided on the interlaminar parts which had been exposed in an opening as the through-hole, and on an exposed region other than the plating resist portion, and the plating resist portion is made of a cured product of the resin composition.
摘要翻译：提供了一种用于永久绝缘膜的树脂组合物，特别地，通过分隔通孔获得的部分通孔可以容易且精确地形成，而不会在电镀抗蚀剂部分中沉积催化物质（种子）。本发明提供一种用于永久绝缘膜的树脂组合物，其包含热固性树脂，树脂填料和含有至少一个选自硫原子和氮原子的原子的化合物。本发明还提供一种多层印刷布线板，其中具有电路图案和绝缘层的导电层彼此交替地叠置，并且通孔经由通孔使导电层之间能够导电。通孔包括设置在导电层和绝缘层之间的层间部分之间或绝缘层之间的另一层间部分或两者之间的电镀抗蚀剂部分。电镀部分设置在作为通孔的开口中露出的层间部分上，以及在电镀抗蚀剂部分以外的暴露区域上，并且电镀抗蚀部分由固化产物的树脂组合物。

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