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31. 发明申请

US20150255847A1 COPLANAR WAVEGUIDE (CPW) MICROWAVE TRANSMISSION LINE STRUCTURES 有权
标题翻译：共振波导（CPW）微波传输线结构
公开(公告)号：US20150255847A1
公开(公告)日：2015-09-10
申请号：US14196678
申请日：2014-03-04
申请人： Raytheon Company
发明人： Shahed Reza , Keith R. Kessler , Christopher M. Laighton
IPC分类号： H01P3/02
CPC分类号： H01P3/003 , H01P1/162 , H01P5/04
摘要： A microwave structure having an input section for receiving both a common mode signal and a CPW differential mode signal; an output section; and a CPW transmission line, having a center conductor disposed between a pair of coplanar ground plane conductors, connected between the input section and the output section. The conductors of the CPW transmission line are configured to provide the common mode signal a different attenuation in passing to the output section than the CPW transmission line provides to the differential mode signal passing between the input section and the output section.
摘要翻译：一种微波结构，具有用于接收共模信号和CPW差模信号的输入部分; 输出部分; 以及CPW传输线，其具有设置在一对共面接地平面导体之间的中心导体，连接在输入部分和输出部分之间。 CPW传输线的导体被配置为向CPW传输线提供经过输入部分和输出部分之间的差分模式信号的通向输出部分的共模信号提供不同的衰减。

32. 发明授权

US09123980B2 Flexible transmission device and communication device using the same 有权
标题翻译：灵活的传输设备和使用该设备的通信设备
公开(公告)号：US09123980B2
公开(公告)日：2015-09-01
申请号：US14331231
申请日：2014-07-15
申请人： MEDIATEK INC.
发明人： Min-Chung Wu , Shao-Chin Lo
IPC分类号： H01Q1/24 , H01P3/00 , H05K1/02 , H05K1/03
CPC分类号： H01P3/003 , H05K1/0221 , H05K1/0393
摘要： A flexible transmission device, for transmitting radio-frequency (RF) signals between a first communication module and a second communication module in a communication device, comprising a flexible substrate; a first metal sheet, formed on a plane of the flexible substrate and coupled between ground terminals of the first communication module and the second communication module; and a second metal sheet, formed on a plane of the flexible substrate different from the first metal sheet, and coupled between signal terminals of the first communication module and the second communication module, for transmitting the RF signals.
摘要翻译：一种柔性传输装置，用于在通信装置中的第一通信模块和第二通信模块之间传输射频（RF）信号，包括柔性基板; 第一金属片，形成在柔性基板的平面上并且耦合在第一通信模块的接地端子和第二通信模块之间; 以及第二金属片，形成在与第一金属片不同的柔性基板的平面上，并且耦合在第一通信模块和第二通信模块的信号端子之间，用于发送RF信号。

33. 发明授权

US09107305B2 Multilayer substrate 有权
标题翻译：多层基板
公开(公告)号：US09107305B2
公开(公告)日：2015-08-11
申请号：US14106517
申请日：2013-12-13
申请人： TAIYO YUDEN CO., LTD.
发明人： Tetsuo Saji , Gohki Nishimura , Naoyuki Tasaka
IPC分类号： H05K1/02 , H05K1/16 , H05K3/46 , H01P1/213 , H01P3/00 , H05K1/18 , H01F17/00
CPC分类号： H05K1/0284 , H01F2017/0046 , H01F2017/0073 , H01P1/213 , H01P3/003 , H05K1/0219 , H05K1/0253 , H05K1/162 , H05K1/165 , H05K1/185 , H05K3/4608 , H05K2201/0338 , H05K2201/09745
摘要： A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.
摘要翻译：通过堆叠导电层和绝缘层来构成多层基板。多层基板包括作为导电层之一并且比任何其它导电层更厚的芯以及包含在导电层中并且与芯相邻并且与第一绝缘层为一体的第一信号线的绝缘层插入在芯和第一信号线之间，第一信号线用于发射RF信号。芯部具有面向第一信号线的凹部。

34. 发明申请

US20150200436A1 QUADRATURE HYBRID 有权
标题翻译：混合混合
公开(公告)号：US20150200436A1
公开(公告)日：2015-07-16
申请号：US14416703
申请日：2012-07-27
申请人： Mingquan Bao
发明人： Mingquan Bao
IPC分类号： H01P5/12 , H01P3/08 , H01P3/00
CPC分类号： H01P5/12 , H01P3/003 , H01P3/081 , H01P5/184
摘要： A quadrature hybrid comprising first and second coupled open waveguides. Each open waveguide comprises first and second ports. One port in the first open waveguide is used as input port for an input signal which is used to generate I and Q output signals. The other port in the first open waveguide is used to output the Q signal, and one of the ports in the second waveguide is used to output the I signal. The other of the ports in the second open waveguide is an isolated port. The quadrature hybrid comprises a first differential amplifier with positive and negative ports, the positive port being connected to the first open waveguide and the negative port being connected to the second open waveguide.
摘要翻译：包括第一和第二耦合的开放波导的正交混合。每个开放波导包括第一和第二端口。第一开放波导中的一个端口用作用于产生I和Q输出信号的输入信号的输入端口。第一开放波导中的另一个端口用于输出Q信号，并且第二波导中的一个端口用于输出I信号。第二个开放波导中的另一个端口是隔离端口。正交混合器包括具有正和负端口的第一差分放大器，正端口连接到第一开路波导，负端口连接到第二开路波导。

35. 发明申请

US20150091674A1 HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE 有权
标题翻译：高频传输线和电子设备
公开(公告)号：US20150091674A1
公开(公告)日：2015-04-02
申请号：US14564140
申请日：2014-12-09
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru KATO , Satoshi ISHINO , Jun SASAKI , Kuniaki YOSUI , Takahiro BABA , Nobuo IKEMOTO
IPC分类号： H01P3/08
CPC分类号： H01P3/02 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/082 , H01P3/085 , H01P5/00 , H01P5/028 , H05K1/0218 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/025 , H05K1/028 , H05K1/0296 , H05K1/14 , H05K1/148 , H05K1/186 , H05K3/361 , H05K2201/0707 , H05K2201/09218
摘要： A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
摘要翻译：扁平电缆的传输线部分包括交替连接的第一区域和第二区域。在第一区域中，传输线部分是包括具有信号导体的介质元件，包括开口部分的第一接地导体和作为固体填充导体的第二接地导体的柔性三板传输线。在第二区域中，传输线部分是包括具有曲折导体的宽电介质元件和固体填充导体的第一接地导体和第二接地导体的硬三板传输线。第二区域中的特性阻抗的变化幅度大于第一区域中的特性阻抗的变化宽度。

36. 发明授权

US08988166B2 Structure and compact modeling of variable transmission lines 有权
标题翻译：可变传输线的结构和紧凑建模
公开(公告)号：US08988166B2
公开(公告)日：2015-03-24
申请号：US13251256
申请日：2011-10-02
申请人： Danny Elad , David Goren , Shlomo Shlafman
发明人： Danny Elad , David Goren , Shlomo Shlafman
IPC分类号： H01P1/18 , H01P3/08 , H01P3/00
CPC分类号： H01P1/18 , H01P3/003 , H03J2200/10
摘要： A novel and useful fabricated variable transmission line that is tuned digitally is presented. Digital tuning of the variable transmission line enables the compensation of process variation in both the active and passive devices of the RF design. Along with several embodiments of the variable transmission line, the present invention also provides a method of compact modeling of the variable transmission line. The variable transmission line structure and compact modeling enables circuit level simulation using a parametric device that in one embodiment can be included as an integral part of a silicon foundry design kit.
摘要翻译：提出了一种以数字方式调谐的新颖有用的制造可变传输线。可变传输线的数字调谐使得能够补偿RF设计的有源和无源器件中的工艺变化。除了可变传输线的几个实施例，本发明还提供了一种可变传输线的紧凑建模的方法。可变传输线结构和紧凑建模使得能够使用在一个实施例中可以包括作为硅铸造设计套件的组成部分的参数设备进行电路级仿真。

37. 发明授权

US08963657B2 On-chip slow-wave through-silicon via coplanar waveguide structures, method of manufacture and design structure 有权
标题翻译：通过共面波导结构的片上慢波通硅，制造方法和设计结构
公开(公告)号：US08963657B2
公开(公告)日：2015-02-24
申请号：US13156935
申请日：2011-06-09
申请人： Essam Mina , Guoan Wang , Wayne H. Woods, Jr.
发明人： Essam Mina , Guoan Wang , Wayne H. Woods, Jr.
IPC分类号： H01P3/08 , G06F17/50 , H01L21/768 , H01L23/48 , H01P3/00
CPC分类号： H01L23/481 , H01L2924/0002 , H01P3/003 , H01L2924/00
摘要： On-chip, high performance, slow-wave coplanar waveguide with through-silicon via structures, method of manufacture and design structures for integrated circuits are provided herein. The method includes forming at least one ground plane layer in a substrate and forming a signal layer in the substrate, in a same plane layer as the at least one ground. The method further includes forming at least one metal filled through-silicon via between the at least one ground plane layer and the signal layer.
摘要翻译：本文提供具有贯穿硅通孔结构的片上，高性能，慢波共面波导，其制造方法和集成电路的设计结构。该方法包括在衬底中形成至少一个接地平面层，并在与该至少一个接地相同的平面层中在衬底中形成信号层。该方法还包括在至少一个接地层与信号层之间形成至少一个填充有金属的硅，

38. 发明申请

US20140104801A1 MULTILAYER SUBSTRATE 审中-公开
标题翻译：多层基板
公开(公告)号：US20140104801A1
公开(公告)日：2014-04-17
申请号：US14106517
申请日：2013-12-13
申请人： TAIYO YUDEN CO., LTD.
发明人： Tetsuo SAJI , Gohki NISHIMURA , Naoyuki TASAKA
IPC分类号： H05K1/16
CPC分类号： H05K1/0284 , H01F2017/0046 , H01F2017/0073 , H01P1/213 , H01P3/003 , H05K1/0219 , H05K1/0253 , H05K1/162 , H05K1/165 , H05K1/185 , H05K3/4608 , H05K2201/0338 , H05K2201/09745
摘要： A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.
摘要翻译：通过堆叠导电层和绝缘层来构成多层基板。多层基板包括作为导电层之一并且比任何其它导电层更厚的芯以及包含在导电层中并且与芯相邻并且与第一绝缘层为一体的第一信号线的绝缘层插入在芯和第一信号线之间，第一信号线用于发射RF信号。芯部具有面向第一信号线的凹部。

39. 发明申请

US20140097916A1 HIGH-FREQUENCY SIGNAL TRANSMISSION LINE 有权
标题翻译：高频信号传输线
公开(公告)号：US20140097916A1
公开(公告)日：2014-04-10
申请号：US14103914
申请日：2013-12-12
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru KATO , Shigeru TAGO , Jun SASAKI , Satoshi SASAKI
IPC分类号： H01P3/08
CPC分类号： H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
摘要： Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ∈2 higher than the relative dielectric constant ∈1 and is provided on the first principal surface so as to overlap the opening.
摘要翻译：在包括具有与信号线重叠的开口的接地导体的高频信号传输线中减少了不需要的辐射。电介质元件组件具有相对介电常数ε1并且具有第一主表面和第二主表面。信号线设置在电介质元件组件中。接地导体设置在电介质元件组件中，并且相对于信号线在第一主表面侧面对信号线，并且设置有与信号线重叠的开口。高介电常数层的相对介电常数ε2比相对介电常数ε1高，并且设置在第一主表面上以与开口重叠。

40. 发明授权

US08655119B2 Connection device and optical device 有权
标题翻译：连接装置和光学装置
公开(公告)号：US08655119B2
公开(公告)日：2014-02-18
申请号：US12923259
申请日：2010-09-10
申请人： Takatoshi Yagisawa
发明人： Takatoshi Yagisawa
IPC分类号： G02B6/12 , G02B6/36
CPC分类号： H05K1/147 , G02B6/4201 , G02B6/4246 , H01P1/047 , H01P3/003 , H05K1/0219 , H05K3/3405 , H05K3/3447 , H05K3/366 , H05K3/4629 , H05K2201/0715 , H05K2201/09618 , H05K2201/09845 , H05K2201/10121 , H05K2201/1034
摘要： A connection device includes a ground electrode layer that is provided in a substrate, a first transmission path that is provided on the ground electrode layer via a dielectric layer, and a plurality of leads that are connected to the first transmission path and the ground electrode layer or the first transmission path and a plane that is electrically connected to the ground electrode layer. The plurality of leads are fitted into through-holes that are provided in a second transmission path and a ground electrode on a flexible substrate to be electrically connected.
摘要翻译：连接装置包括设置在基板中的接地电极层，经由电介质层设置在接地电极层上的第一传输路径和与第一传输路径和接地电极层连接的多个引线或第一传输路径和电连接到接地电极层的平面。多个引线装配在设置在第二传输路径上的通孔中，并且柔性基板上的接地电极被电连接。

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