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    • 36. 发明申请
    • PRODUCTION METHOD FOR JOINED BODY
    • 接合体的生产方法
    • US20150194636A1
    • 2015-07-09
    • US14411686
    • 2013-08-06
    • PANASONIC CORPORATION
    • Hiroko Okumura
    • H01L51/56
    • H01L51/56C09J5/00C09J2203/318H01L27/322H01L51/0024H01L51/5253H01L2251/556
    • A method of manufacturing a joined body, including: covering a first area and a second area of a first substrate with a sheet of resin in uncured state; separating a part of the sheet covering the second area from the first substrate, the separating performed after the covering; and joining the first substrate with a second substrate by arranging the second substrate to face the first substrate with a part of the sheet covering the first area between the first substrate and the second substrate, and curing the resin in the part of the sheet covering the first area, the joining performed after the separating. In the method, during the separating, a phase difference δ between stress and strain in the part of the sheet covering the second area is no greater than 48 degrees.
    • 一种接合体的制造方法,包括:用未固化状态的树脂片覆盖第一基板的第一区域和第二区域; 将覆盖第二区域的片材的一部分与第一衬底分离,在覆盖之后进行分离; 以及通过将所述第二基板布置成面对所述第一基板而将所述第一基板与所述第一基板接合,所述第一基板的一部分覆盖所述第一基板和所述第二基板之间的所述第一区域,并且使所述第二基板的所述部分中的树脂固化, 第一区,分离后进行加盟。 在该方法中,在分离期间,覆盖第二区域的片材的应力与应变之间的相位差δ不大于48度。