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31. 发明授权

US07684060B2 Quality-control method for laminated-foil packaging system 失效
标题翻译：层压箔包装系统的质量控制方法
公开(公告)号：US07684060B2
公开(公告)日：2010-03-23
申请号：US11890540
申请日：2007-08-06
申请人： Günter Felk , Jörg Riekenbrauck , Hans-Werner Bongers
发明人： Günter Felk , Jörg Riekenbrauck , Hans-Werner Bongers
IPC分类号： G01B11/00
CPC分类号： B65B57/00 , B29C51/00 , B29C65/8253 , B29L2031/7164 , G01N21/90 , G01N21/9508 , G01N2021/8416
摘要： In a sealing machine a pair of juxtaposed foils are sealed together at web regions having oppositely directed outer surfaces between a pair of dies, at least one of which is formed with an array of bumps that taper outwardly toward a respective one of the outer surfaces. The bumps press into the one outer surface and form therein permanent cavities of a predetermined imprint depth so as to bond together the foils at the web region. A quality of seal is determined by measuring after formation of the cavities surface features of the cavities at a level of the one outer surface of the respective foil, and calculating based on the measured surface features an imprint depth of the cavity.
摘要翻译：在密封机中，一对并置的箔在一对模具之间具有相反引导的外表面的纤维网区域被密封在一起，其中至少一个模具形成有朝着相应的一个外表面向外逐渐向外变形的凸块阵列。凸块压入一个外表面，并在其中形成预定压印深度的永久空腔，以便在纸幅区域处将箔粘合在一起。通过在各个箔的一个外表面的水平面上形成空腔的空腔表面特征之后测量并且基于所测量的表面特征计算空腔的压印深度来确定密封质量。

32. 发明授权

US07662634B2 Method and device for determining the isomer composition in isocyanate production processes 有权
标题翻译：用于测定异氰酸酯生产过程中异构体组成的方法和装置
公开(公告)号：US07662634B2
公开(公告)日：2010-02-16
申请号：US10845727
申请日：2004-05-14
申请人： Jochen Mahrenholtz , Andrea Wimschneider , Hans-Georg Pirkl , Heinz-Herbert Müller , Stefan Dresely , Jeffrey Bolton , Martin Schiffhauer , Udo Wolf , Johannes Schweer , Martin Gerlach
发明人： Jochen Mahrenholtz , Andrea Wimschneider , Hans-Georg Pirkl , Heinz-Herbert Müller , Stefan Dresely , Jeffrey Bolton , Martin Schiffhauer , Udo Wolf , Johannes Schweer , Martin Gerlach
IPC分类号： G01N33/00
CPC分类号： G01N21/359 , G01J3/433 , G01N21/3577 , G01N21/65 , G01N2021/8416 , G01N2201/1293 , Y10T436/12 , Y10T436/17 , Y10T436/172307
摘要： The invention relates to a method for determining the isomer composition in an isocyanate isomer mixture, wherein a spectrum of the isomer mixture is recorded and the spectrum is entered into a chemometric calibration model.
摘要翻译：本发明涉及一种用于测定异氰酸酯异构体混合物中的异构体组合物的方法，其中记录异构体混合物的光谱，并将光谱输入到化学计量校准模型中。

33. 发明授权

US07623249B2 Automated product profiling apparatus and product slicing system using same 有权
标题翻译：自动产品分析仪器和产品切片系统使用相同
公开(公告)号：US07623249B2
公开(公告)日：2009-11-24
申请号：US12267402
申请日：2008-11-07
申请人： Glenn Sandberg , Scott A. Lindee , Salvatore Lamartino , Robert Bania
发明人： Glenn Sandberg , Scott A. Lindee , Salvatore Lamartino , Robert Bania
IPC分类号： G01B11/24 , G01B11/30 , G01N9/04 , G01N21/86 , G06M7/00 , H01J40/14 , G01V8/00 , A23N4/04 , B26D5/00 , A22C18/00 , A22C21/00 , A22C25/00
CPC分类号： G01B11/245 , A22C17/0033 , A22C17/0086 , A22C17/02 , B26D5/007 , B26D5/32 , B26D7/0625 , B26D7/0641 , B26D7/30 , B26D2210/02 , G01N21/84 , G01N2021/177 , G01N2021/8416 , G01N2021/845 , G01N2021/8908 , G01N2201/102 , Y10T83/04 , Y10T83/182 , Y10T83/531
摘要： A system, suitable for high-speed operation, by which raw product (45), such as a slab of meat, can be accurately processed, such as by slicing into segments of desired weight, comprises a product profiling apparatus (15). The product profiling apparatus (15) measures the profile of the physical process. The product profiling apparatus (15) includes line lasers (75, 85) for directing a line of light across the upper and lower surfaces of the product (45) and visual image cameras (80, 90) directed toward the profile surface to capture, at fixed increments, the product profile. The product may also be weighed and the product density determined from the overall profile measurements. A controller (150) receives this data, and instructs the physical process accordingly.
摘要翻译：一种适于高速操作的系统，可以通过将诸如肉类的原料（45）等精加工的原料（例如通过切成所需重量的片段）包括产品成型装置（15）而进行。产品成型设备（15）测量物理过程的轮廓。产品成型设备（15）包括用于将光线引导穿过产品（45）的上表面和下表面的直线激光器（75,85）和指向轮廓表面的视觉摄像机（80,90）以固定的增量，产品简介。也可以将产品称重，并根据总体轮廓测量确定产品密度。控制器（150）接收该数据，并相应地指示物理处理。

34. 发明授权

US07616844B2 Fabrication of fiber optic probes 有权
标题翻译：光纤探头的制造
公开(公告)号：US07616844B2
公开(公告)日：2009-11-10
申请号：US12282694
申请日：2007-03-14
申请人： Dag Roar Hjelme , Oddvar Aune , Berit Falch , Dan Ostling , Reinold Ellingsen
发明人： Dag Roar Hjelme , Oddvar Aune , Berit Falch , Dan Ostling , Reinold Ellingsen
IPC分类号： G02B6/00
CPC分类号： G01N21/7703 , G01N21/272 , G01N21/359 , G01N2021/772 , G01N2021/7723 , G01N2021/773 , G01N2021/7779 , G01N2021/8416
摘要： A method of fabricating a sensor probe comprises: placing the end of an optical fiber 10 in a polymerization space 2; applying a drop of hydrogel pre-gel solution 30 to the end of the fiber; exposing said pre-gel solution to an ultra-violet light source 24 to cause polymerization therein; and monitoring a light signal that has passed down said optical fiber 10 in order to monitor said polymerization.
摘要翻译：制造传感器探针的方法包括：将光纤10的端部放置在聚合空间2中; 将一滴水凝胶预凝胶溶液30施加到纤维的末端; 将所述预凝胶溶液暴露于紫外光源24以引起其中的聚合; 并监测已经通过所述光纤10的光信号，以便监视所述聚合。

35. 发明申请

US20090103074A1 Methods for Performing Quality Control of Process to Treat a Surface 审中-公开
标题翻译：执行处理表面处理质量控制的方法
公开(公告)号：US20090103074A1
公开(公告)日：2009-04-23
申请号：US11873943
申请日：2007-10-17
申请人： Jerome J. Cuomo , Vinay G. Sakhrani
发明人： Jerome J. Cuomo , Vinay G. Sakhrani
IPC分类号： G01J3/00 , G01J3/443
CPC分类号： G01J3/443 , G01N21/73 , G01N2021/8416
摘要： The present application is directed to methods for performing quality control analysis of a process to treat a surface of a workpiece. A sensor is placed in proximity to the surface, and a controller analyzes data obtained by analyzing a signal from the sensor. The controller may determine whether the process started properly, the presence of a lubricant on the surface, and the amount of the lubricant.
摘要翻译：本申请涉及用于对处理工件的表面的处理进行质量控制分析的方法。将传感器放置在表面附近，并且控制器分析通过分析来自传感器的信号而获得的数据。控制器可以确定过程是否正确启动，表面上是否存在润滑剂以及润滑剂的量。

36. 发明申请

US20090074349A1 FABRICATION OF FIBER OPTIC PROBES 有权
标题翻译：光纤探头的制造
公开(公告)号：US20090074349A1
公开(公告)日：2009-03-19
申请号：US12282694
申请日：2007-03-14
申请人： Dag Roar Hjelme , Oddvar Aune , Berit Falch , Dan Ostling , Reinold Ellingsen
发明人： Dag Roar Hjelme , Oddvar Aune , Berit Falch , Dan Ostling , Reinold Ellingsen
IPC分类号： G02B6/00 , C08F2/48 , B05D3/06
CPC分类号： G01N21/7703 , G01N21/272 , G01N21/359 , G01N2021/772 , G01N2021/7723 , G01N2021/773 , G01N2021/7779 , G01N2021/8416
摘要： A method of fabricating a sensor probe comprises: placing the end of an optical fiber 10 in a polymerization space 2; applying a drop of hydrogel pre-gel solution 30 to the end of the fiber; exposing said pre-gel solution to an ultra-violet light source 24 to cause polymerization therein; and monitoring a light signal that has passed down said optical fiber 10 in order to monitor said polymerization.
摘要翻译：制造传感器探针的方法包括：将光纤10的端部放置在聚合空间2中; 将一滴水凝胶预凝胶溶液30施加到纤维的末端; 将所述预凝胶溶液暴露于紫外光源24以引起其中的聚合; 并监测已经通过所述光纤10的光信号，以便监视所述聚合。

37. 发明申请

US20080218745A1 METHOD AND SYSTEM TO COMPENSATE FOR LAMP INTENSITY DIFFERENCES IN A PHOTOLITHOGRAPHIC INSPECTION TOOL 失效
标题翻译：补偿光刻检测工具中的强度差异的方法和系统
公开(公告)号：US20080218745A1
公开(公告)日：2008-09-11
申请号：US12101260
申请日：2008-04-11
申请人： David Dixon , Lloyd Lee
发明人： David Dixon , Lloyd Lee
IPC分类号： G01N21/00
CPC分类号： G01N21/95607 , G01N21/278 , G01N21/93 , G01N21/9501 , G01N2021/8416 , G01N2201/0695 , G01N2201/12753
摘要： An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.
摘要翻译：在确定检查中的晶片的置信度得分后，开发后的检查工具会考虑刀具对刀具的变异性。使用金色晶片来计算RGB特征以及不同灯泡强度的各个RGB曲线的斜率。这些斜率被归一化以便在签名中产生红色值和蓝色值的补偿因子。当使用不同的灯随后在ADI站检查晶片时，可能以不同的灯强度捕获测试晶片RGB特征。因此，当比较签名时，基于不同的灯的强度设置，通过补偿因子来调整金色晶片RGB签名，然后使用该调整的RGB签名来确定在测试晶片上是否存在缺陷。

38. 发明授权

US07393459B2 Method for automatic determination of substrates states in plasma processing chambers 失效
标题翻译：自动测定等离子体处理室中基片状态的方法
公开(公告)号：US07393459B2
公开(公告)日：2008-07-01
申请号：US10939158
申请日：2004-09-10
申请人： Matthew F Davis , Lei Lian , Quentin E. Walker
发明人： Matthew F Davis , Lei Lian , Quentin E. Walker
IPC分类号： G01L21/30 , H01L21/66
CPC分类号： H01J37/32972 , G01B11/24 , G01N21/45 , G01N21/55 , G01N21/8422 , G01N2021/8416 , G01N2201/1222 , G01N2201/129 , H01J37/32935
摘要： A method for automatic determination of a state of a substrate in a plasma processing chamber is provided. Substrate reflectance data is collected in a processing chamber prior to processing to be analyzed with reference reflectance data to determine if the substrate state meets a control criterion. The substrate state may define the thickness and the qualities of the films on the substrate, the critical dimensions of the different layers on the substrate. The reflectance data is analyzed using a multi-variant analysis technique, such as principle component analysis. In addition to analyzing substrate state prior to processing, substrate reflectance could also be collected in a processing chamber during processing to be analyzed with reference reflectance data to further determine if the substrate state and/or the substrate processing are meeting a control criterion.
摘要翻译：提供了一种用于自动确定等离子体处理室中的基板的状态的方法。在处理之前将基板反射率数据收集在处理室中，以用参考反射率数据进行分析，以确定基板状态是否满足控制标准。衬底状态可以限定衬底上的膜的厚度和质量，衬底上不同层的临界尺寸。使用多变量分析技术（如主成分分析）分析反射率数据。除了在处理之前分析衬底状态之外，衬底反射率也可以在处理期间被收集在处理室中，以用参考反射率数据进行分析，以进一步确定衬底状态和/或衬底处理是否满足控制标准。

39. 发明申请

US20080106728A1 Consecutive measurement of structures formed on a semiconductor wafer using a polarized reflectometer 有权
标题翻译：使用偏振反射计连续测量在半导体晶片上形成的结构
公开(公告)号：US20080106728A1
公开(公告)日：2008-05-08
申请号：US11594497
申请日：2006-11-07
申请人： Vi Vuong , Junwei Bao , Manuel Madriaga
发明人： Vi Vuong , Junwei Bao , Manuel Madriaga
IPC分类号： G01N21/00
CPC分类号： G01N21/4788 , G01N21/95607 , G01N2021/8416 , G01N2021/95615
摘要： Structures formed on a semiconductor wafer are consecutively measured by obtaining first and second measured diffraction signals of a first structure and a second structure formed abutting the first structure. The first and second measured diffraction signals were consecutively measured using a polarized reflectometer. The first measured diffraction signal is compared to a first simulated diffraction signal generated using a profile model of the first structure. The profile model has profile parameters that characterize geometries of the first structure. One or more features of the first structure are determined based on the comparison. The second measured diffraction signal is converted to a converted diffraction signal. The converted diffraction signal is compared to the first simulated diffraction signal or a second simulated diffraction signal generated using the same profile model as the first simulated diffraction signal. One or more features of the second structure are determined based on the comparison.
摘要翻译：通过获得与第一结构邻接形成的第一结构和第二结构的第一和第二测量的衍射信号，连续测量形成在半导体晶片上的结构。使用偏振反射计连续测量第一和第二测量的衍射信号。将第一测量的衍射信号与使用第一结构的轮廓模型产生的第一模拟衍射信号进行比较。轮廓模型具有表征第一结构的几何形状的轮廓参数。基于比较确定第一结构的一个或多个特征。第二测量的衍射信号被转换成转换的衍射信号。将转换的衍射信号与第一模拟衍射信号或使用与第一模拟衍射信号相同的轮廓模型产生的第二模拟衍射信号进行比较。基于比较来确定第二结构的一个或多个特征。

40. 发明授权

US07359545B2 Method and system to compensate for lamp intensity differences in a photolithographic inspection tool 失效
标题翻译：补偿光刻检测工具灯强度差异的方法和系统
公开(公告)号：US07359545B2
公开(公告)日：2008-04-15
申请号：US10749887
申请日：2003-12-31
申请人： David Dixon , Lloyd Lee
发明人： David Dixon , Lloyd Lee
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , G01N21/278 , G01N21/93 , G01N21/9501 , G01N2021/8416 , G01N2201/0695 , G01N2201/12753
摘要： An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.
摘要翻译：在确定检查中的晶片的置信度得分后，开发后的检查工具会考虑刀具对刀具的变异性。使用金色晶片来计算RGB特征以及不同灯泡强度的各个RGB曲线的斜率。这些斜率被归一化以便在签名中产生红色值和蓝色值的补偿因子。当使用不同的灯随后在ADI站检查晶片时，可能以不同的灯强度捕获测试晶片RGB特征。因此，当比较签名时，基于不同的灯的强度设置，通过补偿因子来调整金色晶片RGB签名，然后使用该调整的RGB签名来确定在测试晶片上是否存在缺陷。

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