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    • 31. 发明申请
    • VEHICLE AMBIENT TEMPERATURE ESTIMATION SYSTEM
    • 车辆环境温度估计系统
    • US20140044149A1
    • 2014-02-13
    • US13571988
    • 2012-08-10
    • Kenji David Matsuura
    • Kenji David Matsuura
    • G01K13/00
    • G01K7/427G01K2205/00
    • Ambient temperature is determined using a vehicle-implemented system based on an estimated ambient temperature determined in view of a radiator fluid temperature profile. During periods of radiator fan operation, radiator fluid temperature is measured and logged to create the radiator fluid temperature profile. A best-fit polynomial is fitted to the radiator fluid temperature profile, and a coefficient from the best-fit polynomial is used to reference a best-fit equation to ambient temperature relation. The relation is predetermined for the particular vehicle configuration, and the ambient temperature is estimated based on the coefficient from the fitted best-fit polynomial.
    • 基于根据散热器流体温度分布确定的估计环境温度,使用车辆实施的系统确定环境温度。 在散热器风扇运行期间,测量和记录散热器流体温度以产生散热器流体温度曲线。 最佳拟合多项式适用于散热器流体温度分布,并且使用最佳拟合多项式的系数将最佳拟合方程引用到环境温度关系。 该关系对于特定车辆配置是预定的,并且环境温度是根据拟合最佳拟合多项式的系数来估计的。
    • 33. 发明申请
    • METHOD AND APPARATUS FOR ON-CHIP TEMPERATURE
    • 芯片温度的方法和装置
    • US20130166885A1
    • 2013-06-27
    • US13531013
    • 2012-06-22
    • Karthik RamaniStephen PresantJohn Brothers
    • Karthik RamaniStephen PresantJohn Brothers
    • G01K3/00G06F9/30
    • G06F9/4893G01K7/427G06F1/20Y02D10/24
    • When an instruction is executed on an integrated circuit (IC), an activity level and temperature are measured. A relationship between the activity level and temperature is determined, to estimate the temperature from the activity level. The activity level is monitored and is input to a scheduler, which estimates the IC temperature based on the activity level. The scheduler distributes work taking into account the temperature of various IC regions and may include distributing work to the IC region that has a lowest estimated temperature or relatively lower estimated temperature (e.g., lower than the average IC or IC region temperature). When the utilization level of one or more IC regions is high, the scheduler is configured to reduce the clock speed or the voltage of the one or more IC regions, or flag the regions as being unavailable for additional workload.
    • 当在集成电路(IC)上执行指令时,测量活动电平和温度。 确定活动水平和温度之间的关系,从活动水平估算温度。 监视活动级别,并将其输入到调度程序中,该调度程序将根据活动级别估算IC温度。 调度器考虑各种IC区域的温度来分配工作,并且可以包括将工作分配到具有最低估计温度或相对较低估计温度(例如低于平均IC或IC区域温度)的IC区域。 当一个或多个IC区域的使用级别高时,调度器被配置为降低一个或多个IC区域的时钟速度或电压,或将该区域标记为不可用于额外的工作负载。
    • 35. 发明申请
    • METHOD FOR ESTIMATING TEMPERATURE AT A CRITICAL POINT
    • 在关键点估算温度的方法
    • US20130060510A1
    • 2013-03-07
    • US13665308
    • 2012-10-31
    • Apple Inc.
    • Keith CoxGaurav KapoorVaughn Arnold
    • G06F19/00G01K1/00
    • G06F1/26G01K1/20G01K7/42G01K7/425G01K7/427G06F1/206
    • Methods and apparatuses are disclosed to estimate temperature at one or more critical points in a data processing system comprising modeling a steady state temperature portion of a thermal model at the one or more critical points using regression analysis; modeling the transient temperature portion of the thermal model at the one or more critical points using a filtering algorithm; and generating a thermal model at the one or more critical points by combining the steady state temperature portion of the thermal model with the transient temperature portion of the thermal model. The thermal model may then be used to estimate an instantaneous temperature at the one or more critical points or to predict a future temperature at the one or more critical points.
    • 公开了用于估计数据处理系统中的一个或多个临界点处的温度的方法和装置,其包括使用回归分析来建模所述一个或多个关键点处的热模型的稳态温度部分; 使用滤波算法对一个或多个临界点处的热模型的瞬态温度部分进行建模; 以及通过将热模型的稳态温度部分与热模型的瞬态温度部分组合来在一个或多个关键点处产生热模型。 然后可以使用热模型来估计一个或多个关键点处的瞬时温度或者预测一个或多个关键点处的未来温度。
    • 37. 发明授权
    • Method for estimating temperature at a critical point
    • 估计临界点温度的方法
    • US08306772B2
    • 2012-11-06
    • US12250498
    • 2008-10-13
    • Keith CoxGaurav KapoorVaughn Arnold
    • Keith CoxGaurav KapoorVaughn Arnold
    • G01K1/00
    • G06F1/26G01K1/20G01K7/42G01K7/425G01K7/427G06F1/206
    • Methods and apparatuses are disclosed to estimate temperature at one or more critical points in a data processing system comprising modeling a steady state temperature portion of a thermal model at the one or more critical points using regression analysis; modeling the transient temperature portion of the thermal model at the one or more critical points using a filtering algorithm; and generating a thermal model at the one or more critical points by combining the steady state temperature portion of the thermal model with the transient temperature portion of the thermal model. The thermal model may then be used to estimate an instantaneous temperature at the one or more critical points or to predict a future temperature at the one or more critical points.
    • 公开了用于估计数据处理系统中的一个或多个临界点处的温度的方法和装置,其包括使用回归分析来建模所述一个或多个关键点处的热模型的稳态温度部分; 使用滤波算法对一个或多个临界点处的热模型的瞬态温度部分进行建模; 以及通过将热模型的稳态温度部分与热模型的瞬态温度部分组合来在一个或多个关键点处产生热模型。 然后可以使用热模型来估计一个或多个关键点处的瞬时温度或者预测一个或多个关键点处的未来温度。
    • 38. 发明授权
    • System for determining ambient temperature
    • 用于确定环境温度的系统
    • US08280673B2
    • 2012-10-02
    • US11950394
    • 2007-12-04
    • Mohammad A. Aljabari
    • Mohammad A. Aljabari
    • G01K1/00G01K3/00
    • H05B1/02G01K1/20G01K7/42G01K7/427
    • A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the dimensional 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.
    • 用于根据外壳内确定的温度指示外壳的环境温度的机构。 温度可以从外壳中的两个或更多个位置的两个或更多个传感器获得。 外壳可以包括诸如可以确定功率消耗的电子器件内的装置。 可以将数据包括在各种电子功率消耗水平下的外壳内两个位置的温度,可以输入到二维图。 2-D图的近似可以用适用于环境温度求解的方程来实现。 尺寸2-D图的数据加上外壳中第三位置和气流水平的温度可以输入到3-D图。 3-D图的近似可以用适用于环境温度求解的方程来实现。