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31. 发明申请

US20080202922A1 HYBRID ELECTRO-DEPOSITION OF SOFT MAGNETIC COBALT ALLOY FILMS 审中-公开
标题翻译：软磁性合金薄膜的混合电沉积
公开(公告)号：US20080202922A1
公开(公告)日：2008-08-28
申请号：US11678056
申请日：2007-02-22
申请人： Ting Zhong , Arnel M. Fajardo , Chang-Min Park
发明人： Ting Zhong , Arnel M. Fajardo , Chang-Min Park
IPC分类号： C05B9/00
CPC分类号： C23C18/1673 , C23C18/1669 , C23C18/1671 , C23C18/34 , C25D3/12 , C25D3/562 , C25D5/006
摘要： A hybrid electro-deposition process for soft magnetic cobalt alloy films comprises providing a plating bath that includes cobalt and a reducing agent, providing a cobalt-containing anode in the plating bath coupled to a power supply, providing a substrate in the plating bath coupled to the power supply, wherein the substrate functions as a cathode, applying a magnetic field across the plating bath, and applying an electrical current to the plating bath by way of the power supply to cause the cobalt to deposit onto the substrate and form a soft magnetic film.
摘要翻译：用于软磁性钴合金膜的混合电沉积方法包括提供包括钴和还原剂的电镀槽，在与电源相连的电镀槽中提供含钴阳极，在镀浴中提供与所述电源，其中所述衬底用作阴极，在所述电镀槽上施加磁场，并且通过所述电源将电流施加到所述电镀槽，以使所述钴沉积到所述衬底上并形成软磁体电影。

32. 发明授权

US07361225B2 Liquid tank 有权
标题翻译：液体罐
公开(公告)号：US07361225B2
公开(公告)日：2008-04-22
申请号：US10847611
申请日：2004-05-18
申请人： Wataru Yamamoto
发明人： Wataru Yamamoto
IPC分类号： B05C3/00
CPC分类号： C23C18/1619 , C23C18/1669 , C25D17/02 , C25D21/10
摘要： The present invention provides a liquid tank which has a compact construction comprising a process bath, an agitation service bath, an agitation room, a liquid supply tunnel, and a liquid supply outlet.
摘要翻译：本发明提供一种具有紧凑结构的液体罐，其包括处理槽，搅拌槽，搅拌室，液体供应通道和液体供应出口。

33. 发明授权

US07332198B2 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US07332198B2
公开(公告)日：2008-02-19
申请号：US10481437
申请日：2002-10-28
申请人： Xinming Wang , Kenichi Abe , Koji Mishima
发明人： Xinming Wang , Kenichi Abe , Koji Mishima
IPC分类号： B05D1/18
CPC分类号： H01L21/76843 , C23C18/1619 , C23C18/1669 , C23C18/1676 , H01L21/288 , H01L21/76849 , H01L21/76874
摘要： There is provided a plating apparatus and method which can control the temperature of a plating solution during plating more uniformly and easily form a uniform plated film on the to-be-plated surface of a workpiece, and which can simplify the device and decrease the footprint. The plating apparatus includes a plating bath having a double bath structure including an inner bath for holding a plating solution and carrying out plating, and an outer bath which surrounds the inner bath and is in fluid communication therewith. A heating device is disposed in the outer bath. The plating apparatus may further include means for circulating or stirring the plating solution in the plating bath.
摘要翻译：提供一种电镀装置和方法，其可以在电镀期间更均匀地控制电镀液的温度，并且容易地在待镀覆的表面上形成均匀的镀膜，并且可以简化装置并减少占地面积。电镀设备包括具有双浴结构的电镀浴，其包括用于保持电镀液并进行电镀的内浴，以及围绕内浴并与其流体连通的外浴。加热装置设置在外浴中。电镀装置还可以包括用于使电镀液中的电镀液循环或搅拌的装置。

34. 发明授权

US07311779B2 Heating apparatus to heat wafers using water and plate with turbolators 失效
标题翻译：加热装置用水和板与涡轮机加热晶片
公开(公告)号：US07311779B2
公开(公告)日：2007-12-25
申请号：US10680359
申请日：2003-10-06
申请人： Son T. Nguyen , Gary J. Rosen , Ian A. Pancham
发明人： Son T. Nguyen , Gary J. Rosen , Ian A. Pancham
IPC分类号： B05C11/02 , B05C5/00 , B05B7/16 , C23C16/00
CPC分类号： H01L21/67167 , C23C18/1619 , C23C18/1669 , C23C18/1676 , C23C18/168 , H01L21/288 , H01L21/67109 , H01L21/67248
摘要： Embodiments of the invention provide a fluid processing method and apparatus. The apparatus includes a substrate support assembly positioned in a processing volume, a disk shaped member positioned in the processing volume in parallel orientation with a substrate supported on the substrate support assembly, a fluid outlet positioned in a central location of the disk shaped member, and a plurality of turbolators positioned on an upper surface of the disk shaped member, the turbolators being configured to generate a uniform turbulent flow of fluid traveling from the fluid outlet to a perimeter of the substrate. The method includes flowing a heated processing fluid over a plurality of turbolators that are positioned under a substrate being processed to control the temperature of the substrate during processing.
摘要翻译：本发明的实施例提供一种流体处理方法和装置。该装置包括位于处理体积中的基板支撑组件，与支撑在基板支撑组件上的基板平行地定位在处理体积中的圆盘形构件，位于盘形构件的中心位置的流体出口，以及多个涡轮机，其定位在所述盘形构件的上表面上，所述涡轮机构造成产生从所述流体出口行进到所述基板周边的均匀的流体流动。该方法包括使加热的处理流体流过位于被处理的基底下方的多个涡轮机，以在加工期间控制基板的温度。

35. 发明申请

US20070048447A1 SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING 审中-公开
标题翻译：通过电镀铜镀层形成图案铜线的系统和方法
公开(公告)号：US20070048447A1
公开(公告)日：2007-03-01
申请号：US11461415
申请日：2006-07-31
申请人： Alan Lee , Andrew Bailey , William Thie , Yunsang Kim , Yezdi Dordi
发明人： Alan Lee , Andrew Bailey , William Thie , Yunsang Kim , Yezdi Dordi
IPC分类号： B05D3/10 , B05D1/32 , C23C16/00
CPC分类号： H05K3/184 , C23C18/1605 , C23C18/1642 , C23C18/1669 , C23C18/1879 , C23C18/1882 , C23C18/38 , C23C18/40 , H05K3/064 , H05K2203/0571 , H05K2203/072 , H05K2203/087
摘要： A method for forming copper on a substrate including inputting a copper source solution into a mixer, inputting a reducing solution into the mixer, mixing copper source solution and the reducing solution to form a plating solution having a pH of greater than about 6.5 and applying the plating solution to a substrate, the substrate including a catalytic layer wherein applying the plating solution to the substrate includes forming a catalytic layer, maintaining the catalytic layer in a controlled environment and forming copper on the catalytic layer. A system for forming copper structures is also disclosed.
摘要翻译：一种在基板上形成铜的方法，包括将铜源溶液输入到混合器中，将还原溶液输入到混合器中，将铜源溶液和还原溶液混合以形成pH大于约6.5的电镀溶液，电镀溶液到基板上，所述基板包括催化层，其中将所述电镀液施加到所述基板上包括形成催化剂层，将所述催化剂层保持在受控环境中并在所述催化层上形成铜。还公开了一种用于形成铜结构的系统。

36. 发明申请

US20050147746A1 Nanotube growth and device formation 审中-公开
标题翻译：纳米管生长和器件形成
公开(公告)号：US20050147746A1
公开(公告)日：2005-07-07
申请号：US10749958
申请日：2003-12-30
申请人： Valery Dubin , Juan Dominguez , Chin-Chang Cheng
发明人： Valery Dubin , Juan Dominguez , Chin-Chang Cheng
IPC分类号： B05C3/00 , B05D1/12 , C01B31/02 , C23C18/16
CPC分类号： B82Y30/00 , B82Y40/00 , C01B32/162 , C01B2202/02 , C01B2202/06 , C23C18/1646 , C23C18/1666 , C23C18/1669 , C23C18/1882 , Y10S977/742 , Y10T428/2982
摘要： An apparatus and method for forming catalyst particles to grow nanotubes is disclosed. In addition, an apparatus and method for forming nanotubes using the catalytic particles is also disclosed. The particles formed may have different diameters depending upon how they are formed. Once formed, the particles are deposited on a substrate. Once deposited, the mobility of the particles is restricted and nanotubes and/or nanotube portions are grown on the particles. Nanotube portions having different diameters may be formed and the portions may be connected to form nanotubes with different diameters along the length of the nanotube.
摘要翻译：公开了一种用于形成催化剂颗粒以生长纳米管的装置和方法。此外，还公开了使用催化剂颗粒形成纳米管的装置和方法。形成的颗粒可以具有不同的直径，这取决于它们的形成方式。一旦形成，颗粒沉积在基底上。一旦沉积，颗粒的迁移率受到限制，纳米管和/或纳米管部分在颗粒上生长。可以形成具有不同直径的纳米管部分，并且可以将部分连接以形成沿着纳米管的长度具有不同直径的纳米管。

37. 发明申请

US20050072526A1 Heating apparatus to heat wafers using water and plate with turbolators 失效
标题翻译：加热装置用水和板与涡轮机加热晶片
公开(公告)号：US20050072526A1
公开(公告)日：2005-04-07
申请号：US10680359
申请日：2003-10-06
申请人： Son Nguyen , Gary Rosen , Ian Pancham
发明人： Son Nguyen , Gary Rosen , Ian Pancham
IPC分类号： C23C18/16 , H01L21/00 , H01L21/288 , B05D3/04 , C23F1/00
CPC分类号： H01L21/67167 , C23C18/1619 , C23C18/1669 , C23C18/1676 , C23C18/168 , H01L21/288 , H01L21/67109 , H01L21/67248
摘要： Embodiments of the invention provide a fluid processing method and apparatus. The apparatus includes a substrate support assembly positioned in a processing volume, a disk shaped member positioned in the processing volume in parallel orientation with a substrate supported on the substrate support assembly, a fluid outlet positioned in a central location of the disk shaped member, and: a plurality of turbolators positioned on an upper surface of the disk shaped member, the turbolators being configured to generate a uniform turbulent flow of fluid traveling from the fluid outlet to a perimeter of the substrate. The method includes flowing a heated processing fluid over a plurality of turbolators that are positioned under a substrate being processed to control the temperature of the substrate during processing.
摘要翻译：本发明的实施例提供一种流体处理方法和装置。该装置包括位于处理体积中的基板支撑组件，与支撑在基板支撑组件上的基板平行地定位在处理体积中的圆盘形构件，位于盘形构件的中心位置的流体出口，以及：多个涡轮机，其定位在盘形部件的上表面上，所述涡轮机构造成产生从所述流体出口行进到所述基板的周边的均匀的流体流。该方法包括使加热的处理流体流过位于被处理的基底下方的多个涡轮机，以在加工期间控制基板的温度。

38. 发明申请

US20040251141A1 Electroless plating apparatus and electroless plating method 审中-公开
标题翻译：无电镀设备和化学镀方法
公开(公告)号：US20040251141A1
公开(公告)日：2004-12-16
申请号：US10861447
申请日：2004-06-07
申请人： TOKYO ELECTRON LIMITED
发明人： Gishi Chung , Yoshinori Marumo
IPC分类号： B05C003/02 , C25D005/08
CPC分类号： C23C18/1669 , C23C18/1619
摘要： A plate and a substrate are placed to face each other and a treatment liquid is jetted from a treatment liquid jetting portion of the plate, thereby treating the substrate. At this time, bubbles in the treatment liquid are discharged from an opening formed in the plate, thereby enabling reduction in treatment nonuniformity caused by the bubbles. The formation of a slope toward the opening on the plate makes it possible to further promote the removal of the bubbles from the treatment liquid.
摘要翻译：将板和基板放置成彼此面对，并且从板的处理液喷射部分喷射处理液，从而处理基板。此时，处理液中的气泡从形成在板上的开口排出，从而能够减少由气泡引起的处理不均匀性。向板上的开口形成斜面使得可以进一步促进从处理液中除去气泡。

39. 发明申请

US20040161529A1 Electroless plating apparatus and method 审中-公开
标题翻译：化学镀设备及方法
公开(公告)号：US20040161529A1
公开(公告)日：2004-08-19
申请号：US10779827
申请日：2004-02-18
发明人： Akihisa Hongo , Koji Mishima , Hiroaki Inoue , Norio Kimura , Tsutomu Karimata
IPC分类号： B05D005/12 , B05D001/18
CPC分类号： H01L21/76843 , C23C18/1619 , C23C18/1669 , C23C18/1678 , H01L21/288 , H01L21/76849 , H01L21/76874
摘要： An plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plate, of a material to be plated. The plating apparatus includes a holding portion having a heating portion for holding a material to be plated in such a state that a surface to be plated faces downward, and a plating bath for introducing an electroless plating liquid having a predetermined temperature into a plating chamber, and holding the electroless plating liquid while allowing the electroless plating liquid to overflow an overflow dam. The material which is by the holding portion, is brought into contact with the plating liquid in the plating bath to plate the material.
摘要翻译：一种电镀装置，其能够容易地形成在被镀材料的表面上具有更均匀厚度的镀膜。电镀装置具有保持部，该保持部具有用于将被镀面的向下方的状态下的被镀材料保持的加热部，以及将具有规定温度的化学镀液引入镀层的镀浴，并且在使化学镀液体溢出溢流坝的同时保持化学镀液体。通过保持部分的材料与电镀液中的镀液接触以对材料进行平板化。

40. 发明申请

US20040022957A1 Process for deposition of metal on a surface 失效
标题翻译：在表面上沉积金属的工艺
公开(公告)号：US20040022957A1
公开(公告)日：2004-02-05
申请号：US10332922
申请日：2003-07-07
发明人： G Alan Thompson , Theresa M Anderson , David E. Marx
IPC分类号： B05D003/10 , B05D001/18
CPC分类号： C23C18/42 , C23C18/1669 , C23C18/31 , H05K3/187
摘要： The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in a deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency corresponding to a resonance frequency of the material; inducing a solution vibration in the deposition solution in a direction non-parallel to the material vibration, said solution vibration having a frequency corresponding to the a resonance frequency of the deposition solution, whereby said metal is deposited onto the material. This process results in deposition of metal from the plating bath on the material in a controlled and substantially uniform thickness.
摘要翻译：本发明涉及在材料上沉积金属的方法。该方法包括以下步骤：将材料浸入包括金属的沉积溶液中; 在沉积溶液中引起具有对应于材料的共振频率的频率的材料振动; 在与所述材料振动不平行的方向上引起所述沉积溶液中的溶液振动，所述溶液振动具有与所述沉积溶液的共振频率相对应的频率，由此所述金属沉积到所述材料上。该过程导致金属从电镀浴中以受控且基本均匀的厚度沉积在材料上。

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