专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20120018918A1 TOOL, ARRANGEMENT, AND METHOD FOR MANUFACTURING A COMPONENT, COMPONENT 有权
标题翻译：工具，布置和制造组件，组件的方法
公开(公告)号：US20120018918A1
公开(公告)日：2012-01-26
申请号：US13152496
申请日：2011-06-03
申请人： Ulrich Eberth , Martin Friedrich
发明人： Ulrich Eberth , Martin Friedrich
IPC分类号： B29C45/14
CPC分类号： B29C70/48 , B29C45/02 , B29C45/14786 , B29C45/462 , B29C70/546
摘要： This application describes a tool, an arrangement, and a method of manufacturing a component. The manufacturing of the component is achieved by a resin transfer from a storage chamber via a transfer line into a working chamber. Before the resin transfer, taking place, for example by a compressed air charging of the storage chamber, the storage chamber is filled with an amount of resin adjusted to the size of the component. Furthermore, a semi-finished product, consisting of cut-to-size reinforcement fibers, is inserted into the working chamber that is adjusted to the form of the component to be produced. Storage chamber, transfer line, and working chamber are configured in a one-piece mould casing of the tool. The application further describes a component manufactured by the above-mentioned tool or by the above-mentioned method respectively.
摘要翻译：该应用描述了一种工具，一种布置和一种制造组件的方法。通过从存储室经由输送管线将树脂转移到工作室中来实现部件的制造。在树脂转移之前，例如通过储存室的压缩空气充填进行，储存室中填充有一定量的树脂，该树脂被调整到部件的尺寸。此外，将由切割尺寸的增强纤维组成的半成品插入到被调节成待生产部件形式的工作室中。储存室，输送管线和工作室均配置在工具的一体式模具外壳中。本申请还分别描述了通过上述工具制造的部件或上述方法。

32. 发明申请

US20100272843A1 ULTRASONIC DEVICE FOR MOULDING MICRO PLASTIC PARTS 有权
标题翻译：用于模制微型塑料零件的超声波装置
公开(公告)号：US20100272843A1
公开(公告)日：2010-10-28
申请号：US12672732
申请日：2008-08-08
申请人： Francisco Javier Planta Torralba , Encarnacion Escudero Martinez , Andres Sancho Descalzo , Pedro Luis Macias Lopez , Jose Fernando Bas Ferrero , Eugenia Rodriguez Sierra , Francesco Puliga
发明人： Francisco Javier Planta Torralba , Encarnacion Escudero Martinez , Andres Sancho Descalzo , Pedro Luis Macias Lopez , Jose Fernando Bas Ferrero , Eugenia Rodriguez Sierra , Francesco Puliga
IPC分类号： B29C35/08
CPC分类号： B29C45/46 , B29B13/022 , B29B13/023 , B29C35/0261 , B29C45/021 , B29C45/461 , B29C45/462 , B29C45/531 , B29C2045/0094 , B29C2045/0098 , B29C2791/008
摘要： The invention relates to an ultrasonic device for molding micro plastic parts, which combines: a) a mold cavity configured in a mold having an inlet for supplying plastic material to a chamber with an access opening and the chamber facing the cavity at a distal end in relation to its access opening; b) a cantilevered ultrasonic vibration element associated with an ultrasound generator, with an end portion or tip inserted tightly into the chamber through the access opening in an axially centered manner; c) a movement device for generating a relative movement between the end portion and the parts of the mold so that the end portion engages with the supplied plastic material and exerts a pressure of pre-determined magnitude thereon upon activation of the ultrasonic vibration element.
摘要翻译：本发明涉及一种用于模制微塑料部件的超声波装置，其结合：a）模具中的模腔，其具有用于将塑料材料供应到具有进入开口的腔室的入口，并且腔室在远端处面向空腔与其通道的关系; b）与超声波发生器相关联的悬臂式超声波振动元件，其端部或尖端以轴向居中的方式通过进入开口紧密地插入到腔室中; c）用于在所述端部和所述模具的部件之间产生相对运动的运动装置，使得所述端部与所提供的塑料材料接合，并且在所述超声波振动元件启动时在其上施加预定幅度的压力。

33. 发明申请

US20100256502A1 MATERIALS AND PROCESSES FOR BONDING ACOUSTICALLY NEUTRAL STRUCTURES FOR USE IN ULTRASOUND CATHETERS 审中-公开
标题翻译：用于连接超声波导管中使用的中性结构的材料和方法
公开(公告)号：US20100256502A1
公开(公告)日：2010-10-07
申请号：US12418824
申请日：2009-04-06
申请人： Donald Joseph Buckley , Douglas Glenn Wildes , Warren Lee , Weston Blaine Griffin
发明人： Donald Joseph Buckley , Douglas Glenn Wildes , Warren Lee , Weston Blaine Griffin
IPC分类号： A61B8/14 , B29C45/14
CPC分类号： B32B37/24 , A61B8/12 , A61B8/4281 , A61B8/445 , B29C45/02 , B29C45/462 , B29L2031/7542 , G10K11/355
摘要： Provided herein is an ultrasound probe comprising a probe housing defining a distal end, an ultrasonic transducer array disposed within the probe housing and rotatable within said probe housing, an acoustically neutral structure bonded to a surface of the ultrasonic transducer array by an adhesive, a motor coupled to the ultrasonic transducer array, the motor being configured to rotate the ultrasonic transducer array in order to image a three-dimensional volume; and an acoustic coupling fluid disposed within free volume of the probe housing. Also provided is a method of manufacturing.
摘要翻译：本文提供了一种超声波探头，其包括限定远端的探针壳体，设置在探针壳体内并可在所述探针壳体内旋转的超声波换能器阵列，通过粘合剂结合到超声换能器阵列的表面的声中性结构，马达耦合到所述超声换能器阵列，所述马达被配置为旋转所述超声波换能器阵列，以便对三维体积进行成像; 以及设置在探针壳体的自由体积内的声耦合流体。还提供了一种制造方法。

34. 发明申请

US20090218734A1 Tool, Arrangement, and Method for Manufacturing a Component, Component 审中-公开
标题翻译：工具，布置和制造组件的方法
公开(公告)号：US20090218734A1
公开(公告)日：2009-09-03
申请号：US12084751
申请日：2006-11-09
申请人： Ulrich Eberth , Martin Friedrich
发明人： Ulrich Eberth , Martin Friedrich
IPC分类号： B29C43/56 , B29C70/34
CPC分类号： B29C70/48 , B29C45/02 , B29C45/14786 , B29C45/462 , B29C70/546
摘要： This application describes a tool, an arrangement, and a method of manufacturing a component. The manufacturing of the component is achieved by a resin transfer from a storage chamber via a transfer line into a working chamber. Before the resin transfer, taking place, for example by a compressed air charging of the storage chamber, the storage chamber is filled with an amount of resin adjusted to the size of the component. furthermore, a semi-finished product, consisting of cut-to-size reinforcement fibers, is inserted into the working chamber that is adjusted to the form of the component to be produced. Storage chamber, transfer line, and working chamber are configured in a one-piece mould casing of the tool. The application further describes a component manufactured by the above-mentioned tool or by the above-mentioned method respectively.
摘要翻译：该应用描述了一种工具，一种布置和一种制造组件的方法。通过从存储室经由输送管线将树脂转移到工作室中来实现部件的制造。在树脂转移之前，例如通过储存室的压缩空气充填进行，储存室中填充有一定量的树脂，该树脂被调整到部件的尺寸。此外，将由切割尺寸的增强纤维组成的半成品插入到被调节为待生产的部件的形式的工作室中。储存室，输送管线和工作室均配置在工具的一体式模具外壳中。本申请还分别描述了通过上述工具制造的部件或上述方法。

35. 发明申请

US20070194474A1 Injection molding press 审中-公开
标题翻译：注塑机
公开(公告)号：US20070194474A1
公开(公告)日：2007-08-23
申请号：US11361416
申请日：2006-02-23
申请人： Peter Nagy , Nelson Rivas
发明人： Peter Nagy , Nelson Rivas
IPC分类号： B29C45/76 , B29C45/02
CPC分类号： B29C45/531 , B29C45/462 , B29C45/57 , B29C45/82 , B29C2045/824
摘要： An injection press that has a hydraulic cylinder and a press piston located inside the hydraulic cylinder that is translatable within the cylinder. The press piston divides the hydraulic cylinder into engage and retract chambers. A pump and an auxiliary pressurization device are connected to the engage chamber. A transducer measures the pressure in the engage chamber. A controller receives signals from the transducer and operates the pump. The pump delivers hydraulic fluid to the engage chamber to pressurize and inject resin into a mold cavity through the piston. The controller discontinues operation of the pump when the pressure in the engage chamber reaches a specified cut-off level. The auxiliary pressurization device maintains pressure on the fluid in the engage chamber after the controller discontinues operation of the pump to provide back pressure on the injected resin. The auxiliary pressurization device may be an accumulator that is charged by the pump. Safety devices prevent the controller from operating the pump during unsafe conditions.
摘要翻译：一种注射压机，其具有位于液压缸内部的液压缸和压力活塞，其可在气缸内平移。压力机活塞将液压缸分为接合和收回室。泵和辅助加压装置连接到接合室。传感器测量接合室中的压力。控制器从换能器接收信号并操作泵。泵将液压流体输送到接合室，以通过活塞将树脂加注并注入模腔中。当接合室中的压力达到规定的截止水平时，控制器停止泵的操作。在控制器停止泵的操作之后，辅助加压装置对接合室中的流体保持压力，以在喷射的树脂上提供背压。辅助加压装置可以是由泵充电的蓄能器。安全装置可防止控制器在不安全的条件下操作泵。

36. 发明授权

US06558600B1 Method for packaging microelectronic substrates 有权
标题翻译：微电子基板封装方法
公开(公告)号：US06558600B1
公开(公告)日：2003-05-06
申请号：US09565638
申请日：2000-05-04
申请人： Vernon M. Williams , Chad A. Cobbley
发明人： Vernon M. Williams , Chad A. Cobbley
IPC分类号： B29C4502
CPC分类号： B29C70/70 , B29C45/02 , B29C45/14655 , B29C45/462 , B29K2063/00 , B29K2101/10 , Y10T428/13
摘要： A method and apparatus for encapsulating a microelectronic substrate. In one embodiment, the apparatus can include a mold having an internal volume with a first portion configured to receive the microelectronic substrate coupled to a second portion configured to receive a pellet for encapsulating the microelectronic substrate. A plunger moves axially in the second portion to force the pellet into the first portion and around the microelectronic substrate. The pellet has overall external dimensions approximately the same as a conventional pellet, but has cavities or other features that reduce the volume of the pellet and the amount of pellet waste material left after the pellet encapsulates the microelectronic substrate. Accordingly, the pellet can be used with existing pellet handling machines. The mold and/or the plunger can have protrusions and/or other shape features that reduce the size of the first portion of the internal volume. In one aspect of this embodiment, the protrusions can be shaped to fit within the cavities of the pellet.
摘要翻译：一种用于封装微电子衬底的方法和装置。在一个实施例中，该装置可以包括具有内部体积的模具，第一部分被配置为接收耦合到第二部分的微电子衬底，该第二部分被配置为接收用于封装微电子衬底的颗粒。柱塞在第二部分中轴向移动以迫使颗粒进入第一部分并且围绕微电子衬底。颗粒具有与常规颗粒大致相同的整体外部尺寸，但是具有减小颗粒体积的空腔或其它特征以及颗粒封装微电子衬底之后留下的颗粒废料的量。因此，颗粒可以与现有的颗粒处理机一起使用。模具和/或柱塞可以具有减小内部体积的第一部分的尺寸的突起和/或其它形状特征。在该实施例的一个方面中，突起可以成形为适合于颗粒的空腔内。

37. 发明授权

US5843360A Method and pellet for encapsulating lead frames 失效
标题翻译：用于封装引线框架的方法和沉淀
公开(公告)号：US5843360A
公开(公告)日：1998-12-01
申请号：US666466
申请日：1996-06-21
申请人： Johannes Lambertus Martinus Dannenberg
发明人： Johannes Lambertus Martinus Dannenberg
IPC分类号： B29B9/08 , B29B9/12 , B29C45/02 , B29C45/14 , B29C45/46 , B29L31/34 , H01L21/56 , B29C31/06
CPC分类号： B29C45/462 , B29C45/463 , H01L21/565 , B29C45/14655 , H01L2924/0002 , Y10T428/23
摘要： A method and pellet for encapsulating lead frames. Prior to applying pressure to a pellet, a plastic foil is placed between the pellet and a plunger. The pellet has a body of encapsulating material (e.g. epoxy) and a plastic layer connected thereto. A device is described for manufacturing such a pellet.
摘要翻译：用于封装引线框架的方法和沉淀。在向颗粒施加压力之前，将塑料箔放置在颗粒和柱塞之间。颗粒具有包封材料（例如环氧树脂）和与其连接的塑料层。描述了用于制造这种颗粒的装置。

38. 发明授权

US5698152A Resin tablet for sealing semiconductor 失效
标题翻译：用于密封半导体的树脂片
公开(公告)号：US5698152A
公开(公告)日：1997-12-16
申请号：US736782
申请日：1996-10-25
申请人： Tomohiro Taruno , Yoshio Toyoda , Hirofumi Ohno , Shoichi Kimura , Hiroyuki Asao , Shinichi Kanai
发明人： Tomohiro Taruno , Yoshio Toyoda , Hirofumi Ohno , Shoichi Kimura , Hiroyuki Asao , Shinichi Kanai
IPC分类号： B29B9/08 , B29B9/10 , B29B9/12 , B29B11/12 , B29B13/02 , B29C45/46 , B29K63/00 , H01L21/56
CPC分类号： H01L21/56 , B29B11/12 , B29B13/022 , B29C45/462 , H01L2924/0002 , Y10T428/8305
摘要： A resin tablet for sealing a semiconductor formed by solidifying a molten thermosetting resin composition by cooling, wherein the content of volatile matters in the tablet is 0.05% by weight or less, and the content of gelled particles in the tablet is 0 for the particles of 60 mesh on and is 10 ppm or less for the particles of 100 mesh on.
摘要翻译：一种用于密封通过冷却固化熔融的热固性树脂组合物形成的半导体的树脂片，其中片剂中的挥发物的含量为0.05重量％以下，片剂中的凝胶状颗粒的含量为0 60目的，对于100目的颗粒为10ppm或更小。

39. 发明授权

US5507633A Resin molding apparatus for sealing an electronic device 失效
标题翻译：用于密封电子设备的树脂成型设备
公开(公告)号：US5507633A
公开(公告)日：1996-04-16
申请号：US273025
申请日：1994-07-08
申请人： Michio Osada , Yoshihisa Kawamoto
发明人： Michio Osada , Yoshihisa Kawamoto
IPC分类号： B29C33/30 , B29C45/02 , B29C45/26 , B29C45/34 , B29C45/46 , H01L21/00 , B29C45/14
CPC分类号： H01L21/67126 , B29C45/02 , B29C45/34 , B29C45/462 , B29C33/306 , B29C45/2675 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025
摘要： In an apparatus for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.
摘要翻译：在用于模制密封电子部件的树脂的设备中，通过覆盖锅，树脂路径和空腔的外侧周边，在上模具部分和下模具部分的模制表面之间形成密封空间部分。树脂片在其底部部分和下模具部分的罐的周边部分被加热，以从其顶部部分向上膨胀。包含在树脂片内的空气和水分被排出到密封空间部分中，该密封空间部分被包括在密封空间部分内的任何空气和水分都被抽空，从而避免了模制树脂体中的空隙的形成。

40. 发明授权

US5082615A Method for packaging semiconductor devices in a resin 失效
标题翻译：在树脂中封装半导体器件的方法
公开(公告)号：US5082615A
公开(公告)日：1992-01-21
申请号：US404389
申请日：1989-09-08
申请人： Kunito Sakai
发明人： Kunito Sakai
IPC分类号： B29C45/02 , B29C45/34 , B29C45/46 , H01L21/00 , H01L21/56
CPC分类号： B29C45/34 , B29C45/02 , B29C45/462 , H01L21/565 , H01L2924/0002
摘要： A method for packaging semiconductor devices in resin uses a mold having a pot and cavities, a vacuum pump for drawing off the air contained in the pot and the gases emitted from a resin tablet placed in the pot, and a pressing piston for pressing the resin tablet to feed the resin to the cavities. The pot has a volume which is greater than the maximum volume to which the heated resin tablet expands in a vacuum. The method includes the steps of placing the resin tablet in the pot, heating the resin under an applied vacuum until it expands to a sufficient extent to draw away gas trapped in the heated resin tablet, pressing the heated resin to the cavities to surround semiconductor devices placed therein, and curing the resin.
摘要翻译：在树脂中包装半导体器件的方法使用具有罐和腔的模具，用于抽出罐中所含的空气的真空泵和从放置在罐中的树脂片排出的气体，以及用于挤压树脂的按压活塞片剂将树脂喂入空腔。该罐的体积大于加热的树脂片在真空中膨胀的最大体积。该方法包括以下步骤：将树脂片放置在锅中，在施加的真空下加热树脂，直到其膨胀到足够的程度以抽出被捕获在加热的树脂片中的气体，将加热的树脂压到空腔中以围绕半导体器件并固化树脂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式