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31. 发明申请

US20070012270A1 Valve timing controller 有权
公开(公告)号：US20070012270A1
公开(公告)日：2007-01-18
申请号：US11482704
申请日：2006-07-10
申请人： Akira Hori , Akihiko Takenaka , Shuji Mizutani
发明人： Akira Hori , Akihiko Takenaka , Shuji Mizutani
IPC分类号： F01L1/34
CPC分类号： F01L1/352 , F01L1/344 , F01L2001/34436 , F01L2820/032
摘要： A valve timing adjusting device includes: a first rotary body which rotates in synchronization with one of a crankshaft and a camshaft and into which lubricating fluid is supplied; a second rotary body which rotates in synchronization with the other; a torque producing unit for producing control torque; and a phase change unit including a planetary gear mechanism in which a planetary gear is engaged with a sun gear in such a way as to be able to perform a planetary motion. The phase change unit changes a relative rotational phase between the first rotary body and the second rotary body by utilizing the control torque transmitted from the torque producing unit to the planetary gear mechanism and has a space at an interface where the first rotary body is brought into sliding contact with the planetary gear.

32. 发明授权

US6122594A System and method for designating points on a map using reduced designation information 有权
标题翻译：使用减少的指定信息在地图上指定点的系统和方法
公开(公告)号：US6122594A
公开(公告)日：2000-09-19
申请号：US417462
申请日：1999-10-12
申请人： Kazuyoshi Tamaki , Yoshimasa Furuike , Takao Mitsui
发明人： Kazuyoshi Tamaki , Yoshimasa Furuike , Takao Mitsui
IPC分类号： G09B29/00 , G01C21/00 , G01C21/32 , G06T11/60 , G08G1/0969 , G09B29/10 , G09G5/36
CPC分类号： G01C21/32 , G09B29/106
摘要： A map of an entire region is divided into sections of a square of 900", each of which is further divided into blocks of a square of 30", each of which is further divided into units of a square of 1", so that a region on the map can be hierarchically designated. Each section is defined with section codes of three figures; each block is defined with block codes of three figures in accordance with its relative positional relation in the section; and each unit is defined with unit codes of three figures in accordance with its relative positional relation in the block, so that each unit can be completely differentiated with an intrinsic code of nine figures composed of those three kinds of codes. As to the section code composing the intrinsic code corresponding to the predetermined region, moreover, a number of significant digits is reduced by assigning a lower number in the code system, so that the manual operations of inputting the intrinsic code of the predetermined region can be lightened.
摘要翻译：整个地区的地图被划分成900°的正方形的区间，每一个区域进一步被划分成30“的平方的块，每一个被进一步分成1”的平方的单位，使得地图上的区域可以被分层指定。每个部分定义为三个部分代码; 每个块根据其在该部分中的相对位置关系用三个图形的块代码定义; 并且每个单元根据其在块中的相对位置关系被定义为具有三个图形的单位代码，使得每个单元可以用由这三种代码组成的九位数的内在代码完全区分。此外，对于构成对应于预定区域的本征代码的段代码，通过在代码系统中分配较低的数字来减少有效数字的数量，从而输入预定区域的本征代码的手动操作可以是减轻

33. 发明授权

US6060780A Surface mount type unit and transducer assembly using same 失效
标题翻译：表面安装型单元和换能器组件使用相同
公开(公告)号：US6060780A
公开(公告)日：2000-05-09
申请号：US804718
申请日：1997-02-21
申请人： Tameharu Ohta , Tomohito Kunda
发明人： Tameharu Ohta , Tomohito Kunda
IPC分类号： G01P1/02 , H01L25/16 , H05K1/03 , H05K1/11 , H05K3/30 , H05K3/34 , H01L23/12
CPC分类号： G01P1/023 , H01L25/165 , H05K3/3436 , H05K3/3442 , H01L2224/05554 , H01L2224/48137 , H01L2224/49175 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H05K1/0306 , H05K1/111 , H05K2201/09045 , H05K2201/09381 , H05K2201/094 , H05K2201/09781 , H05K2201/10083 , H05K2201/10454 , H05K2201/10568 , H05K2201/10727 , H05K2201/10969 , H05K2201/2036 , H05K2203/306 , H05K3/303 , Y02P70/613
摘要： A surface mount type semiconductor package is mounted on a printed board by bonding, by means of solder bumps signal electrodes, electrically connected to respective terminals of a semiconductor chip incorporated in the package, with lands provided on the printed board. On a mount surface of the package, there are provided auxiliary electrodes formed as electrodes which are not electrically connected to the respective terminals of the semiconductor chip and have a thickness greater than that of the signal electrodes. As a result, solder thickness is secured for the solder bumps between each signal electrode and corresponding land by the difference in thickness between the auxiliary electrode and the signal electrode.
摘要翻译：表面安装型半导体封装通过焊接凸起信号电极，通过与设置在封装中的半导体芯片的各个端子电连接到印刷电路板上的焊盘而结合而安装在印刷电路板上。在封装的安装表面上，提供了形成为不与半导体芯片的各个端子电连接并且具有大于信号电极的厚度的电极的辅助电极。结果，通过辅助电极和信号电极之间的厚度差，确保每个信号电极和相应焊盘之间的焊料凸块的焊料厚度。

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