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    • 39. 发明授权
    • Thin oxide dummy tiling as charge protection
    • 薄氧化虚拟平铺作为电荷保护
    • US07977218B2
    • 2011-07-12
    • US11645475
    • 2006-12-26
    • Cinti ChenYi HeWenmei LiZhizheng LiuMing-Sang KwanYu SunJean Yee-Mei Yang
    • Cinti ChenYi HeWenmei LiZhizheng LiuMing-Sang KwanYu SunJean Yee-Mei Yang
    • H01L21/00
    • H01L27/115H01L27/0207H01L27/11568
    • Novel fabrication methods implement the use of dummy tiles to avoid the effects of in-line charging, ESD events, and such charge effects in the formation of a memory device region region. One method involves forming at least a portion of a memory core array upon a semiconductor substrate that involves forming STI structures in the substrate substantially surrounding a memory device region region within the array. An oxide layer is formed over the substrate in the memory device region region and over the STI's, wherein an inner section of the oxide layer formed over the memory device region region is thicker than an outer section of the oxide layer formed over the STI's. A first polysilicon layer is then formed over the inner and outer sections comprising one or more dummy tiles formed over one or more outer sections and electrically connected to at least one inner section.
    • 新颖的制造方法实现使用虚拟瓦片以避免在形成存储器件区域区域中的在线充电,ESD事件和这种电荷效应的影响。 一种方法包括在半导体衬底上形成至少一部分存储器芯阵列,该半导体衬底涉及在衬底中形成基本上围绕阵列内的存储器件区域区域的STI结构。 在存储器件区域和STI之上的衬底上形成氧化物层,其中形成在存储器件区域上的氧化物层的内部部分比在STI上形成的氧化物层的外部部分更厚。 然后在内部和外部部分上形成第一多晶硅层,包括形成在一个或多个外部部分上并且电连接到至少一个内部部分的一个或多个虚拟瓦片。