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31. 发明授权

US5628989A Antiperspirant and deodorant 失效
标题翻译：止汗剂和除臭剂
公开(公告)号：US5628989A
公开(公告)日：1997-05-13
申请号：US489474
申请日：1995-06-12
申请人： Asao Harashima , Yoshitsugu Morita , Ryuji Tachibana
发明人： Asao Harashima , Yoshitsugu Morita , Ryuji Tachibana
IPC分类号： A61K8/00 , A61K8/02 , A61K8/89 , A61K8/891 , A61Q15/00 , C08L83/04 , A61K7/32 , A61K7/34 , A61K7/38
CPC分类号： A61Q15/00 , A61K8/02 , A61K8/891 , A61K2800/412 , Y10S424/05
摘要： Antiperspirant/deodorants contain 5-90 wt % of spheroid silicone rubber powders with average particle sizes of 0.1-200 .mu.m and JIS A hardness of the silicone rubber forming said powder is 35-80. They spread well, are smooth, and have a dry feel when used.
摘要翻译：防汗剂/除臭剂含有5-90重量％的平均粒径为0.1-200μm的球状硅橡胶粉末，形成所述粉末的硅橡胶的JIS A硬度为35-80。它们传播良好，光滑，使用时感觉干燥。

32. 发明授权

US5486588A Epoxy-functional organopolysiloxane from SiH polysiloxane, unsaturated epoxy compound and alkene 失效
标题翻译：来自SiH聚硅氧烷的环氧官能的有机聚硅氧烷，不饱和环氧化合物和烯烃
公开(公告)号：US5486588A
公开(公告)日：1996-01-23
申请号：US463578
申请日：1995-06-05
申请人： Yoshitsugu Morita
发明人： Yoshitsugu Morita
IPC分类号： C08G77/38 , C08G77/50 , C08G77/06 , C08G77/08
CPC分类号： C08G77/38 , C08G77/50
摘要： An organopolysiloxane suitable for modifying curable organic and silicone compositions is disclosed, said organopolysiloxane having the general formula ##STR1## wherein each R.sup.1 is a monovalent group independently selected from the group consisting of hydrocarbon groups and halogenated hydrocarbon groups; R.sup.2 is selected from the group consisting of the hydrogen atom, monovalent hydrocarbon groups and halogenated hydrocarbon groups; R.sup.3 is selected from the group consisting of epoxy-functional organic groups, alkoxysilylalkyl groups and alkyl groups having at least 6 carbon atoms; a is zero or a positive number; b is a positive number; c is a positive number; a/c has a value of zero to
摘要翻译：公开了一种适用于改性可固化的有机和有机硅组合物的有机聚硅氧烷，所述有机聚硅氧烷具有通式“IMAGE”，其中每个R 1是独立地选自烃基和卤代烃基的一价基团; R2选自氢原子，一价烃基和卤代烃基; R3选自环氧官能的有机基团，烷氧基甲硅烷基烷基和具有至少6个碳原子的烷基; a为零或正数; b是正数; c是正数; a / c的值为零至<4; b / c的值为0.05〜4; 和（a + b）/ c的值为0.2-4，条件是R1和R2都不是烯基，并且所述有机聚硅氧烷在其分子中具有至少一个所述环氧官能的有机基团和至少一个所述的具有至少6个碳原子的烷基。

33. 发明授权

US5358983A Curable silicone composition 失效
标题翻译：可固化硅酮组合物
公开(公告)号：US5358983A
公开(公告)日：1994-10-25
申请号：US43248
申请日：1993-04-06
申请人： Yoshitsugu Morita
发明人： Yoshitsugu Morita
IPC分类号： C08L83/04 , C08L83/06 , C08L83/14 , C08K5/09 , C08L63/00
CPC分类号： C08L83/06 , C08L83/14
摘要： The present invention pertains to a curable silicone composition comprised of (A) an organopolysiloxane represented by the formula ##STR1## wherein R.sup.1 is a monovalent hydrocarbon group other than an alkenyl group; R.sup.2 is a monovalent hydrocarbon group other than an alkenyl group or hydrogen; R.sup.3 is an organic group that contains an epoxy group or an alkoxysilylalkyl group with the proviso that at least one R.sup.3 group is an organic group containing an epoxy group; a is either 0 or a positive number; b is a positive number; c is a positive number; a/c has a value of between 0 to 4, b/c has a value of between 0.05 to 4, and (a+b)/c has a value of between 0.2 to 4; and (B) a curing compound selected from curing agents or curing catalysts. The curable silicone composition of the present invention has superior curing properties and is capable of forming a hardened silicone material with superior flexibility and heat resistance after curing.
摘要翻译：本发明涉及一种可固化的有机硅组合物，其包含（A）由下式表示的有机聚硅氧烷：其中R 1是除烯基之外的一价烃基; R2是除烯基或氢之外的一价烃基; R3是含有环氧基或烷氧基甲硅烷基烷基的有机基团，条件是至少一个R 3基团是含有环氧基团的有机基团; a是0或正数; b是正数; c是正数; a / c的值在0〜4之间，b / c的值在0.05〜4之间，（a + b）/ c的值在0.2〜4之间; 和（B）选自固化剂或固化催化剂的固化化合物。本发明的可固化硅氧烷组合物具有优异的固化性能，并且能够在固化后形成具有优异的柔韧性和耐热性的硬化硅酮材料。

34. 发明授权

US5008733A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5008733A
公开(公告)日：1991-04-16
申请号：US161164
申请日：1988-02-26
申请人： Katsutoshi Mine , Yoshitsugu Morita , Satoshi Miyamae
发明人： Katsutoshi Mine , Yoshitsugu Morita , Satoshi Miyamae
IPC分类号： H01L23/29 , H01L21/60 , H01L23/057 , H01L23/31 , H01L23/28 , H01L23/30
CPC分类号： H01L23/057 , H01L23/3135 , H01L23/3171 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/16225 , H01L2224/16227 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/8592 , H01L2924/00011 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/014 , H01L2924/12036 , H01L2924/1301 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/20752 , H01L2924/3025
摘要： A semiconductor device (1) in which a heat-bondable cured silicone (7) is applied and heat-bonded to the surface of only a predetermined principal portion of the semiconductor device so as not to contact bonding wires (3), flip chip solder portions (8) or beam leads, in order to protect the surface of the principal portion, and a seal layer (6) or (10) is provided after the heat bonding of the cured silicone. The cured silicone (7) is preferably in the form of a film, and a heat-resistant base material (12) may be laminated to one side of the cured silicone. Breaking of bonding wires (3), cracking of solder portions (8) and separation of beam leads do not occur because only the portion to be protected can be protected by coating with the cured silicone (7) and the portion not to be protected is not so coated. Moreover, sisnce there is no contamination caused by a silicone exhalation, the occurrence of a defective bonding and the separation of a sealing resin can be prevented. The seal layers (6 ) and (10) are each constituted by a hermetic seal or a resin seal.
摘要翻译：一种半导体器件（1），其中加热粘合的固化的硅氧烷（7）被热粘合到仅半导体器件的预定主要部分的表面，以便不接触接合线（3），倒装焊料为了保护主要部分的表面，在固化的硅氧烷的热粘结之后提供了部分（8）或光束引线，以及密封层（6）或（10）。固化的硅氧烷（7）优选为膜的形式，并且耐热基材（12）可以层压在固化的硅酮的一面上。不会发生接合线（3）的断裂，焊料部分（8）的破裂和引线的分离，因为只有被固化的硅氧烷（7）涂覆才能保护被保护的部分，而不受保护的部分是没有涂层此外，由于没有由有机硅呼气引起的污染，可以防止发生不良接合和密封树脂的分离。密封层（6）和（10）各自由气密密封或树脂密封构成。

35. 发明授权

US4778860A Thermosetting resin composition 失效
标题翻译：热固性树脂组合物
公开(公告)号：US4778860A
公开(公告)日：1988-10-18
申请号：US90885
申请日：1987-08-31
申请人： Yoshitsugu Morita , Shoichi Shida
发明人： Yoshitsugu Morita , Shoichi Shida
IPC分类号： C08K5/01 , C08L83/04 , C08L101/00 , C08L77/00
CPC分类号： C08L101/00 , C08K5/01 , C08L83/04 , C08G77/12 , C08G77/20 , C08G77/44
摘要： The water permeability of cured thermosetting organic resin compositions is reduced and the dimensional stability of these compositions during molding is improved by the addition to the curable resin composition of a finely divided, cured organosiloxane material prepared from a curable organopolysiloxane, a curing agent for the organopolysiloxane, an optional silica filler and an aromatic hydrocarbon compound containing a substituted benzene ring where the substituent is a monovalent ethylenically unsaturated hydrocarbon radical or an alkenyloxy radical.
摘要翻译：固化的热固性有机树脂组合物的透水性降低，并且通过加入由可固化的有机聚硅氧烷制备的细分固化的有机硅氧烷材料的固化树脂组合物，用于有机聚硅氧烷的固化剂来改善这些组合物在模制期间的尺寸稳定性，任选的二氧化硅填料和含有取代苯环的芳族烃化合物，其中取代基是一价烯属不饱和烃基或烯氧基。

36. 发明申请

US20140191161A1 Curable Silicon Composition, Cured Product Thereof, And Optical Semiconductor Device 审中-公开
标题翻译：可固化硅组合物，其固化产物和光半导体器件
公开(公告)号：US20140191161A1
公开(公告)日：2014-07-10
申请号：US14131331
申请日：2012-07-04
申请人： Masaaki Amako , Tadashi Okawa , Tomohiro Iimura , Kazuhiro Nishijima , Maki Itoh , Yoshitsugu Morita
发明人： Masaaki Amako , Tadashi Okawa , Tomohiro Iimura , Kazuhiro Nishijima , Maki Itoh , Yoshitsugu Morita
IPC分类号： C08G77/04 , C09K11/08
CPC分类号： C08G77/04 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/80 , C08L83/00 , C08L83/04 , C09J183/04 , C09K11/08 , H01L23/24 , H01L23/296 , H01L33/502 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A hydrosilylation curable silicone composition that forms a cured product with a high refractive index, high transparency, excellent heat resistance, and excellent flexibility, the hydrosilylation curable silicone composition comprising, as a main component, an organopolysiloxane represented by the following average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d wherein, R1 are alkyl groups, alkenyl groups, phenyl groups, or hydrogen atoms; R2 is a group recited for R1, a condensed polycyclic aromatic group, or a group containing a condensed polycyclic aromatic group, provided that at least one of R1 or R2 in a molecule is an alkenyl group or hydrogen atom, and at least one R2 in a molecule is a condensed polycyclic aromatic group or a group containing a condensed polycyclic aromatic group; and a, b, c, and d are numbers satisfying: 0.01≦a≦0.8, 0≦b≦0.5, 0.2≦c≦0.9, 0≦d
摘要翻译：一种形成具有高折射率，高透明度，优异的耐热性和优异柔韧性的固化产物的氢化硅烷化可固化的硅氧烷组合物，所述氢化硅烷化可固化的有机硅组合物包含以下平均单元式代表的有机聚硅氧烷作为主要成分：（ R13SiO1 / 2）a（R12SiO2 / 2）b（R2SiO3 / 2）c（SiO4 / 2）d其中R1为烷基，烯基，苯基或氢原子; R2是R1，稠合多环芳基或含有稠合多环芳基的基团，只要分子中的R 1或R 2中的至少一个为烯基或氢原子，并且至少一个R 2为分子是缩合多环芳基或含缩合多环芳基的基团; 和a，b，c和d是满足：0.01＆nlE; a＆nlE; 0.8,0和nlE; b＆nlE; 0.5,0.2＆amp; nlE; c＆nlE; 0.9,0和nlE; d <0.2和a + b + c + d = 1。

37. 发明授权

US08338527B2 Curable silicone composition and electronic components 失效
标题翻译：可固化有机硅组合物和电子元件
公开(公告)号：US08338527B2
公开(公告)日：2012-12-25
申请号：US11912643
申请日：2006-04-27
申请人： Yoshitsugu Morita , Minoru Isshiki , Tomoko Kato
发明人： Yoshitsugu Morita , Minoru Isshiki , Tomoko Kato
IPC分类号： C08L83/06 , C08G77/14
CPC分类号： C08G59/686 , C08G59/3254 , C08G59/4085 , C08L83/06 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , C08L83/00 , H01L2224/0401
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R5—(R42SiO)mR42Si—R5-A, wherein R4 is substituted or unsubstituted mono-valent hydrocarbon group that does not contain an aliphatically unsaturated bond, R5 is a divalent organic group, A is a siloxane residue with a specific average unit formula, and m is an integer with a value of at least 1; and (C) a curing agent for epoxy resin, exhibits excellent handling and curing characteristics and that cures to give a cured product that exhibits excellent flexibility and adhesiveness.
摘要翻译：一种可固化的有机硅组合物，其包含：（A）由特定平均单元式表示并且在每个分子中具有至少两个上述环氧官能的一价有机基团的有机聚硅氧烷; （B）由以下通式表示的二有机硅氧烷：A-R5-（R42SiO）mR42Si-R5-A，其中R4是不含脂族不饱和键的取代或未取代的一价烃基，R5是二价有机基团 A是具有特定平均单元式的硅氧烷残基，m是至少为1的整数; 和（C）环氧树脂固化剂，具有优异的处理和固化特性，并且可以固化，得到表现出优异的柔软性和粘合性的固化产物。

38. 发明授权

US08262970B2 Semiconductor device and method of manufacturing thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08262970B2
公开(公告)日：2012-09-11
申请号：US10599041
申请日：2005-03-08
申请人： Yoshitsugu Morita , Junji Nakanishi , Katsutoshi Mine
发明人： Yoshitsugu Morita , Junji Nakanishi , Katsutoshi Mine
IPC分类号： H01L23/29 , H01L21/56
CPC分类号： H01L21/566 , H01L23/296 , H01L23/3121 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein said curable liquid silicone composition has viscosity of 90 Pa·s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf·cm is not less than 1 min., while the time interval during which the torque grows from 1 kgf·cm to 5 kgf·cm is not more than 1 min.
摘要翻译：一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将填充模具和非密封半导体器件之间的空间的可固化液体硅氧烷组合物在预定的成型温度下进行压缩成型而密封在固化的硅氧烷体中，其中所述可固化液体硅氧烷组合物在室温下的粘度为90Pa·s以下，从成型温度下的立方微米的扭矩测定之后的时刻到扭矩达到1kgf·cm时的时间间隔为不小于1分钟，扭矩从1 kgf·cm增加到5 kgf·cm的时间间隔不超过1分钟。

39. 发明授权

US07874655B2 Liquid transporting apparatus and piezoelectric actuator 有权
标题翻译：液体输送装置和压电致动器
公开(公告)号：US07874655B2
公开(公告)日：2011-01-25
申请号：US12343152
申请日：2008-12-23
申请人： Masatomo Kojima , Yoshitsugu Morita , Keiji Kura
发明人： Masatomo Kojima , Yoshitsugu Morita , Keiji Kura
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/14209 , B41J2002/14217 , B41J2002/14225 , B41J2002/14258 , B41J2002/14266 , B41J2002/14306 , B41J2002/14459 , B41J2002/14491
摘要： A liquid transporting apparatus includes a channel unit in which liquid transporting channel transporting the liquid is formed, the liquid transporting channel including a pressure chamber; a piezoelectric actuator which is connected to the channel unit, and which applies a pressure to the liquid in the pressure chamber, the piezoelectric actuator having: a piezoelectric layer; a first electrode arranged on a first surface of the piezoelectric layer to face the pressure chamber; a second electrode which is arranged, to face the first electrode, on a second surface of the piezoelectric layer different from the first surface; third electrodes arranged on the piezoelectric layer to sandwich the first electrode in a plan view; and fourth electrodes which are arranged, to face the third electrode, on the piezoelectric layer; a voltage applying mechanism which applies a voltage to the piezoelectric actuator; and a controller which controls the voltage applying mechanism.
摘要翻译：液体输送装置包括：通道单元，其中形成有输送液体的输送通道，液体输送通道包括压力室; 压电致动器，其连接到所述通道单元，并且对所述压力室中的液体施加压力，所述压电致动器具有：压电层; 布置在所述压电层的第一表面上以面对所述压力室的第一电极; 在与所述第一表面不同的所述压电层的第二表面上配置为面对所述第一电极的第二电极; 布置在压电层上的第三电极以平面图夹持第一电极; 以及与所述第三电极相对配置在所述压电体层上的第四电极; 电压施加机构，其向所述压电致动器施加电压; 以及控制电压施加机构的控制器。

40. 发明授权

US07863399B2 Curing silicone composition and cured product thereof 有权
标题翻译：固化硅酮组合物及其固化产物
公开(公告)号：US07863399B2
公开(公告)日：2011-01-04
申请号：US10584655
申请日：2004-12-20
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
IPC分类号： C08G77/00
CPC分类号： C08L63/00 , C08G59/306 , C08G59/3254 , C08L83/06 , C08L83/00
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.
摘要翻译：一种可固化有机硅组合物，其包含：（A）具有支链分子结构并在一个分子中含有至少两个具有酚羟基的一价烃基的有机聚硅氧烷; （B）具有至少两个不含芳环的环氧基的单价羟基的直链有机聚硅氧烷; 和（C）固化促进剂。

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