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31. 发明授权

US07033865B2 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module 失效
标题翻译：导热基板，导热基板的制造方法和电源模块
公开(公告)号：US07033865B2
公开(公告)日：2006-04-25
申请号：US10647263
申请日：2003-08-26
申请人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo
发明人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo
IPC分类号： H01L21/48
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00
摘要： By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.
摘要翻译：通过设置位于绝缘片的端部和靠近引线框架延伸的绝缘片的端部上的辐射板的端部，在离开绝缘片的端部的位置远离绝缘体片的端部的位置处，绝缘体片材，可以确保引线框架和辐射板之间的蠕变距离，而不会减少可实际安装部件的引线框区域。

32. 发明申请

US20050186768A1 Wiring substrate produced by transfer material method 有权
公开(公告)号：US20050186768A1
公开(公告)日：2005-08-25
申请号：US11090401
申请日：2005-03-25
申请人： Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
发明人： Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
IPC分类号： H05K1/03 , H05K1/16 , H05K3/20 , H05K3/40 , H01L21/00 , H01L21/44 , H01L21/461 , H01L23/48 , H01L29/40
CPC分类号： H05K3/20 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/0102 , H01L2924/01078 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/205 , H05K3/4061 , H05K3/4069 , H05K2203/1461 , Y10T29/49149 , Y10T29/49179 , Y10T29/49208 , Y10T29/49213 , Y10T428/12486 , H01L2924/00
摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

33. 发明申请

US20050005420A1 Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production 有权
标题翻译：电路元件，电路元件封装，电路元件内置模块，电路元件封装生产和电路元件内置模块生产
公开(公告)号：US20050005420A1
公开(公告)日：2005-01-13
申请号：US10902523
申请日：2004-07-29
申请人： Koichi Hirano , Seiichi Nakatani , Hiroyuki Handa , Tsunenori Yoshida , Yoshihisa Yamashita , Hiroyuki Ishitomi
发明人： Koichi Hirano , Seiichi Nakatani , Hiroyuki Handa , Tsunenori Yoshida , Yoshihisa Yamashita , Hiroyuki Ishitomi
IPC分类号： H01G2/06 , H01L25/065 , H01L29/06 , H05K1/18 , H05K3/34 , G01R1/00
CPC分类号： H01G2/065 , H01L25/0652 , H01L29/0657 , H01L2224/16225 , H01L2924/09701 , H01L2924/10157 , H01L2924/10158 , H01L2924/3011 , H05K1/185 , H05K3/3442 , H05K2201/09154 , H05K2201/10568 , H05K2201/10636 , H05K2201/2036 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49082 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/53174 , Y10T29/53178
摘要： A circuit component package of the present invention includes a mounting member including a substrate and a wiring pattern provided on the substrate, a circuit component including a component body and an external electrode provided at an end of the component body, the circuit component being arranged on the mounting member, and a conductive material that electrically connects the external electrode with the wiring pattern. In the circuit component, the component body is shaped so that a first portion of the component body on which the external electrode is provided is thinner than a second portion of the component body, the second portion being a portion on which the external electrode is not provided, and further, the external electrode is arranged in a region on a side on which the component body is positioned with respect to a reference plane containing a predetermined surface of the component body. The circuit component is arranged on the mounting member so that the component body is in contact with the mounting member. The predetermined surface of the component body is a surface of the component body that is to be opposed to the mounting member when the circuit component is mounted on the mounting member.
摘要翻译：本发明的电路部件封装包括：安装构件，包括基板和设置在基板上的布线图案;电路部件，包括部件主体和设置在部件主体的端部的外部电极，电路部件布置在安装构件和将外部电极与布线图案电连接的导电材料。在电路部件中，部件主体的形状使得设置有外部电极的部件主体的第一部分比部件主体的第二部分薄，第二部分是外部电极不在其上的部分并且进一步地，外部电极相对于包含组件主体的预定表面的参考平面布置在组件主体位于其一侧的区域中。电路部件设置在安装部件上，使得部件主体与安装部件接触。当电路部件安装在安装部件上时，部件主体的预定表面是组件主体的与安装部件相对的表面。

34. 发明授权

US06787884B2 Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production 有权
标题翻译：电路元件，电路元件封装，电路元件内置模块，电路元件封装生产和电路元件内置模块生产
公开(公告)号：US06787884B2
公开(公告)日：2004-09-07
申请号：US10448921
申请日：2003-05-29
申请人： Koichi Hirano , Seiichi Nakatani , Hiroyuki Handa , Tsunenori Yoshida , Yoshihisa Yamashita , Hiroyuki Ishitomi
发明人： Koichi Hirano , Seiichi Nakatani , Hiroyuki Handa , Tsunenori Yoshida , Yoshihisa Yamashita , Hiroyuki Ishitomi
IPC分类号： H01L2304
CPC分类号： H01G2/065 , H01L25/0652 , H01L29/0657 , H01L2224/16225 , H01L2924/09701 , H01L2924/10157 , H01L2924/10158 , H01L2924/3011 , H05K1/185 , H05K3/3442 , H05K2201/09154 , H05K2201/10568 , H05K2201/10636 , H05K2201/2036 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49082 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/53174 , Y10T29/53178
摘要： A circuit component package of the present invention includes a mounting member including a substrate and a wiring pattern provided on the substrate, a circuit component including a component body and an external electrode provided at an end of the component body, the circuit component being arranged on the mounting member, and a conductive material that electrically connects the external electrode with the wiring pattern. In the circuit component, the component body is shaped so that a first portion of the component body on which the external electrode is provided is thinner than a second portion of the component body, the second portion being a portion on which the external electrode is not provided, and further, the external electrode is arranged in a region on a side on which the component body is positioned with respect to a reference plane containing a predetermined surface of the component body. The circuit component is arranged on the mounting member so that the component body is in contact with the mounting member. The predetermined surface of the component body is a surface of the component body that is to be opposed to the mounting member when the circuit component is mounted on the mounting member.
摘要翻译：本发明的电路部件封装包括：安装构件，包括基板和设置在基板上的布线图案;电路部件，包括部件主体和设置在部件主体的端部的外部电极，电路部件布置在安装构件和将外部电极与布线图案电连接的导电材料。在电路部件中，部件主体的形状使得设置有外部电极的部件主体的第一部分比部件主体的第二部分薄，第二部分是外部电极不在其上的部分并且进一步地，外部电极相对于包含组件主体的预定表面的参考平面布置在组件主体位于其一侧的区域中。电路部件设置在安装部件上，使得部件主体与安装部件接触。当电路部件安装在安装部件上时，部件主体的预定表面是组件主体的与安装部件相对的表面。

35. 发明授权

US06692818B2 Method for manufacturing circuit board and circuit board and power conversion module using the same 有权
标题翻译：制造电路板和电路板的方法以及使用该电路板的电力转换模块
公开(公告)号：US06692818B2
公开(公告)日：2004-02-17
申请号：US10163806
申请日：2002-06-05
申请人： Koichi Hirano , Yoshihisa Yamashita , Seiichi Nakatani
发明人： Koichi Hirano , Yoshihisa Yamashita , Seiichi Nakatani
IPC分类号： B32B300
CPC分类号： H05K1/0373 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H05K3/022 , H05K2201/0129 , H05K2201/0209 , H05K2201/0355 , H05K2203/0156 , Y10S428/901 , Y10T428/24917 , H01L2924/00014
摘要： A method for manufacturing a circuit board with high thermal dissipation includes the following steps: preparing a thermal conductive resin composition including 70 to 95 mass % of an inorganic filler and 5 to 30 mass % of a resin composition that includes a liquid thermosetting resin, a thermoplastic resin powder, and a latent curing agent; bonding the thermal conductive resin composition and a metal foil together by heating at a temperature lower than a temperature at which the thermosetting resin starts to cure while applying pressure so that the thermal conductive resin composition increases in viscosity and thus is solidified irreversibly; providing holes and curing the thermosetting resin to form an insulating substrate; and forming through holes and a circuit pattern. This method can achieve improved productivity and low cost in processing the holes. It is preferable that the thermal conductive resin composition is integral with a reinforcing material.
摘要翻译：制造具有高散热性的电路板的方法包括以下步骤：制备包含70至95质量％的无机填料和5至30质量％的包含液体热固性树脂的树脂组合物的导热树脂组合物，热塑性树脂粉末和潜在性固化剂; 通过在低于热固性树脂开始固化的温度的温度下加热将导热性树脂组合物和金属箔接合在一起，同时施加压力，使得导热性树脂组合物的粘度增加，从而不可逆地固化; 提供孔并固化热固性树脂以形成绝缘基板; 并形成通孔和电路图案。该方法可以实现提高生产率并且在加工孔时具有低成本。导热性树脂组合物优选与增强材料成一体。

36. 发明申请

US20110204367A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY 有权
标题翻译：半导体器件，其制造方法和图像显示器
公开(公告)号：US20110204367A1
公开(公告)日：2011-08-25
申请号：US12672135
申请日：2008-08-06
申请人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Susumu Sawada
发明人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Susumu Sawada
IPC分类号： H01L33/02 , H01L29/786 , H01L21/336
CPC分类号： H01L51/057 , H01L27/3274 , H01L27/3276 , H01L51/0096 , Y02E10/549 , Y02P70/521
摘要： A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided.A semiconductor device comprising a resin film that has a through hole that penetrates from one surface to the other surface thereof, a source electrode disposed along the inner wall of the through hole, a drain electrode disposed along the inner wall of the through hole, a gate electrode disposed on the other surface of the resin film opposing the through hole, an insulating layer disposed on the gate electrode at the bottom of the through hole and an organic semiconductor disposed in the through hole so as to contact the source electrode and the drain electrode, wherein the organic semiconductor makes contact with at least a part of the insulating layer at the bottom of the through hole so that a channel is formed in the organic semiconductor in the vicinity of the insulating layer that is in contact therewith.
摘要翻译：提供了具有以更高密度形成的半导体元件的半导体器件。此外，还提供了使用该半导体器件的图像显示装置。一种半导体器件，包括具有从一个表面到另一个表面穿透的通孔的树脂膜，沿着通孔的内壁设置的源电极，沿该通孔的内壁设置的漏电极，设置在与通孔相对的树脂膜的另一个表面上的栅电极，设置在通孔底部的栅电极上的绝缘层和布置在通孔中的有机半导体，以便与源电极和漏极电极，其中有机半导体与通孔底部的绝缘层的至少一部分接触，使得在与其接触的绝缘层附近的有机半导体中形成沟道。

37. 发明申请

US20110204366A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY 有权
标题翻译：半导体器件，其制造方法和图像显示器
公开(公告)号：US20110204366A1
公开(公告)日：2011-08-25
申请号：US12672127
申请日：2008-08-06
申请人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Susumu Sawada
发明人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Susumu Sawada
IPC分类号： H01L33/02 , H01L29/786 , H01L21/336
CPC分类号： H01L27/3274 , H01L27/283 , H01L27/3248 , H01L27/3276 , H01L51/0005 , H01L51/0558 , H01L2227/323
摘要： A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided.A semiconductor device comprising a resin film that has a through hole that penetrates from one surface to the other surface thereof, an organic semiconductor disposed inside the through hole, an insulating film on one end of the organic semiconductor, a gate electrode on the insulating film, a source electrode connected electrically to the other end of the organic semiconductor and a drain electrode connected electrically to the other end of the organic semiconductor.
摘要翻译：提供了具有以更高密度形成的半导体元件的半导体器件。此外，还提供了使用该半导体器件的图像显示装置。一种半导体器件，包括具有从一个表面到另一个表面穿透的通孔的树脂膜，设置在所述通孔内的有机半导体，在所述有机半导体的一端上的绝缘膜，所述绝缘膜上的栅电极与该有机半导体的另一端电连接的源电极和与该有机半导体的另一端电连接的漏电极。

38. 发明授权

US07911064B2 Mounted body and method for manufacturing the same 有权
标题翻译：安装体及其制造方法
公开(公告)号：US07911064B2
公开(公告)日：2011-03-22
申请号：US11908087
申请日：2006-02-28
申请人： Shingo Komatsu , Seiichi Nakatani , Seiji Karashima , Toshiyuki Kojima , Takashi Kitae , Yoshihisa Yamashita
发明人： Shingo Komatsu , Seiichi Nakatani , Seiji Karashima , Toshiyuki Kojima , Takashi Kitae , Yoshihisa Yamashita
IPC分类号： H01L21/44 , H01L23/52 , H01L23/40 , H01L23/48 , H01L21/00
CPC分类号： H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/81801 , H01L2224/83886 , H01L2225/06517 , H01L2225/06527 , H01L2225/06582 , H01L2225/06593 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要： A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.
摘要翻译：本发明的安装体包括：层叠半导体芯片10（10a，10b）的多层半导体芯片20，以及安装基板13，其上安装有多层半导体芯片20。在该安装体中，多层半导体芯片20中的各半导体芯片10（10a，10b）在与安装基板13相对的芯片面21（21a，21b）上具有多个元件电极12（12a，12b）在安装基板13上分别形成有与多个元件电极（12a，12b）对应的电极端子14，并且安装基板的电极端子14和元件电极（12a，12b）被连接通过焊料颗粒的组装形成的焊锡凸块彼此电连接。利用这种结构，可以容易地制造安装有堆叠的包装的安装体。

39. 发明申请

US20100224986A1 MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：安装体及其制造方法
公开(公告)号：US20100224986A1
公开(公告)日：2010-09-09
申请号：US12728615
申请日：2010-03-22
申请人： Toshiyuki Kojima , Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Shingo Komatsu
发明人： Toshiyuki Kojima , Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Shingo Komatsu
IPC分类号： H01L23/498
CPC分类号： H01L24/81 , H01L21/6835 , H01L23/4952 , H01L23/49524 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/25 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16058 , H01L2224/16059 , H01L2224/16105 , H01L2224/16106 , H01L2224/16238 , H01L2224/17051 , H01L2224/171 , H01L2224/24011 , H01L2224/24225 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/73204 , H01L2224/82001 , H01L2224/83385 , H01L2224/83886 , H01L2224/83888 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19043 , H01L2924/3025 , H01L2224/16225 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2224/81805 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.
摘要翻译：本发明的安装体（100）包括：具有形成元件电极（12）的表面（10a）和与表面（10a）相对的后表面（10b）的半导体元件（10）。以及安装板（30），在其上形成有各自具有电极端子（32）的布线图案（35）。半导体元件（10）的后表面（10b）与安装板（30）接触，并且半导体元件（10）的元件电极（12）与电极端子（32）电连接通过由组装成桥形的焊料颗粒形成的焊料连接器（20）在安装板（30）上形成的布线图案（35）。利用这种结构，半导体元件的元件电极和安装板的电极端子之间的细间距连接成为可能。

40. 发明授权

US07611040B2 Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition 有权
标题翻译：用于形成焊料凸块的方法和使用焊料粉末树脂组合物安装半导体器件的方法
公开(公告)号：US07611040B2
公开(公告)日：2009-11-03
申请号：US11579505
申请日：2006-04-25
申请人： Takashi Kitae , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu , Yoshihisa Yamashita
发明人： Takashi Kitae , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu , Yoshihisa Yamashita
IPC分类号： B23K31/02 , H01L21/44
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/0558 , H01L2224/05639 , H01L2224/05644 , H01L2224/11003 , H01L2224/1152 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81141 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/15787 , H01L2924/15788 , H05K3/323 , H05K3/3436 , H05K2201/09745 , H05K2201/10977 , H05K2203/0108 , H05K2203/0113 , H05K2203/043 , H05K2203/0465 , H05K2203/167 , Y02P70/613 , H01L2924/00 , H01L2224/29099
摘要： A method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device is provided. A flat plate having a plurality of projections or recesses thereon is prepared; the flat plate is aligned to oppose an electronic component and a resin composition including a solder powder is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals, so as to form solder bumps on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps. Thus, the solder bumps having pits corresponding to the projections or having protrusions corresponding to the recesses are formed.
摘要翻译：提供一种用于形成用于实现高密度安装的焊料凸块的方法和用于安装半导体器件的高可靠性方法。制备其上具有多个突起或凹部的平板; 将平板对准电子部件，将包含焊料粉末的树脂组合物供给到平板和电子部件之间的间隙; 对树脂组合物进行退火，通过使熔融的焊料粉末在端子上自组装，将包含在树脂组合物中的焊料粉末熔化成使焊料粉末生长直至平板表面的水平，从而形成焊料凸块在终端上并且在冷却并固化焊料凸块之后去除平板。因此，形成具有对应于突起或具有与凹部对应的突起的凹坑的焊料凸块。

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