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31. 发明申请

US20050205296A1 Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus 有权
标题翻译：电光装置用面板，其制造方法，电光装置及电子装置
公开(公告)号：US20050205296A1
公开(公告)日：2005-09-22
申请号：US11073481
申请日：2005-03-04
申请人： Haruki Ito
发明人： Haruki Ito
IPC分类号： G02F1/1345 , G02F1/13 , G02F1/1362 , G09F9/00 , H05K3/00 , H05K3/40 , H05K1/03 , H05K1/11 , H05K3/30
CPC分类号： G02F1/1362 , G02F1/13452 , G02F1/13458 , G02F1/136277 , H05K3/0023 , H05K3/4007 , H05K2201/0367 , H05K2201/09909 , H05K2203/013 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A panel for an electro-optical apparatus, includes a substrate, a plurality of wires formed on the substrate, convex portions formed from resin and provided either on the plurality of wires or on the substrate, conductive layers provided so as to cover at least a portion of the surfaces of the convex portions, and that are electrically connected to the respective wires, and a plurality of external connection terminals for electrically connecting electronic components, formed by the convex portions and the conductive layers.
摘要翻译：电光装置用面板包括基板，形成在基板上的多根线，由树脂形成的凸部，设置在多条导线上或基板上，导电层设置成至少覆盖凸部的表面的部分，与各个电线电连接;以及多个用于电连接由凸部和导电层形成的电子部件的外部连接端子。

32. 发明授权

US08183693B2 Electronic device, method of producing the same, and semiconductor device 有权
标题翻译：电子装置及其制造方法以及半导体装置
公开(公告)号：US08183693B2
公开(公告)日：2012-05-22
申请号：US12897173
申请日：2010-10-04
申请人： Shuichi Tanaka , Haruki Ito
发明人： Shuichi Tanaka , Haruki Ito
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L24/90 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/13 , H01L2224/13008 , H01L2224/13099 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/19043 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599 , H01L2224/05099
摘要： A semiconductor device includes n1 first interconnects (n is an integer larger than one) respectively formed on first electrodes and extending over a first resin protrusion, and n2 second interconnects (n2
摘要翻译：半导体器件包括分别形成在第一电极上并在第一树脂突起上延伸的n1个第一互连（n是大于一的整数），以及分别形成在第二电极上并在第二树脂突起上延伸的n2个第二互连（n2 < 。第一和第二树脂突起由相同的材料形成，具有相同的宽度并且纵向延伸。第一互连延伸以与第一树脂突起的纵向轴线相交，并且每个第一互连件在第一树脂突起上具有第一宽度W1。第二互连延伸以与第二树脂突起的纵向轴线相交，并且每个第二互连件在第二树脂突起上具有第二宽度W2（W1

33. 发明授权

US07851265B2 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus 有权
标题翻译：半导体装置及其制造方法，电路基板及电子设备
公开(公告)号：US07851265B2
公开(公告)日：2010-12-14
申请号：US11830048
申请日：2007-07-30
申请人： Haruki Ito
发明人： Haruki Ito
IPC分类号： H01L21/60 , H01L21/78
CPC分类号： H01L23/5226 , H01L23/293 , H01L23/3114 , H01L23/3192 , H01L23/49816 , H01L23/5329 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/17 , H01L2224/02125 , H01L2224/02126 , H01L2224/02331 , H01L2224/0236 , H01L2224/02373 , H01L2224/02375 , H01L2224/02377 , H01L2224/02379 , H01L2224/02381 , H01L2224/024 , H01L2224/11334 , H01L2224/1146 , H01L2224/13014 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/14131 , H01L2224/16225 , H01L2224/16227 , H01L2224/94 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01074 , H01L2924/013 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/186 , H01L2924/3512 , H01L2924/00 , H01L2224/11
摘要： A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings.
摘要翻译：提供一种半导体器件，包括：包括多个电极的半导体元件; 第一布线耦合到电极并且从耦合到电极的部分引导到半导体元件的中心; 耦合在第一布线和外部端子之间的第二布线，第二布线相对于中心引导到半导体元件的外部区域; 以及形成在第一布线和第二布线之间的至少一个树脂层。

34. 发明授权

US07795129B2 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment 有权
标题翻译：半导体装置及其制造方法，电路基板，电光装置和电子设备
公开(公告)号：US07795129B2
公开(公告)日：2010-09-14
申请号：US11456354
申请日：2006-07-10
申请人： Haruki Ito
发明人： Haruki Ito
IPC分类号： H01L21/44
CPC分类号： H01L24/14 , G02F1/13458 , H01L21/4846 , H01L23/485 , H01L24/02 , H01L24/11 , H01L24/13 , H01L2224/0236 , H01L2224/02375 , H01L2224/02377 , H01L2224/024 , H01L2224/0401 , H01L2224/05124 , H01L2224/114 , H01L2224/1145 , H01L2224/1146 , H01L2224/1161 , H01L2224/11622 , H01L2224/11901 , H01L2224/12105 , H01L2224/13008 , H01L2224/13013 , H01L2224/13018 , H01L2224/1319 , H01L2224/13582 , H01L2224/13644 , H01L2224/13666 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers which are electrically connected to the electrodes and which cover the top surfaces of the protrusions. A method for manufacturing the semiconductor device includes a step of applying a layer of the resin to the semiconductor device except for the electrodes, a step of patterning the conductive layers on the electrodes and the layer of the resin in accordance with the protrusions, and a step of removing the layer of the resin located between the conductive layers by the use of the patterned conductive layers as masks so as to form the protrusions.
摘要翻译：半导体器件具有多个由树脂制成并且高于电极的突起，以及与电极电连接并覆盖突起的顶表面的导电层。一种半导体器件的制造方法，其特征在于，除了电极以外，还具有对半导体装置施加一层树脂的工序，根据突起对电极上的导电层和树脂层进行图案化的工序，通过使用图案化的导电层作为掩模去除位于导电层之间的树脂层以形成突起的步骤。

35. 发明授权

US07495331B2 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus 有权
标题翻译：半导体装置，半导体装置的制造方法，电子部件，电路基板以及电子装置
公开(公告)号：US07495331B2
公开(公告)日：2009-02-24
申请号：US11433901
申请日：2006-05-12
申请人： Haruki Ito , Nobuaki Hashimoto
发明人： Haruki Ito , Nobuaki Hashimoto
IPC分类号： H01L23/04
CPC分类号： H01L23/481 , H01L23/4824 , H01L23/50 , H01L23/522 , H01L24/12 , H01L2224/05001 , H01L2224/05009 , H01L2224/05022 , H01L2224/05025 , H01L2224/05027 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05186 , H01L2224/05548 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/05686 , H01L2224/16 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H03H9/0547 , H03H9/0552 , H03H9/1071 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01074 , H01L2924/01023
摘要： A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.
摘要翻译：半导体器件包括：半导体衬底，包括在与第一面相对的一侧上的第一面和第二面; 形成在所述半导体衬底的第一面上的外部连接端子; 形成在所述半导体衬底的第一面上并电连接到所述外部连接端子的第一电极; 形成在所述半导体衬底的第二面上或上的电子元件; 电连接到所述电子元件并具有顶面和后表面的第二电极; 形成在所述半导体衬底的第二面上并且具有包括所述第二电极的后表面的至少一部分的底面的槽部; 以及形成在所述槽部中并且电连接到所述第二电极的后表面的导电部分。

36. 发明授权

US07365561B2 Test probe and tester, method for manufacturing the test probe 有权
标题翻译：测试探针和测试仪，制造测试探针的方法
公开(公告)号：US07365561B2
公开(公告)日：2008-04-29
申请号：US11184763
申请日：2005-07-19
申请人： Haruki Ito , Shinji Mizuno , Koji Yamaguchi
发明人： Haruki Ito , Shinji Mizuno , Koji Yamaguchi
IPC分类号： G01R31/00
CPC分类号： G09G3/006 , G01R1/06761 , G01R1/07314 , G09G3/3622 , Y10T29/49204
摘要： A test probe having a conductive part electrically connected to terminals of a test-object device, including: a silicon substrate; a protrusion made of resin provided on the silicon substrate; a first conductive part which is provided on the protrusion and comes in contact with the terminals; and a second conductive part which is provided in a region other than a region having the protrusion on the silicon substrate and is electrically connected to the first conductive part.
摘要翻译：一种测试探针，其具有与测试对象器件的端子电连接的导电部分，包括：硅衬底; 设置在硅基板上的由树脂制成的突起; 第一导电部，设置在突起上并与端子接触; 以及第二导电部，其设置在除了在所述硅基板上具有所述突起的区域以外的区域中，并且与所述第一导电部电连接。

37. 发明申请

US20060263930A1 Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method 失效
公开(公告)号：US20060263930A1
公开(公告)日：2006-11-23
申请号：US11417301
申请日：2006-05-02
申请人： Haruki Ito
发明人： Haruki Ito
IPC分类号： H01L21/00 , H01L21/84
CPC分类号： H01L23/5389 , H01L21/568 , H01L23/49816 , H01L23/49883 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/24195 , H01L2224/24227 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H05K1/036 , H05K1/185 , H05K3/125 , H05K3/4664 , H05K2201/10636 , H05K2201/10674 , H05K2203/013 , H05K2203/1469 , Y02P70/611
摘要： A method of manufacture of an electronic substrate, having a process of embedding electronic components in a substrate, and a process of ejecting liquid droplets containing a conductive material, to form a wiring pattern connected to the external connection electrodes of the electronic components embedded in the substrate.

38. 发明申请

US20060261826A1 Test probe and manufacturing method for test probe 审中-公开
标题翻译：测试探针和测试探针的制造方法
公开(公告)号：US20060261826A1
公开(公告)日：2006-11-23
申请号：US11415459
申请日：2006-05-01
申请人： Haruki Ito
发明人： Haruki Ito
IPC分类号： G01R31/02
CPC分类号： G01R1/0735
摘要： A test probe for testing a semiconductor device, includes: a substrate having a first surface and a second surface; an input projection portion formed on the first surface; an output projection portion formed on the first surface; input contacting portions, each of which is in contact with each of the input terminals and is formed on the input projection portion; output contacting portions, each of which is in contact with each of the output terminals and is formed on the output projection portion; input conductive portions formed on the first surface, each of which is electrically connected to each of the input contacting portions; and output conductive portions formed on the first surface, each of which is electrically connected to each of the output contacting portions.
摘要翻译：一种用于测试半导体器件的测试探针，包括：具有第一表面和第二表面的衬底; 形成在所述第一表面上的输入突出部; 形成在所述第一表面上的输出突出部; 输入接触部分，每个输入接触部分与每个输入端子接触并形成在输入突出部分上; 输出接触部分，其每个与每个输出端子接触并形成在输出突出部分上; 形成在第一表面上的输入导电部分，每个输入导电部分电连接到每个输入接触部分; 并且输出形成在第一表面上的导电部分，每个导电部分电连接到每个输出接触部分。

39. 发明申请

US20060240664A1 Method of manufacturing multi-layered substrate 审中-公开
标题翻译：制造多层基板的方法
公开(公告)号：US20060240664A1
公开(公告)日：2006-10-26
申请号：US11396255
申请日：2006-03-31
申请人： Kenji Wada , Haruki Ito , Hideo Imai
发明人： Kenji Wada , Haruki Ito , Hideo Imai
IPC分类号： H01L21/4763
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/24011 , H01L2224/24137 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/73204 , H01L2224/76155 , H01L2224/82102 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K3/125 , H05K3/4664 , H05K2203/013 , H01L2924/00
摘要： A method of manufacturing a multi-layered substrate includes providing an electronic component on a surface of a substrate so that a terminal of the electronic component faces upward. The method also includes providing a first insulation pattern on the surface so as to fill a step generated due to a thickness of the electronic component.
摘要翻译：制造多层基板的方法包括在基板的表面上设置电子部件，使得电子部件的端子朝向上方。该方法还包括在表面上提供第一绝缘图案，以便填充由于电子部件的厚度而产生的台阶。

40. 发明申请

US20060055013A1 Electronic component, circuit board, electronic apparatus, and method for manufacturing electronic component 有权
标题翻译：电子部件，电路基板，电子设备及电子部件的制造方法
公开(公告)号：US20060055013A1
公开(公告)日：2006-03-16
申请号：US11204217
申请日：2005-08-15
申请人： Haruki Ito , Nobuaki Hashimoto
发明人： Haruki Ito , Nobuaki Hashimoto
IPC分类号： H01L23/02 , H01L23/24 , H01L23/48
CPC分类号： H03H9/0552 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05186 , H01L2224/05569 , H01L2224/05572 , H01L2224/13 , H03H9/059 , H03H9/1071 , H01L2924/00014 , H01L2924/04941 , H01L2924/01074 , H01L2924/01023 , H01L2924/013
摘要： An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug.
摘要翻译：电子部件包括：具有第一表面和与第一表面相对的第二表面的半导体衬底; 从所述第一表面到所述第二表面穿透所述半导体衬底的跨基板导电插塞; 设置在所述半导体的第一表面附近的电子元件; 以及密封构件，其密封所述密封构件和所述第一表面之间的所述电子元件，其中所述电子元件电连接到所述跨基板导电插塞。

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