专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20060005589A1 Push-button box-opening structure 有权
标题翻译：按钮开箱结构
公开(公告)号：US20060005589A1
公开(公告)日：2006-01-12
申请号：US11167824
申请日：2005-06-27
申请人： Hiroshi Hanjono , Yasuhiro Suzuki
发明人： Hiroshi Hanjono , Yasuhiro Suzuki
IPC分类号： B60R25/02
CPC分类号： B60R7/06 , E05B1/0038 , E05B15/004 , E05B83/30 , E05C3/162 , Y10S292/31 , Y10S292/37 , Y10T70/5761 , Y10T292/0825 , Y10T292/1047 , Y10T292/1083 , Y10T292/444
摘要： A push-button box-opening structure is provided in which a push button is pushed in from an unlocking starting position to an unlocking position to open a storage box. The unlocking starting position is set at a position where the push button is pushed in a given depth from a pushing-in starting position so as to prevent inadvertent opening of the storage box. The storage box does not open when the button is inadvertently pushed in up to the given depth.
摘要翻译：提供了按钮盒开口结构，其中按钮从解锁开始位置被推入解锁位置以打开存储盒。解锁开始位置被设定在按压从推入开始位置向给定深度推动的位置，以防止存储箱的意外打开。当按钮被无意地推入到给定的深度时，存储盒不会打开。

32. 发明申请

US20050261516A1 PROCESS FOR PRODUCING A FLUORINATED ESTER, A FLUORINATED ACYL FLUORIDE AND A FLUORINATED VINYL ETHER 有权
标题翻译：氟化氟化物，氟化氟乙烯和氟化乙烯醚的制备方法
公开(公告)号：US20050261516A1
公开(公告)日：2005-11-24
申请号：US10619784
申请日：2003-07-16
申请人： Takashi Okazoe , Kunio Watanabe , Shin Tatematsu , Hidenobu Murofushi , Masakuni Sato , Masahiro Ito , Koichi Yanase , Yasuhiro Suzuki
发明人： Takashi Okazoe , Kunio Watanabe , Shin Tatematsu , Hidenobu Murofushi , Masakuni Sato , Masahiro Ito , Koichi Yanase , Yasuhiro Suzuki
IPC分类号： C07C41/24 , C07C43/17 , C07C51/60 , C07C67/03 , C07C67/14 , C07C67/287 , C07C69/63
CPC分类号： C07C67/287 , C07C41/24 , C07C51/60 , C07C67/03 , C07C67/14 , C07C59/135 , C07C69/708 , C07C69/63 , C07C43/17
摘要： A process for producing a fluorinated ester through a small number of steps, is presented. The process for producing a fluorinated ester, comprises a transesterification step in which RAF—COOCF2—RAF and RA—CH2OH are subjected to a transesterification reaction to obtain RAF—COOCH2—RA, and a fluorination step in which the obtained compound is fluorinated to obtain a reaction product containing RAF—COOCF2—RAF. Here, in the formulae, RA is a monovalent organic group, and RAF is the same group as RA or a monovalent organic group obtained by fluorination of RA.
摘要翻译：提出了通过少量步骤生产氟化酯的方法。氟化酯的制备方法包括酯交换步骤，其中R AF -OCOCF 2 -R AF和R A A < / O 2 CH 2 OH进行酯交换反应，得到R AF-COOCH 2 -R A A / O >和氟化步骤，其中所得化合物被氟化以获得含有R AF -OCOCF 2 -R AF的反应产物。这里，在式中，R A A为一价有机基团，R AF为与R A A或单价有机基团相同的基团通过R A A的氟化获得。

33. 发明申请

US20050127579A1 Process for producing molded article of reclaimed thermoplastic resin 审中-公开
标题翻译：回收热塑性树脂成型体的制造方法
公开(公告)号：US20050127579A1
公开(公告)日：2005-06-16
申请号：US10502116
申请日：2003-01-23
申请人： Yasuhiro Suzuki
发明人： Yasuhiro Suzuki
IPC分类号： B29B17/00 , B29C44/34 , B29C45/17 , B29D22/00 , B29C45/00
CPC分类号： B29C44/3411 , B29B17/0042 , B29C45/1704 , Y02W30/62
摘要： The object of the present invention is to provide a recycled molded article, not having defects such as sink, warping, bending, and the like, and whose molding contraction does not change substantially depending on its recycle turn number so that said molded article having a good dimensional stability can be manufactured without changing design of the injection molding machine or molding conditions in every turn. To attain this object, the gas assist injection molding method or the expansion injection molding method wherein gas pressure or expansion pressure is effected on the melted molding material mixture in the mold, are applied in the present invention. By applying these methods, the melted molding material mixture may fill the mold uniformly and contraction strain by cooling may be absorbed in the inner hollow or the foamed structure in the resulting molded article, and further change of mold contraction depending on recycle turn number is reduced to obtain a molded article having a good dimension stability.
摘要翻译：本发明的目的是提供一种不具有凹陷，翘曲，弯曲等缺陷的再循环成型品，其成型收缩根据其循环回转数不发生显着变化，可以在不改变注塑机的设计或每一轮的成型条件的情况下制造良好的尺寸稳定性。为了达到上述目的，在本发明中应用气体辅助注射成型法或膨胀注射成型法，其中在模具中熔融的成型材料混合物上进行气体压力或膨胀压力。通过应用这些方法，熔融的成型材料混合物可以均匀地填充模具，通过冷却的收缩应变可以被吸收到所得模制品中的内部中空或发泡结构中，并且根据再循环转数而进一步改变模具收缩以获得具有良好尺寸稳定性的模塑制品。

34. 发明申请

US20050049332A1 Process for producing powdery linear polymer having improved powder properties 有权
标题翻译：具有改善的粉末性质的粉末状线性聚合物的制备方法
公开(公告)号：US20050049332A1
公开(公告)日：2005-03-03
申请号：US10493935
申请日：2002-08-28
申请人： Atsuhiro Higuchi , Yasuhiro Suzuki
发明人： Atsuhiro Higuchi , Yasuhiro Suzuki
IPC分类号： C08F6/22 , C08F257/02 , C08F265/04 , C08F285/00 , C08F291/00 , C08L51/00 , C08J3/02
CPC分类号： C08F291/00 , C08F6/22 , C08F257/02 , C08F265/04 , C08F285/00 , C08L51/003 , Y10S525/902 , Y10T428/2998 , C08L2666/02
摘要： A powdery linear polymer having a narrow particle size distribution with little dusting and excellent in anti-blocking property is recovered from a latex of a linear polymer containing a large proportion (35-75 wt. %) of soft polymer (S) component through a two-step coagulation process including a first (moderate coagulation) step causing 70-98 wt. % of the coagulation. The linear polymer in the latex has a multilayer structure comprising a linear polymer (S) having a glass transition temperature below 40° C. and a linear polymer (H) having a higher glass transition temperature disposed in totally at least two layers and containing 35-75 wt. %, as a whole, of the linear polymer (S) with the proviso that the linear polymer (S) cannot be contained in excess of 30 wt. % in an outermost layer of the multilayer structure.
摘要翻译：从具有较大比例（35-75重量％）软质聚合物（S）组分的线性聚合物的胶乳通过一种或多种的软质聚合物（S）组分回收具有窄粉粒度分布小且抗粘连性优异的粉末状线性聚合物两步凝结过程包括第一（中等凝结）步骤，产生70-98wt。％的凝血。胶乳中的线性聚合物具有包含玻璃化转变温度低于40℃的线性聚合物（S）和具有较高玻璃化转变温度的直链聚合物（H）的多层结构，其总体上至少设置在两层中并含有35 -75重量％线性聚合物（S）的整体上的％，条件是线性聚合物（S）不能超过30重量％。％的多层结构的最外层。

35. 发明授权

US06728025B2 Semiconductor optical amplifier characteristic evaluation method and apparatus 失效
标题翻译：半导体光放大器特性评估方法及装置
公开(公告)号：US06728025B2
公开(公告)日：2004-04-27
申请号：US10263233
申请日：2002-10-02
申请人： Katsuaki Magari , Toshio Ito , Hiromi Oohashi , Hiroyuki Kamioka , Yasuhiro Suzuki
发明人： Katsuaki Magari , Toshio Ito , Hiromi Oohashi , Hiroyuki Kamioka , Yasuhiro Suzuki
IPC分类号： H01S300
CPC分类号： H04B10/0731
摘要： In an SOA characteristic evaluation method, the current is supplied to an SOA. An optical output generated by the SOA that have received the current is measured. Transmission light obtained by transmitting the optical output through a wavelength filter and/or a polarizer is measured. The characteristic of the SOA is evaluated on the basis of the measurement result of the optical output and the measurement result of the transmission light without using an optical input to the SOA. An SOA characteristic evaluation apparatus is also disclosed.
摘要翻译：在SOA特性评估方法中，将电流提供给SOA。测量已经接收到电流的由SOA生成的光输出。测量通过波长滤波器和/或偏振器透射光输出而获得的透射光。基于光输出的测量结果和传输光的测量结果，不对SOA进行光输入来评估SOA的特性。还公开了SOA特性评估装置。

36. 发明授权

US06703445B2 Molding thermoplastic resin material and a method for equal quality recycle of thermoplastic resin mold 失效
标题翻译：热塑性树脂模塑成型和热塑性树脂模具等质量循环的方法
公开(公告)号：US06703445B2
公开(公告)日：2004-03-09
申请号：US09969975
申请日：2001-10-03
申请人： Yasuhiro Suzuki
发明人： Yasuhiro Suzuki
IPC分类号： C08K554
CPC分类号： C08J11/06 , B29B17/00 , Y02W30/62 , Y02W30/701
摘要： The object of the present invention is to provide a molding thermoplastic resin material giving resin mold whose quality and value are substantially equal to original resin mold even in a case where said resin mold is recycled. To attain said object, olefin group rubber and/or acrylic rubber to which monomer(s) being the same or similar monomer as (to) monomer(s) composing said molding thermoplastic resin material is(are) graft-copolymerized to give said rubbers compatibility with said molding thermoplastic resin material is(are) added in said molding thermoplastic resin material to improve said equal quality recycling property (property that quality and value are substantially equal to original thermoplastic resin mold even in a case where said thermoplastic resin mold is recycled). Said olefin group rubber and/or said acrylic rubber has(have) excellent thermal stability, heat-resistance, ozone resistance, oxidation resistance, and durability and has(have) effect on improvement of impact resistance for said thermoplastic resin material which is substantially immutable against heat history affected by repeated recycles and said molding thermoplastic resin material of the present invention can be used as a resin material of equal quality resin mold whose quality and value are substantially equal to resin mold using virgin resin material even in a case where said resin mold is recycled.
摘要翻译：本发明的目的是提供一种成型热塑性树脂材料，其树脂模具的质量和价值基本上等于原始树脂模具，即使在所述树脂模具被再循环的情况下，为了达到上述目的，烯烃基橡胶和/或丙烯酸橡胶与构成所述成型热塑性树脂材料的（单体）单体相同或相似的单体被接枝共聚以使所述橡胶与所述成型热塑性树脂材料相容，添加在所述成型热塑性树脂材料中以改善所述相同质量的再循环性能（即使在所述热塑性树脂模具被再循环的情况下，其质量和数值基本上等于原始热塑性树脂模具的性质）。烯烃基橡胶和/或所述丙烯酸酯橡胶具有优异的热稳定性，耐热性，耐臭氧性，抗氧化性和耐久性，并具有对改进的影响所述热塑性树脂材料的电阻基本上不能反映受重复再循环影响的热历史，并且本发明的所述模塑热塑性树脂材料可用作等品质树脂模具的树脂材料，其质量和值基本上等于树脂模具即使在所述树脂模具被再循环的情况下也使用原始树脂材料。

37. 发明授权

US06247809B1 Ink-jet printer 失效
标题翻译：喷墨打印机
公开(公告)号：US06247809B1
公开(公告)日：2001-06-19
申请号：US09152115
申请日：1998-09-03
申请人： Takashi Kashiwagi , Hiroshi Yamaguchi , Shinichiro Fujii , Juntaro Oku , Masaaki Oyaide , Hitoshi Ushiogi , Tadao Kamano , Sakae Shiida , Hidenobu Suzuki , Yasuhiro Suzuki , Akira Sato
发明人： Takashi Kashiwagi , Hiroshi Yamaguchi , Shinichiro Fujii , Juntaro Oku , Masaaki Oyaide , Hitoshi Ushiogi , Tadao Kamano , Sakae Shiida , Hidenobu Suzuki , Yasuhiro Suzuki , Akira Sato
IPC分类号： B41J201
CPC分类号： B41J11/0005 , B41J13/223
摘要： An ink-jet printer includes a rotary drum 10, having a dielectric peripheral surface 11, for rotating at a constant speed, a sheet loader 90 for loading a sheet to the rotary drum 10, a sheet holding system for causing the sheet to be held on the peripheral surface 11 of the rotary drum 10, and a print head section 200 for printing an image on the sheet held on the peripheral surface 11 of the rotary drum 10 by jetting ink to the sheet while the rotary drum 10 makes a predetermined number of rotations. Particularly, the sheet holding system includes a charging section 20 and a supplementary charger section 26. The charging section 20 charges the peripheral surface 11 of the rotary drum 10 on an upstream side of the loading point where the leading end of the sheet loaded by the sheet loader 90 contacts the peripheral surface 11 of the rotary drum 10. The supplementary charger section 26 charges the sheet to supplement the electrostatic attraction force attenuated during the rotation of the rotary drum 10.
摘要翻译：喷墨打印机包括具有用于以恒定速度旋转的介电外围表面11的旋转滚筒10，用于将片材装载到旋转滚筒10的片材装载机90，用于使片材保持的片材保持系统在旋转磁鼓10的外周面11上，以及打印头部分200，用于通过在旋转磁鼓10形成预定数量的同时将墨水喷射到片材上来打印保持在旋转磁鼓10的周面11上的图像上的图像的旋转。特别地，片材保持系统包括充电部分20和辅助充电器部分26.充电部分20在装载点的上游侧对旋转鼓10的外周表面11进行充电，片材装载机90与旋转鼓10的周面11接触。补充充电器部分26对片材进行充电以补充在旋转磁鼓10旋转期间衰减的静电吸引力。

38. 发明授权

US5882819A Sulfide-series electrode material and secondary battery with high energy density 失效
标题翻译：硫化物系列电极材料和能量密度高的二次电池
公开(公告)号：US5882819A
公开(公告)日：1999-03-16
申请号：US720033
申请日：1996-09-27
申请人： Katsuhiko Naoi , Akihiko Torikoshi , Yasuhiro Suzuki
发明人： Katsuhiko Naoi , Akihiko Torikoshi , Yasuhiro Suzuki
IPC分类号： H01M4/60 , H01M10/05
CPC分类号： H01M4/608 , H01M4/60
摘要： An electrode material includes a sulfide compound containing a tetrazole ring as an active substance. The secondary battery using such a material provides an extremely high energy density.
摘要翻译：电极材料包括含有四唑环作为活性物质的硫化物。使用这种材料的二次电池提供极高的能量密度。

39. 发明授权

US5763942A Lead frame free of irregular deformation 失效
标题翻译：引线框架无变形
公开(公告)号：US5763942A
公开(公告)日：1998-06-09
申请号：US800297
申请日：1997-02-13
申请人： Yasuhiro Suzuki
发明人： Yasuhiro Suzuki
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/49541 , H01L2924/0002
摘要： There is provided a lead frame including an outer frame, a die pad on which a semiconductor device is to be mounted, a plurality of outer leads extending from the outer frame to the die pad, a dam bar connected at opposite ends thereof to the outer frame for connecting the outer leads to one another for prevention of resin overflow, and a support lead extending obliquely to the dam bar for connecting the die pad to the outer frame. The outer frame is formed beyond an end of the dam bar with an opening extending in a direction making an angle with a direction in which the dam bar longitudinally extends so that there is formed an elastically deformable portion between the opening and an end of the dam bar, the opening having a length covering at least a width of the dam bar. When there is generated a stress because of shrinkage of resin with which a semiconductor device is sealed, the elastically deformable portion is first deformed by absorbing a stress to thereby prevent the stress from spreading further to the dam bar. Thus, it is possible to prevent irregular bending of outer leads connected by the dam bar with each other. As a result, higher accuracy is expected with respect to a position of outer leads after a semiconductor device is sealed with resin.
摘要翻译：提供了一种引线框架，其包括外框架，其上安装有半导体器件的管芯焊盘，从外框架延伸到管芯焊盘的多个外引线，在其两端连接到外管用于将外引线彼此连接以防止树脂溢出的框架，以及倾斜延伸到坝条的支撑引线，用于将管芯焊盘连接到外框架。外框架形成为超过阻挡杆的端部，开口沿与坝条纵向延伸的方向成一角度的方向延伸，使得在开口和坝的端部之间形成可弹性变形的部分所述开口具有覆盖所述坝条的至少宽度的长度。当由于密封半导体器件的树脂的收缩而产生应力时，首先通过吸收应力来使可弹性变形部变形，从而防止应力进一步扩散到堤坝。因此，可以防止由堤坝彼此连接的外部引线的不规则弯曲。结果，在用树脂密封半导体器件之后，相对于外部引线的位置，期望更高的精度。

40. 发明授权

US5712507A Semiconductor device mounted on die pad having central slit pattern and peripheral slit pattern for absorbing 失效
标题翻译：半导体器件安装在具有中心狭缝图案和外围狭缝图案的芯片衬垫上用于吸收
公开(公告)号：US5712507A
公开(公告)日：1998-01-27
申请号：US589784
申请日：1996-01-22
申请人： Takahiro Eguchi , Yasuhiro Suzuki
发明人： Takahiro Eguchi , Yasuhiro Suzuki
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L24/32 , H01L23/49503 , H01L2224/32057 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/0132 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3511
摘要： A plurality of slits are formed in a die pad of a lead-frame for mounting a semiconductor chip, and are arranged in such a manner as to nearly equalize the length of peripheral sub-areas of the die pad uncovered with the semiconductor chip, thereby effectively absorbing a shrinkage and an elongation due to a difference in thermal expansion coefficient among the die pad, the semiconductor chip and a plastic package hermetically sealing the semiconductor chip.
摘要翻译：在用于安装半导体芯片的引线框架的管芯焊盘中形成多个狭缝，并且以几乎相等于半导体芯片未覆盖的管芯焊盘的外围子区域的长度的方式布置，从而有效地吸收由于芯片焊盘，半导体芯片和密封半导体芯片的塑料封装体之间的热膨胀系数差而引起的收缩和伸长。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式