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31. 发明申请

US20060205116A1 Methods for packaging microfeature devices and microfeature devices formed by such methods 有权
公开(公告)号：US20060205116A1
公开(公告)日：2006-09-14
申请号：US11430483
申请日：2006-05-09
申请人： Peter Benson , Charles Watkins
发明人： Peter Benson , Charles Watkins
IPC分类号： H01L21/00 , H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L21/563 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H05K3/305 , H05K2201/10674 , H05K2201/10977 , H05K2201/10984 , Y02P70/613 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method comprises providing a workpiece including a substrate having a plurality of microelectronic dies on and/or in the substrate. The individual dies include integrated circuitry and pads electrically coupled to the integrated circuitry. The method then includes depositing an underfill layer onto a front side of the substrate. The method also includes selectively forming apertures in the underfill layer to expose the pads at the front side of the substrate. The method further includes depositing a conductive material into the apertures and in electrical contact with the corresponding pads. In one aspect of this embodiment, the underfill layer is a photoimageable material.

32. 发明申请

US20070066048A1 Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies 有权
标题翻译：使用激光烧蚀工艺制造用于半导体器件结构的导电元件的方法和制造半导体器件组件的方法
公开(公告)号：US20070066048A1
公开(公告)日：2007-03-22
申请号：US11601341
申请日：2006-11-17
申请人： Peter Benson , Charles Watkins
发明人： Peter Benson , Charles Watkins
IPC分类号： H01L21/4763
CPC分类号： H01L24/13 , H01L21/563 , H01L21/76804 , H01L21/76879 , H01L23/3171 , H01L24/02 , H01L24/11 , H01L2224/0401 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/73203 , H01L2924/0001 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014
摘要： A method for forming at least one conductive element is disclosed. Particularly, a semiconductor substrate, including a plurality of semiconductor dice thereon, may be provided and a dielectric layer may be formed thereover. At least one depression may be laser ablated in the dielectric layer and an electrically conductive material may be deposited thereinto. Also, a method for assembling a semiconductor die having a plurality of bond pads and a dielectric layer formed thereover to a carrier substrate having a plurality of terminal pads is disclosed. At least one depression may be laser ablated into the dielectric layer and a conductive material may be deposited thereinto for electrical communication between the semiconductor die and the carrier substrate. The semiconductor die may be affixed to the carrier substrate and at least one of the dielectric layer and the conductive material may remain substantially solid during affixation therebetween. The methods may be implemented at the wafer level.
摘要翻译：公开了一种用于形成至少一个导电元件的方法。特别地，可以提供在其上包括多个半导体晶片的半导体衬底，并且可以在其上形成电介质层。至少一个凹陷可以在电介质层中激光烧蚀，并且导电材料可以沉积在其中。此外，公开了一种用于组装具有多个接合焊盘的半导体管芯的方法以及形成在其上的具有多个端子焊盘的载体衬底的电介质层。可以将至少一个凹陷激光烧蚀到介电层中，并且可以在其中沉积导电材料以用于半导体管芯和载体衬底之间的电连通。半导体管芯可以固定到载体衬底上，并且介电层和导电材料中的至少一个可以在它们之间固定期间保持基本上固体。这些方法可以在晶片级实现。

33. 发明申请

US20060046461A1 Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies 有权
公开(公告)号：US20060046461A1
公开(公告)日：2006-03-02
申请号：US10933197
申请日：2004-09-01
申请人： Peter Benson , Charles Watkins
发明人： Peter Benson , Charles Watkins
IPC分类号： H01L21/44 , H01L21/4763
CPC分类号： H01L24/13 , H01L21/563 , H01L21/76804 , H01L21/76879 , H01L23/3171 , H01L24/02 , H01L24/11 , H01L2224/0401 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/73203 , H01L2924/0001 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014
摘要： A method for forming at least one conductive element is disclosed. Particularly, a semiconductor substrate, including a plurality of semiconductor dice thereon, may be provided and a dielectric layer may be formed thereover. At least one depression may be laser ablated in the dielectric layer and an electrically conductive material may be deposited thereinto. Also, a method for assembling a semiconductor die having a plurality of bond pads and a dielectric layer formed thereover to a carrier substrate having a plurality of terminal pads is disclosed. At least one depression may be laser ablated into the dielectric layer and a conductive material may be deposited thereinto for electrical communication between the semiconductor die and the carrier substrate. The semiconductor die may be affixed to the carrier substrate and at least one of the dielectric layer and the conductive material may remain substantially solid during affixation therebetween. The methods may be implemented at the wafer level.

34. 发明申请

US20060046346A1 Methods for packaging microfeature devices and microfeature devices formed by such methods 有权
公开(公告)号：US20060046346A1
公开(公告)日：2006-03-02
申请号：US10932842
申请日：2004-09-01
申请人： Peter Benson , Charles Watkins
发明人： Peter Benson , Charles Watkins
IPC分类号： H01L21/50
CPC分类号： H01L21/563 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H05K3/305 , H05K2201/10674 , H05K2201/10977 , H05K2201/10984 , Y02P70/613 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method comprises providing a workpiece including a substrate having a plurality of microelectronic dies on and/or in the substrate. The individual dies include integrated circuitry and pads electrically coupled to the integrated circuitry. The method then includes depositing an underfill layer onto a front side of the substrate. The method also includes selectively forming apertures in the underfill layer to expose the pads at the front side of the substrate. The method further includes depositing a conductive material into the apertures and in electrical contact with the corresponding pads. In one aspect of this embodiment, the underfill layer is a photoimageable material.

35. 发明申请

US20080229696A1 INTERLOCKING PANEL 审中-公开
标题翻译：互锁面板
公开(公告)号：US20080229696A1
公开(公告)日：2008-09-25
申请号：US12052689
申请日：2008-03-20
申请人： Peter Benson , Anders Helander
发明人： Peter Benson , Anders Helander
IPC分类号： E04C2/30 , E04B2/72 , E04G21/14 , E04C2/38
CPC分类号： E06B3/7003 , B60J5/108 , E04B1/6129 , E04B1/615 , E04C2/08 , E04C2/34
摘要： An interlocking panel, and structures formed therefrom, are described herein. Embodiments of the present invention provide a panel including a protruding end including a receiving member for engaging a complementary engaging member of a first adjacent panel, and a receiving end including two flanges, at least one of the two flanges including an engaging member for engaging a complementary receiving member of a second adjacent panel, one or both of the two flanges configured to flex to allow the complementary receiving member of the second adjacent panel to engage the engaging member.
摘要翻译：互锁面板以及由此形成的结构在本文中被描述。本发明的实施例提供了一种面板，其包括突出端，该突出端包括用于接合第一相邻面板的互补接合构件的接收构件和包括两个凸缘的接收端，所述两个凸缘中的至少一个包括用于接合第二相邻面板的互补接收构件，两个凸缘中的一个或两个被构造成弯曲以允许第二相邻面板的互补接收构件接合接合构件。

36. 发明授权

US07158995B2 Method for managing pointers to external objects in a run-time environment 有权
标题翻译：在运行时环境中管理指向外部对象的指针的方法
公开(公告)号：US07158995B2
公开(公告)日：2007-01-02
申请号：US10406787
申请日：2003-04-03
申请人： Harlan Sexton , David Unietis , Peter Benson
发明人： Harlan Sexton , David Unietis , Peter Benson
IPC分类号： G06F17/00
CPC分类号： G06F9/445 , G06F9/44557 , G06F12/0253 , Y10S707/99943 , Y10S707/99944 , Y10S707/99945 , Y10S707/99953 , Y10S707/99957
摘要： A method and software for managing pointers to external objects in a run-time environment are described in which eager external references are provided that allow session memory objects to point directly to certain call memory objects with machine pointers. The eager external references contain enough information to recreate the call memory objects in call memory at the beginning of the call and fix the session memory objects to point to the new locations of the recreated call memory objects.
摘要翻译：描述了一种用于在运行时环境中管理指向外部对象的指针的方法和软件，其中提供了允许会话存储器对象使用机器指针直接指向某些调用存储器对象的渴望的外部引用。激烈的外部引用包含足够的信息，以在调用开始时重新创建调用存储器中的调用存储器对象，并修复会话存储器对象以指向重新创建的调用存储器对象的新位置。

37. 发明授权

US06711657B1 Methods for managing memory in a run-time environment including registration of a deallocation routine at explicit, lazy initialization 有权
标题翻译：用于在运行时环境中管理内存的方法，包括在显式，延迟初始化时注册一个释放程序
公开(公告)号：US06711657B1
公开(公告)日：2004-03-23
申请号：US09512619
申请日：2000-02-25
申请人： Harlan Sexton , Peter Benson , Jerry Schwarz
发明人： Harlan Sexton , Peter Benson , Jerry Schwarz
IPC分类号： G06F1200
CPC分类号： G06F12/0253 , G06F9/4493 , G06F9/485 , Y10S707/99953 , Y10S707/99956
摘要： Methods of memory management in a run-time environment are described. A mechanism is provided for registering a routine to deinitialize or deallocate a large object at the end of a call (e.g. by setting it to null to unreference the object), which prevents the large object from being migrated into session memory, e.g. when live objects are migrated at the end of the call. This routine is called after the finalization of garbage collected objects that may use the large object. In a subsequent call, the large object is checked before use to determine if the object is deinitialized and re-initialized if the large object was deinitialized.
摘要翻译：描述运行时环境中的内存管理方法。提供了一种机制，用于在呼叫结束时（例如通过将其设置为空以取消对对象的重定位）来注册例程以对大对象进行去初始化或解除分配，这防止大对象迁移到会话存储器，例如，活动结束时迁移活动对象。在可能使用大对象的垃圾收集对象的最终化之后调用此例程。在随后的调用中，在使用之前检查大对象以确定对象是否已初始化，如果大对象已初始化，则重新初始化该对象。

38. 发明授权

US06457019B1 Memory management within a run-time environment 有权
标题翻译：运行时环境中的内存管理
公开(公告)号：US06457019B1
公开(公告)日：2002-09-24
申请号：US09248295
申请日：1999-02-11
申请人： Harlan Sexton , David Unietis , Peter Benson
发明人： Harlan Sexton , David Unietis , Peter Benson
IPC分类号： G06F1700
CPC分类号： G06F12/0276 , Y10S707/99944 , Y10S707/99953
摘要： Objects that are managed within a run-time environment are stored on N-bit aligned addresses. Due to the alignment restriction, the N least significant bits of a reference to an object are available for storing information about the storage properties of the object. This information is extractable by fast register operations. The storage properties can include the lifetime, format, and contiguity of the object, or a combination of these properties. If the run-time environment implements a generational garbage collector, the reference tags are used to encode whether or not the object is recently allocated.
摘要翻译：在运行时环境中管理的对象存储在N位对齐的地址上。由于对齐限制，对对象的引用的N个最低有效位可用于存储关于对象的存储属性的信息。该信息可以通过快速注册操作来提取。存储属性可以包括对象的生命周期，格式和连续性，或这些属性的组合。如果运行时环境实现代数垃圾收集器，则引用标记用于编码对象是否最近被分配。

39. 发明授权

US07223674B2 Methods for forming backside alignment markers useable in semiconductor lithography 有权
标题翻译：形成用于半导体光刻的背面对准标记的方法
公开(公告)号：US07223674B2
公开(公告)日：2007-05-29
申请号：US10840733
申请日：2004-05-06
申请人： Pary Baluswamy , Peter Benson
发明人： Pary Baluswamy , Peter Benson
IPC分类号： H01L21/301
CPC分类号： H01L21/67282 , B23K26/364 , G03F9/708 , G03F9/7084 , H01L21/3065 , H01L23/544 , H01L2223/5442 , H01L2223/54453 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein are methods for forming photolithography alignment markers on the back side of a substrate, such as a crystalline silicon substrate used in the manufacture of semiconductor integrated circuits. According to the disclosed techniques, laser radiation is used to remove the material (e.g., silicon) from the back side of a substrate to form the back side alignment markers at specified areas. Such removal can comprise the use of laser ablation or laser-assisted etching. The substrate is placed on a motor-controlled substrate holding mechanism in a laser removal chamber, and the areas are automatically moved underneath the laser radiation to removal the material. The substrate holding mechanism can comprise a standard chuck (in which case use of a protective layer on the front side of the substrate is preferred), or a substrate clamping assembly which suspends the substrate at its edges (in which case the protective layer is not necessary). Alternatively, a stencil having holes corresponding to the shape of the back side alignment markers can be placed over the back side of the substrate to mitigate the need to move the substrate to the areas with precision.
摘要翻译：这里公开了在衬底的背面上形成光刻对准标记的方法，例如用于制造半导体集成电路的晶体硅衬底。根据所公开的技术，使用激光辐射从衬底的背面去除材料（例如硅），以在特定区域形成背面对准标记。这种去除可以包括使用激光烧蚀或激光辅助蚀刻。将基板放置在激光去除室中的电动机控制的基板保持机构上，并且这些区域在激光辐射下自动移动以去除材料。基板保持机构可以包括标准卡盘（在这种情况下优选使用基板的正面上的保护层）或将基板悬挂在其边缘处的基板夹持组件（在这种情况下保护层不是保护层）必要）。或者，具有与背面对准标记的形状对应的孔的模板可以放置在衬底的背面上，以减轻将衬底精确地移动到区域的需要。

40. 发明申请

US20060226118A1 Methods for forming backside alignment markers useable in semiconductor lithography 审中-公开
标题翻译：形成用于半导体光刻的背面对准标记的方法
公开(公告)号：US20060226118A1
公开(公告)日：2006-10-12
申请号：US11449532
申请日：2006-06-07
申请人： Pary Baluswamy , Peter Benson
发明人： Pary Baluswamy , Peter Benson
IPC分类号： B44C1/22 , C23F1/00
CPC分类号： H01L21/67282 , B23K26/364 , G03F9/708 , G03F9/7084 , H01L21/3065 , H01L23/544 , H01L2223/5442 , H01L2223/54453 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein are methods for forming photolithography alignment markers on the back side of a substrate, such as a crystalline silicon substrate used in the manufacture of semiconductor integrated circuits. According to the disclosed techniques, laser radiation is used to remove the material (e.g., silicon) from the back side of a substrate to form the back side alignment markers at specified areas. Such removal can comprise the use of laser ablation or laser-assisted etching. The substrate is placed on a motor-controlled substrate holding mechanism in a laser removal chamber, and the areas are automatically moved underneath the laser radiation to removal the material. The substrate holding mechanism can comprise a standard chuck (in which case use of a protective layer on the front side of the substrate is preferred), or a substrate clamping assembly which suspends the substrate at its edges (in which case the protective layer is not necessary). Alternatively, a stencil having holes corresponding to the shape of the back side alignment markers can be placed over the back side of the substrate to mitigate the need to move the substrate to the areas with precision.
摘要翻译：这里公开了在衬底的背面上形成光刻对准标记的方法，例如用于制造半导体集成电路的晶体硅衬底。根据所公开的技术，使用激光辐射从衬底的背面去除材料（例如硅），以在特定区域形成背面对准标记。这种去除可以包括使用激光烧蚀或激光辅助蚀刻。将基板放置在激光去除室中的电动机控制的基板保持机构上，并且这些区域在激光辐射下自动移动以去除材料。基板保持机构可以包括标准卡盘（在这种情况下优选使用基板的正面上的保护层）或将基板悬挂在其边缘处的基板夹持组件（在这种情况下保护层不是保护层）必要）。或者，具有与背面对准标记的形状对应的孔的模板可以放置在衬底的背面上，以减轻将衬底精确地移动到区域的需要。

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