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31. 发明授权

US07014532B2 Lapping machine, lapping method, and method of manufacturing magnetic head 失效
标题翻译：研磨机，研磨方法和制造磁头的方法
公开(公告)号：US07014532B2
公开(公告)日：2006-03-21
申请号：US10823167
申请日：2004-04-13
申请人： Teruaki Nishioka , Kazuo Yokoi , Yoshiaki Yanagida , Shunsuke Sone
发明人： Teruaki Nishioka , Kazuo Yokoi , Yoshiaki Yanagida , Shunsuke Sone
IPC分类号： B24B49/00
CPC分类号： B24B37/005 , B24B37/048 , B24B49/00 , B24B51/00
摘要： A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).
摘要翻译：研磨机包括由旋转机构旋转的研磨表面板（1），具有多个突起到底面的研磨夹具（28），研磨表面板上的研磨表面上的研磨表面研磨的工件（30）（1）配置有用于分别调整多个突起（28c）与研磨面板（1）的变化量的投影量调整元件（29），以及控制电路（36）投影控制信号输入到投影变化调整元件（29）。

32. 发明申请

US20050186887A1 Processing method and apparatus 失效
标题翻译：加工方法及装置
公开(公告)号：US20050186887A1
公开(公告)日：2005-08-25
申请号：US11094659
申请日：2005-03-31
申请人： Michinao Nomura , Yoshiaki Yanagida , Koji Sudo , Shunsuke Sone
发明人： Michinao Nomura , Yoshiaki Yanagida , Koji Sudo , Shunsuke Sone
IPC分类号： B24B1/00 , B24B13/00 , B24B37/00 , B24B37/04 , B24B49/00 , B24B49/02
CPC分类号： B24B37/30 , B24B1/00 , B24B13/00 , B24B37/00 , B24B49/02
摘要： A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.
摘要翻译：一种处理方法包括以下步骤：将工具与工件弹性变形，夹具已安装在工件上，将工件压靠在抛光表面上，并使工件和抛光表面相对于彼此移动。

33. 发明授权

US06913509B2 Method and apparatus for polishing, and lapping jig 失效
标题翻译：抛光和研磨夹具的方法和设备
公开(公告)号：US06913509B2
公开(公告)日：2005-07-05
申请号：US10460560
申请日：2003-06-12
申请人： Shunsuke Sone , Yoshiaki Yanagida , Teruaki Nishioka , Koji Suto
发明人： Shunsuke Sone , Yoshiaki Yanagida , Teruaki Nishioka , Koji Suto
IPC分类号： B24B37/00 , B24B37/005 , B24B37/04 , B24B37/30 , B24B41/06 , B24B49/04 , B24B51/00 , G11B5/127 , G11B5/31 , G11B5/39 , B24B49/00
CPC分类号： B24B51/00 , B24B37/048 , B24B49/04 , Y10T29/49048 , Y10T29/4905
摘要： Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.
摘要翻译：本文公开了一种通过操作多个弯曲机构来相对于抛光表面推/拉工件来抛光具有多个电阻元件的工件的方法。该方法包括以下步骤：测量工件的形状，根据测量的形状来计算每个弯曲机构的操作量，根据所计算的操作量按照弯曲机构在抛光表面上按压工件，并更新操作量根据工件的工作量。根据这种方法，可以稳定地抛光包含在工件中的磁头。

34. 发明授权

US06599170B2 Method and apparatus for polishing, and lapping jig 失效
公开(公告)号：US06599170B2
公开(公告)日：2003-07-29
申请号：US09736003
申请日：2000-12-13
申请人： Shunsuke Sone , Yoshiaki Yanagida , Teruaki Nishioka , Koji Suto , Tomokazu Sugiyama
发明人： Shunsuke Sone , Yoshiaki Yanagida , Teruaki Nishioka , Koji Suto , Tomokazu Sugiyama
IPC分类号： B24B4900
CPC分类号： B24B51/00 , B24B37/048 , B24B49/04 , Y10T29/49048 , Y10T29/4905
摘要： Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

35. 发明授权

US06315636B1 Lapping machine, row tool, and lapping method 失效
标题翻译：研磨机，排工具和研磨方法
公开(公告)号：US06315636B1
公开(公告)日：2001-11-13
申请号：US09483906
申请日：2000-01-18
申请人： Yoshiaki Yanagida , Teruaki Nishioka , Koji Sudo , Shunsuke Sone , Tomokazu Sugiyama
发明人： Yoshiaki Yanagida , Teruaki Nishioka , Koji Sudo , Shunsuke Sone , Tomokazu Sugiyama
IPC分类号： B24B4900
CPC分类号： B24B37/30 , B24B37/048 , B24B49/16 , G11B5/102 , G11B5/1871 , G11B5/3103 , G11B5/3116 , G11B5/3163 , G11B23/505
摘要： Disclosed herein is a lapping machine for lapping a row bar having a plurality of head sliders. The lapping machine includes a lap plate for providing a lapping surface, a row tool having a work surface for pressing the row bar against the lapping surface, and a mechanism for operating the row tool so that a given pressure distribution is produced between the row bar and the lapping surface. The row tool has a plurality of holes arranged along the work surface. The mechanism includes a plurality of pivoted links each having a load point where a force having a direction perpendicular to the work surface is applied to the row tool in each of the holes. Each of the pivoted links further has a support point as the fulcrum and an effort point where a force having a direction substantially parallel to the work surface is received. The ratio of a distance between the load point and the support point to a distance between the effort point and the support point is substantially constant. With this configuration, the spacing between any adjacent ones of the holes of the row tool can be easily reduced to thereby improve a working accuracy.
摘要翻译：本文公开了一种用于研磨具有多个头滑块的行杆的研磨机。研磨机包括用于提供研磨表面的搭接板，具有用于将排条压靠在研磨表面上的工作表面的行工具和用于操作行工具的机构，使得在行条之间产生给定的压力分布和研磨表面。行工具具有沿着工作表面布置的多个孔。该机构包括多个枢转连杆，每个枢转连杆具有负载点，其中具有垂直于工作表面的方向的力被施加到每个孔中的行工具。每个枢转连杆还具有作为支点的支撑点和具有基本上平行于工作表面的方向的力的努力点。负载点和支撑点之间的距离与工作点与支撑点之间的距离的比率基本上是恒定的。利用这种构造，可以容易地减少行工具的任何相邻孔之间的间隔，从而提高加工精度。

36. 发明授权

US06296713B1 Erasing method 失效
标题翻译：擦除方法
公开(公告)号：US06296713B1
公开(公告)日：2001-10-02
申请号：US09545096
申请日：2000-04-06
申请人： Masaru Sugie , Chiaki Sekioka , Yoshiaki Yanagida , Hisashi Uemura , Masayuki Kubota , Hirobumi Haga
发明人： Masaru Sugie , Chiaki Sekioka , Yoshiaki Yanagida , Hisashi Uemura , Masayuki Kubota , Hirobumi Haga
IPC分类号： B08B704
CPC分类号： G03G9/0926 , B41M7/0009
摘要： According to a first aspect of this invention, it is assumed that the recording is carried out on the recording medium by a non-catalyst-containing recording agent and a liquid-state catalyst is coated on the recording medium at the time of erasing processing and subsequently the heating and irradiation of near infrared rays are carried out as the erasing processing. Also, according to a second aspect of this invention, it is assumed that the recording is carried out on the recording medium by a catalyst-containing recording agent and, at the erasing processing time, the heating and irradiation of the recording agent are simultaneously carried out using a thermal emission and near IR irradiation source such as a halogen lamp.
摘要翻译：根据本发明的第一方面，假设通过非催化剂的记录剂在记录介质上进行记录，并且在擦除处理时将液态催化剂涂覆在记录介质上，随后进行近红外线的加热和照射作为擦除处理。此外，根据本发明的第二方面，假设通过含催化剂的记录剂在记录介质上进行记录，并且在擦除处理时间同时承载记录剂的加热和照射使用热发射和近红外辐射源如卤素灯。

37. 发明授权

US6132290A Automatic lapping method of a thin film element and a lapping apparatus using the same 失效
标题翻译：薄膜元件的自动研磨方法和使用其的研磨装置
公开(公告)号：US6132290A
公开(公告)日：2000-10-17
申请号：US988994
申请日：1997-12-11
申请人： Tomokazu Sugiyama , Motoichi Watanuki , Kazuo Yokoi , Yoshiaki Yanagida , Koji Suto
发明人： Tomokazu Sugiyama , Motoichi Watanuki , Kazuo Yokoi , Yoshiaki Yanagida , Koji Suto
IPC分类号： B24B37/013 , B24B37/07 , B24B49/02 , G11B5/31 , G11B5/127 , B24B49/00
CPC分类号： B24B37/013 , B24B37/00 , B24B37/048 , B24B49/02 , G11B5/3116 , G11B5/3163
摘要： The present invention relates to an automatic lapping method and a lapping apparatus for lapping a work piece, which is bonded to a row bar, including a thin-film element in order to control the lapping process by accurately measuring height of the work piece. The automatic lapping apparatus may include a lapping plate for lapping a thin-film, which is bonded to a row bar, including a monitoring element having at least an analog resistance value which is analogously varied according to lapping; and a controller for converting the analog resistance value to height of said thin-film element and controlling said lapping plate to stop the lapping process when the height of the thin-film element has reached to a targeted value, wherein said controller employs a previously measured resistance value as a currently measured resistance value when the currently measured resistance value is less than the previously measured resistance value.
摘要翻译：本发明涉及一种用于研磨工件的自动研磨方法和研磨装置，该工件通过精确测量工件的高度来结合到包括薄膜元件的排条，以控制研磨过程。自动研磨装置可以包括用于研磨薄膜的研磨板，所述研磨板结合到排条，包括至少具有根据研磨类似地变化的模拟电阻值的监测元件; 以及用于将所述薄膜元件的模拟电阻值转换为高度的控制器，并且当所述薄膜元件的高度达到目标值时控制所述研磨板停止研磨处理，其中所述控制器采用预先测量的电阻值作为当前测量的电阻值小于先前测量的电阻值时的当前测量的电阻值。

38. 发明授权

US07534159B2 Processing method and apparatus 失效
标题翻译：加工方法及装置
公开(公告)号：US07534159B2
公开(公告)日：2009-05-19
申请号：US11094659
申请日：2005-03-31
申请人： Michinao Nomura , Yoshiaki Yanagida , Koji Sudo , Shunsuke Sone
发明人： Michinao Nomura , Yoshiaki Yanagida , Koji Sudo , Shunsuke Sone
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B1/00 , B24B13/00 , B24B37/00 , B24B49/02
摘要： A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.
摘要翻译：一种处理方法包括以下步骤：将工具与工件弹性变形，夹具已安装在工件上，将工件压靠在抛光表面上，并使工件和抛光表面相对于彼此移动。

39. 发明申请

US20080142492A1 Laser processing method, laser processing apparatus and spring arm manufacturing method 有权
标题翻译：激光加工方法，激光加工装置和弹簧臂制造方法
公开(公告)号：US20080142492A1
公开(公告)日：2008-06-19
申请号：US11974320
申请日：2007-10-12
申请人： Akihiko Ushimaru , Yoshiaki Yanagida , Koji Sudo
发明人： Akihiko Ushimaru , Yoshiaki Yanagida , Koji Sudo
IPC分类号： B23K26/02
CPC分类号： G11B5/4833 , Y10T29/49998
摘要： A laser processing method includes the steps of: preparing a long metal object to be irradiated; and irradiating the object with a laser beam at a certain portion in a longitudinal direction of the object. The irradiation is performed along a width direction of the object for both a first half path from one end to the other end of the object in the width direction and a return path from the other end to the one end so that the object can be bent.
摘要翻译：激光加工方法包括以下步骤：制备待照射的长金属物体; 并且在物体的纵向方向上的某一部分用激光束照射物体。沿着物体的宽度方向从物体的宽度方向的一端到另一端的第一半路径以及从另一端到一端的返回路径沿着物体的宽度方向进行照射，使得物体可以弯曲。

40. 发明授权

US07258151B2 Manufacturing method and apparatus for magnetic head sliders 失效
标题翻译：磁头滑块的制造方法和装置
公开(公告)号：US07258151B2
公开(公告)日：2007-08-21
申请号：US11415533
申请日：2006-05-02
申请人： Michinao Nomura , Yoshiaki Yanagida , Tomokazu Sugiyama
发明人： Michinao Nomura , Yoshiaki Yanagida , Tomokazu Sugiyama
IPC分类号： B32B38/04
CPC分类号： B24B37/048 , G11B5/1871 , G11B5/3103 , G11B5/3116 , G11B5/3166 , G11B5/3173 , Y10T29/4903 , Y10T29/49041 , Y10T29/49055 , Y10T156/1057 , Y10T156/1062 , Y10T156/1768 , Y10T156/1798
摘要： Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
摘要翻译：本文公开了一种方法，包括以下步骤：切割晶片以制备具有排列成矩阵的多个头元件的行块，将板构件接合到行块的一个侧表面，将行工具粘合到另一侧表面所述行块结合到所述板构件与所述一个侧表面相对，并且切割所述行块以制备结合到所述行工具并具有一排头元件的行杆。还公开了一种用于实现上述接合步骤的接合装置。

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