专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US08576027B2 Differential-common mode resonant filters 失效
标题翻译：差分共模滤波器
公开(公告)号：US08576027B2
公开(公告)日：2013-11-05
申请号：US12810200
申请日：2007-12-25
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H01P1/203 , H01P7/08
CPC分类号： H01P1/2088 , H01P7/065
摘要： A filter is provided with a multilayer board incorporating a resonator formed by two ground plates opposed to each other and conductive side walls connected to the ground plates; two signal vias provided through the resonator; and two terminals connected to the signal vias to receive a pair of signals. The resonator has a first face of symmetry vertical to the ground plates. The signal vias are disposed symmetrically with respect to the first face of symmetry on a distance from the first face of symmetry.
摘要翻译：滤波器设置有包括由彼此相对的两个接地板形成的谐振器和连接到接地板的导电侧壁的多层板; 通过谐振器提供两个信号通孔; 连接到信号通孔的两个端子接收一对信号。谐振器具有垂直于接地板的对称的第一面。信号通孔相对于第一对称面对称地设置在距第一对称面的距离处。

32. 发明授权

US08378762B2 Compact filtering structure 有权
标题翻译：紧凑型过滤结构
公开(公告)号：US08378762B2
公开(公告)日：2013-02-19
申请号：US12529382
申请日：2007-03-02
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H01P1/203
CPC分类号： H01P1/047 , H01P1/2005 , H01P1/203
摘要： An electromagnetic band gap (EGB) structure includes a substrate made of an isolating material. A plurality of identical planar transmission line segments are formed one under another in conductor layers embedded in the substrate. Vertical transitions connect one by one the plurality of planar transmission line segments. Adjacent ones of the vertical transitions are equally spaced on a predetermined distance in a direction parallel to the transmission line segments, thereby the vertical transitions serve as periodical inclusions forming the EBG structure.
摘要翻译：电磁带隙（EGB）结构包括由隔离材料制成的衬底。多个相同的平面传输线段在埋设在衬底中的导体层中彼此形成。垂直过渡连接多个平面传输线段一个接一个。相邻的垂直转变在平行于传输线段的方向上以预定的距离相等间隔，从而垂直转变用作形成EBG结构的周期性夹杂物。

33. 发明申请

US20100282503A1 MULTI-LAYER SUBSTRATE 有权
标题翻译：多层基板
公开(公告)号：US20100282503A1
公开(公告)日：2010-11-11
申请号：US12675678
申请日：2007-08-31
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K1/0219 , H05K1/0222 , H05K1/0245 , H05K1/116 , H05K3/429 , H05K2201/09236 , H05K2201/09454 , H05K2201/09618 , H05K2201/09636 , H05K2201/09718 , H05K2201/09781
摘要： A multi-layer substrate includes a planar transmission line structure and a signal via, which are connected by a multi-tier transition. The multi-tier transition includes a signal via pad configured to serve for a full-value connection of the signal via and the planar transmission line; and a dummy pad connected to the signal via, formed in an area of a clearance hole in a conductor layer disposed between a signal terminal of the signal via and the planar transmission line, and isolated from the conductor layer.
摘要翻译：多层基板包括通过多层转换连接的平面传输线结构和信号通孔。多层转换包括经配置以用于信号通孔和平面传输线的全值连接的信号通孔; 以及连接到信号通孔的虚拟焊盘，形成在设置在信号通孔的信号端子和平面传输线之间并与导体层隔离的导体层中的间隙孔的区域中。

你已经成功收藏专利！

检索式保存成功!

IPRDB