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31. 发明申请

US20070182061A1 Method of manufacturing support body for pneumatic run flat tire 审中-公开
标题翻译：制造气动平轮胎支撑体的方法
公开(公告)号：US20070182061A1
公开(公告)日：2007-08-09
申请号：US10567457
申请日：2004-08-06
申请人： Kazuya Hatakeyama , Eizaburo Oda , Yoichiro Kondo , Tatsuo Matsuo , Akio Minari
发明人： Kazuya Hatakeyama , Eizaburo Oda , Yoichiro Kondo , Tatsuo Matsuo , Akio Minari
IPC分类号： B60C17/06
CPC分类号： B29D30/0681 , B29D2030/0683 , B60C15/028 , B60C17/06 , Y10T29/49526
摘要： A manufacturing method of a support body for pneumatic run-flat tires, which can make the structures of a mold and a vulcanizer simpler. A metallic support portion has three parts including a center portion and outside portions of both sides. A rubber leg portion is vulcanized and formed so as to be integrated to the outside portion. The center portion and the outside portions are coupled by welding or the like. A mold to form and vulcanize the leg portion can therefore be made smaller. Moreover, since the left and right leg portions can be vulcanized and formed by a single mold, the structure of the mold is simpler.
摘要翻译：一种用于气动扁平轮胎的支撑体的制造方法，其可以使模具和硫化机的结构更简单。金属支撑部具有包括中心部分和两侧外侧部分的三部分。将橡胶脚部硫化并形成为与外侧部分一体化。中心部分和外侧部分通过焊接等联接。因此，可以使用于形成和硫化腿部的模具更小。此外，由于可以通过单个模具硫化和形成左右腿部，因此模具的结构更简单。

32. 发明申请

US20050222315A1 Cement for modification of rubber articles and process for production thereof 有权
标题翻译：用于改性橡胶制品的水泥及其生产方法
公开(公告)号：US20050222315A1
公开(公告)日：2005-10-06
申请号：US10503468
申请日：2003-02-05
申请人： Yoichiro Kondo
发明人： Yoichiro Kondo
IPC分类号： B29C73/16 , B60C1/00 , C08J3/22 , C08K3/22 , G01M1/32 , C08L1/00
CPC分类号： G01M1/326 , B29C73/163 , B29L2030/00 , B60C1/00 , C08J3/226 , C08J2421/00 , C08K3/22 , C08L23/22 , C08L21/00
摘要： A process for producing a cement for adjusting a rubber product comprising 100 parts by weight of a rubber component and 10 to 500 parts by weight of an inorganic filler. In the first mixing step, the rubber component and components for compounding are mixed while the amount of the inorganic filler is kept in the range of 0 to 20 parts by weight per 100 parts by weight of the rubber component. In the second mixing step, (1) the remaining amount of the inorganic filler is mixed using a closed mixing machine, or (2) a master batch of the inorganic filler and the rubber component is mixed in a solution. Since an inorganic filler having a great specific gravity can be mixed in a great amount, a cement containing a solid component having a great specific gravity and providing a coating film exhibiting improved resistance to heat degradation can be produced efficiently.
摘要翻译：一种用于生产用于调整橡胶制品的水泥的方法，包括100重量份的橡胶组分和10-500重量份的无机填料。在第一混合步骤中，混合橡胶组分和配混组分，同时将无机填料的量保持在每100重量份橡胶组分0至20重量份的范围内。在第二混合步骤中，（1）使用封闭混合机混合剩余量的无机填料，或者（2）无机填料的母料和橡胶组分混合在溶液中。由于可以大量地混合具有大比重的无机填料，因此可以有效地制造含有比重大的固体成分的水泥，并提供具有改善的耐热劣化性能的涂膜。

33. 发明授权

US06677670B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06677670B2
公开(公告)日：2004-01-13
申请号：US09843236
申请日：2001-04-25
申请人： Yoichiro Kondo
发明人： Yoichiro Kondo
IPC分类号： H01L2302
CPC分类号： H05K1/189 , H01L23/5387 , H01L24/01 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01322 , H01L2924/00012 , H01L2924/00
摘要： A flexible circuit substrate 11 has mounting regions 111, 112 and 113 on which electronic components 121, 122 and 123 are mounted, respectively. The flexible circuit substrate 11 is structured in such a manner that the mounting regions 111-113 are folded on top of the other over the base region 110 in a predetermined order (f1-f3). An integrated spacer 13 is superposed and affixed to the flexible circuit substrate and supports the electronic components 121-123 when the mounting regions 111-113 are folded on top of the other. The integrated spacer 13 has thick regions 131 and thin regions 132.
摘要翻译：柔性电路基板11具有分别安装有电子部件121,122,123的安装区域111,112,113。柔性电路基板11以使得安装区域111-113以预定顺序（f1-f3）在基部区域110上彼此折叠的方式构造。当安装区域111-113被折叠在另一个顶部时，集成间隔件13叠置并固定到柔性电路基板并且支撑电子部件121-123。集成间隔件13具有厚区域131和薄区域132。

34. 发明授权

US06469377B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06469377B1
公开(公告)日：2002-10-22
申请号：US09842938
申请日：2001-04-25
申请人： Yoichiro Kondo
发明人： Yoichiro Kondo
IPC分类号： H01L2302
CPC分类号： H01L23/5382 , H01L23/5387 , H01L25/0657 , H01L2224/16 , H01L2225/06575 , H01L2225/06579 , H01L2225/06586 , H05K1/189
摘要： To provide a semiconductor device with a three-dimensional mounting module using a flexible circuit substrate which is easy to assemble a three-dimensional structure and is excellent in the workability in repair work (or re-work). [MEANS FOR SOLUTION] A flexible circuit substrate 11 has mounting regions 111, 112 and 113 on which electronic components 121, 122 and 123 are mainly mounted, respectively, and other electronic components 124 and 125 are also mounted. The flexible circuit substrate 11 is structured in such a manner that the mounting regions 111˜113 are folded on top of the other over the base region 110 in a predetermined order (f1˜f3). An integrated spacer 13 has thick regions 131 and thin regions 132, and is superposed and affixed to the flexible circuit substrate 11 as indicated by arrows with broken lines, and supports the electronic components 121˜125 stacked in layers. Fixing bosses 134 and aperture sections 14 to be coupled therewith are provided to facilitate positioning.
摘要翻译：为了使半导体器件具有使用容易组装三维结构的柔性电路基板的三维安装模块，并且在维修工作（或重新加工）中的可操作性优异。[用于解决方案]柔性电路基板11具有安装区域111,112和113，其上主要安装有电子部件121,122和123，并且还安装了其他电子部件124和125。柔性电路基板11的结构使得安装区域111〜113以预定顺序（f1〜f3）折叠在基部区域110上。集成隔离物13具有厚区域131和薄区域132，并且如虚线箭头所示地叠置并固定到柔性电路基板11，并且支撑层叠的电子部件121〜125。固定凸台134和与其联接的孔部分14被提供以便于定位。

35. 发明申请

US20090284341A1 COIL UNIT AND ELECTRONIC APPARATUS USING THE SAME 有权
标题翻译：使用它的线圈单元和电子设备
公开(公告)号：US20090284341A1
公开(公告)日：2009-11-19
申请号：US12429781
申请日：2009-04-24
申请人： Hirofumi Okada , Yoichiro Kondo
发明人： Hirofumi Okada , Yoichiro Kondo
IPC分类号： H01F27/28
CPC分类号： H01F38/14 , H01F17/0006 , H01F2038/143 , H04B1/3883
摘要： A coil unit includes a coil formed by winding a coil wire, a wiring substrate, and a magnetic substance for receiving magnetic lines of force generated by the coil. The wiring substrate includes a connection terminal connected to both ends of the coil, an external connection terminal, and a wiring pattern for connecting the connection terminal and the external connection terminal. No circuit element other than the coil is mounted on the wiring substrate.
摘要翻译：线圈单元包括通过卷绕线圈形成的线圈，布线基板和用于接收由线圈产生的磁力线的磁性物质。布线基板包括连接到线圈两端的连接端子，外部连接端子和用于连接连接端子和外部连接端子的布线图案。除了线圈之外，没有电路元件安装在布线基板上。

36. 发明申请

US20070193327A1 Die and method for manufacturing core 有权
标题翻译：芯片的制造和制造方法
公开(公告)号：US20070193327A1
公开(公告)日：2007-08-23
申请号：US10599739
申请日：2005-03-29
申请人： Yoichiro Kondo , Hiroyuki Isoi
发明人： Yoichiro Kondo , Hiroyuki Isoi
IPC分类号： B21D31/00 , B21D9/05
CPC分类号： B29D30/0681 , B29C45/02 , B29C45/1459 , B29D2030/0683 , B29K2021/00 , B60C17/06
摘要： An object of the present invention is to provide a die and a method for manufacturing a core, wherein the core includes a ring-shaped supporting member 16 that is formed by a plate-like member, that is disposed inside a pneumatic tire, and that supports a pneumatic tire by allowing an inner side of a tread portion of the pneumatic tire to be brought into contact with an outer peripheral surface of the supporting member at the time of a deformation of the pneumatic tire due to a decrease of an internal pressure of the tire, and ring-shaped rubber portions that are joined respectively to both widthwise direction edge portions of the supporting member. A pressing machine 10 includes a ring-shaped core die 26 that is brought into contact with the supporting member 16 from a radial direction inner side thereof to support the supporting member 16 while maintaining a non-contact state with the both widthwise direction edge portions of the supporting member 16, and an upper intermediate die 28 and a lower intermediate die 30 that are disposed so as to hold the core die 26 therebetween from a widthwise direction of the core die 26 and that form cavities 42A and 42B for the rubber portions between the upper intermediate die 28 and the core die 26 as well as between the lower intermediate die 30 and the core die 26. The rubber material G contained in the pod portions 46A1, 46A2, 46B1 and 46B2 formed at the dies 28 and 30 are transferred from runners 44A1, 44A2, 44B1 and 44B2 into cavities 42A and 42B.
摘要翻译：本发明的目的在于提供一种芯体和芯的制造方法，其特征在于，所述芯部具有设置在充气轮胎内部的板状部件形成的环状的支撑部件16，通过使充气轮胎的胎面部的内侧在充气轮胎变形时与支撑部件的外周面接触而支撑充气轮胎，由于内部压力的降低轮胎和分别连接在支撑构件的宽度方向两边缘部分上的环状橡胶部分。压制机10包括从其径向内侧与支撑构件16接触的环状芯模26，以支撑支撑构件16，同时保持与两个宽度方向边缘部分的非接触状态支撑构件16，以及上部中间模具28和下部中间模具30，其被设置成在芯模26的宽度方向上保持芯模26，并且形成用于橡胶的空腔42A和42B 上部中间模具28和芯体模具26之间以及下部中间模具30和芯模具26之间的部分。在模具28和30上形成的荚状部分46A 1，46 A 2，46 B 1和46 B 2中包含的橡胶材料G从流道44A 1，44 A 2，44 B 1和44 B 2 进入腔42A和42B。

37. 发明授权

US06469903B1 Flexible printed circuit and semiconductor device 失效
标题翻译：柔性印刷电路和半导体器件
公开(公告)号：US06469903B1
公开(公告)日：2002-10-22
申请号：US09678474
申请日：2000-10-02
申请人： Yoichiro Kondo
发明人： Yoichiro Kondo
IPC分类号： H05K114
CPC分类号： H05K1/189 , H01L23/5387 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device of the present invention comprises a flexible printed circuit having a first area part located in the center thereof, a second area part provided continuous thereto, and a third area part provided continuous to the first area part; a wiring pattern formed on a surface of the above-described flexible printed circuit; a semiconductor element mounted on a surface of the second area part; and a second semiconductor element mounted on a surface of the third area part, wherein the second area part is folded to a face side of a center area part, and the third area part is folded to a rear side of the second area part.
摘要翻译：本发明的半导体器件包括具有位于其中心的第一区域部分的柔性印刷电路，与其连续设置的第二区域部分和与第一区域部分连续设置的第三区域部分; 形成在上述柔性印刷电路的表面上的布线图案; 安装在所述第二区域部分的表面上的半导体元件; 以及安装在所述第三区域部分的表面上的第二半导体元件，其中所述第二区域部分被折叠到中心区域部分的正面，并且所述第三区域部分被折叠到所述第二区域部分的后侧。

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