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31. 发明申请

US20140105244A1 TEMPERATURE BAND OPERATION LOGGING 有权
标题翻译：温度条操作记录
公开(公告)号：US20140105244A1
公开(公告)日：2014-04-17
申请号：US14125739
申请日：2011-06-27
申请人： David A Moore , Scott P. Faasse , Jeffrey A. Plank , Tahir Cader
发明人： David A Moore , Scott P. Faasse , Jeffrey A. Plank , Tahir Cader
IPC分类号： G01K3/04
CPC分类号： G01K3/04 , G06F1/206 , H05K7/20836
摘要： In a system, temperature measurements are logged. From the logged measurements, duration of operation of the system in each of a plurality of temperature bands is determined.
摘要翻译：在系统中，记录温度测量。从记录的测量中，确定在多个温度带中的每一个中的系统的操作持续时间。

32. 发明申请

US20080123297A1 Hybrid clamshell blade system 审中-公开
标题翻译：混合蛤壳系统
公开(公告)号：US20080123297A1
公开(公告)日：2008-05-29
申请号：US11803750
申请日：2007-05-15
申请人： Donald E. Tilton , Tahir Cader , Eric Grabowski , Ryan J. Baddeley , P. Harley Park , Peter Mohr , Benjamin H. Tolman , Norman O. Alder
发明人： Donald E. Tilton , Tahir Cader , Eric Grabowski , Ryan J. Baddeley , P. Harley Park , Peter Mohr , Benjamin H. Tolman , Norman O. Alder
IPC分类号： H05K7/20 , F25D23/12
CPC分类号： H05K7/20345 , H05K7/20545
摘要： A hybrid clamshell system encapsulates two of the six sides of an electronic circuit board to provide a high heat density solution and environmental protection. The clamshell enclosures seal to both sides of the PCB and contain fluid shut-off couplings. A two-phase cooling system directs a coolant via a supply path located in the sidewall of the enclosure to one or more cooling modules and collects the coolant via a return path within the enclosure. With the addition of an inject/eject mechanism attached to the clamshell, the fully assembled blade can be “fluid hot-swapped” in and out of the chassis with negligible loss of coolant. The interrelation of the clamshell module and it's implementation in an exemplary system are detailed herein.
摘要翻译：混合蛤壳系统封装了电子电路板的六面中的两个，以提供高热密度解决方案和环境保护。蛤壳式外壳密封到PCB的两侧，并包含流体切断联轴器。两相冷却系统通过位于外壳侧壁的供应路径将冷却剂引导到一个或多个冷却模块，并通过外壳内的返回路径收集冷却剂。通过添加连接到蛤壳的注射/排出机构，完全组装的叶片可以以低于冷却剂的可忽略的损失被“流体热交换”进入和离开底盘。蛤壳式模块与其在示例性系统中的实现的相互关系在此详细描述。

33. 发明授权

US07102374B2 Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis 失效
公开(公告)号：US07102374B2
公开(公告)日：2006-09-05
申请号：US10222107
申请日：2002-08-16
申请人： Tahir Cader , Charles Lester Tilton , Benjamin Hewett Tolman , George Joseph Wos , Alan Brent Roberts , Thomas Wong , Jonathan D. Frank
发明人： Tahir Cader , Charles Lester Tilton , Benjamin Hewett Tolman , George Joseph Wos , Alan Brent Roberts , Thomas Wong , Jonathan D. Frank
IPC分类号： G01R31/28 , H01K7/20
CPC分类号： G01R1/0458 , G01R31/2891
摘要： A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.

34. 发明授权

US06996996B1 Sealed spray cooling system 有权
标题翻译：密封喷雾冷却系统
公开(公告)号：US06996996B1
公开(公告)日：2006-02-14
申请号：US10406785
申请日：2003-04-02
申请人： Tahir Cader
发明人： Tahir Cader
IPC分类号： F25D17/02 , F25D23/12 , B05B1/24 , H01L23/34
CPC分类号： H01L23/4735 , H01L2224/32 , H01L2924/16152
摘要： A sealed spray cooling system for reducing coolant loss within thermal management systems. The sealed spray cooling system includes a spray housing defining a spray chamber having at least one atomizer and a seal member attached to the spray housing about the spray chamber for sealing against a semiconductor forming a sealed spray area. Alternatively, the spray unit is comprised of a first member, a second member having at least one atomizer, the second member pivotally attached to the first member forming an interior cavity between thereof, and a seal member attached to the second member for sealing against a semiconductor within the first member thereby forming a sealed spray area. A vacuum manifold is preferably fluidly connected to the spray cavity thereby reducing the pressure within the spray cavity.
摘要翻译：密封式喷雾冷却系统，用于减少散热管理系统内的冷却液流失。密封喷雾冷却系统包括喷射壳体，其限定具有至少一个雾化器的喷雾室和围绕喷雾室连接到喷雾室的密封构件，用于密封形成密封喷射区域的半导体。或者，喷雾单元由第一构件，具有至少一个雾化器的第二构件组成，第二构件枢转地附接到形成其间的内部空腔的第一构件和附接到第二构件的密封构件，用于密封半导体内形成密封的喷射区域。真空歧管优选地流体地连接到喷雾腔，从而减小喷雾腔内的压力。

35. 发明申请

US20050183844A1 Hotspot spray cooling 审中-公开
标题翻译：热点喷雾冷却
公开(公告)号：US20050183844A1
公开(公告)日：2005-08-25
申请号：US10786452
申请日：2004-02-24
申请人： Charles Tilton , Donald Tilton , Thomas Weir , Tahir Cader , Paul Knight
发明人： Charles Tilton , Donald Tilton , Thomas Weir , Tahir Cader , Paul Knight
IPC分类号： F28D15/02 , F28F7/00 , H01L23/473
CPC分类号： F28D15/0266 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the chip that generate large heat fluxes, typically referred to as the core, the liquid coolant is dispensed as a continuous atomized droplet pattern. The atomized pattern creates a high heat flux evaporative cooling thin-film over the one or more core areas. Rather than optimize the atomized pattern and flow based upon complete thin-film vaporization, the present invention optimizes the atomized pattern for maximum heat removal rates. Any excess, non-vaporized, fluid flowing outward from the hotspot is used to cool the lower heat flux (non-core) areas of the component through the creation of a thick coolant film thereon.
摘要翻译：本发明是喷雾冷却热管理装置，其冷却电子部件，从而在其表面上产生变化的热量。液体冷却剂分配在部件的表面上。在芯片的产生大量热通量的区域（通常被称为核心）中，液体冷却剂作为连续的雾化液滴图案被分配。雾化图案在一个或多个核心区域上形成高热通量蒸发冷却薄膜。基于完全薄膜蒸发而不是优化雾化图案和流动，本发明优化雾化图案以获得最大的除热速率。从热点向外流动的任何多余的非汽化流体用于通过在其上形成厚的冷却剂膜来冷却部件的下部热通量（非核心）区域。

36. 发明授权

US5898353A Magnetic fluid cooler transformer 失效
标题翻译：磁流体冷却变压器
公开(公告)号：US5898353A
公开(公告)日：1999-04-27
申请号：US876851
申请日：1997-06-17
申请人： Tahir Cader , Samuel Bernstein , Clayton Crowe
发明人： Tahir Cader , Samuel Bernstein , Clayton Crowe
IPC分类号： H01F27/02 , H01F27/10 , H01F27/08
CPC分类号： H01F27/10 , H01F27/025
摘要： Convective cooling of a distribution transformer is enhanced by use of magnetic fluid which has a magnetically driven flow pattern in the form of a plurality of vertically stacked magnetic circulation cells with convective heat transfer being enhanced by modifying the configuration of a proximate transformer wall to facilitate the transfer of heat from the magnetic fluid to the wall and then to the ambient air.
摘要翻译：配电变压器的对流冷却通过使用具有多个垂直堆叠的磁性循环电池形式的磁力驱动的流动模式的磁性流体增强，其中对流传热通过改变邻近的变压器壁的构造来增强，以便于将热从磁性流体传递到壁，然后传递到环境空气。

37. 发明授权

US09529395B2 Liquid temperature control cooling 有权
标题翻译：液体温度控制冷却
公开(公告)号：US09529395B2
公开(公告)日：2016-12-27
申请号：US14376138
申请日：2012-03-12
申请人： John P. Franz , Michael L. Sabotta , Tahir Cader , David A. Moore
发明人： John P. Franz , Michael L. Sabotta , Tahir Cader , David A. Moore
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02
CPC分类号： G06F1/20 , F28D15/0275 , G06F1/206 , H05K7/20772 , H05K7/20781
摘要： Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack (100, 200a, 200b) can include a number of electronic devices (102, 202) in the electronics rack (100, 200a, 200b), a panel (108-1, 108-2, 208-1, 224-1, 224-2) that extends from a roof (226) to a floor (228) inside the electronics rack (100, 200a, 200b), where a face of the panel (108-1, 108-2, 208-1, 224-1, 224-2) is parallel to a direction in which the number of electronic devices (100, 200a, 200b) slide into the electronics rack (100, 200a, 200b) and perpendicular to a front of the electronics rack, and a heat receiving structure (112, 212, 312, 412) that is integrated into the panel (108-1, 108-2, 208-1, 224-1, 224-2) and that is thermally coupled to the number of electronic devices (102, 202) through the panel (108-1, 108-2, 208-1, 224-1, 224-2), where the heat receiving structure (112, 212, 312, 412) can include a liquid flow compartment (330, 442) an input (216, 316, 416) to receive cool liquid into the liquid flow compartment (330, 442), and a control valve (214, 314, 414-1, 414-2, 414-3, 414-4) to release warm liquid from the liquid flow compartment (330, 442).
摘要翻译：本公开的实例可以包括用于液体温度控制冷却的方法和系统。用于电子机架（100,200a，200b）的液体温度控制冷却系统的示例可以包括电子机架（100,200a，200b）中的多个电子设备（102,202），面板（108-1 ，108-2,208-1,224-1,224-2），其从所述电子机架（100,200a，200b）内部的屋顶（226）延伸到地板（228），其中所述面板 108-1,108-2,208-1,224-1,224-2）平行于电子设备（100,200a，200b）的数量滑入电子机架（100,200a，200b）的方向）和垂直于所述电子机架的前部的热接收结构（112,212,312,412），其被集成到所述面板（108-1,108-2,208-1,224-1,224-212）中， 2），并且其通过面板（108-1,108-2,208-1,224-1,224-2）热耦合到电子设备（102,202）的数量，其中热接收结构（112），212,312,412）可以包括液体流动隔室（330,442），输入端（216,316,416）以将冷却液体接收到液体流动室（330,442）和用于从液体流动室（330,442）释放温热液体的控制阀（214,314,414-1,414-2,414-3,414-4）。

38. 发明申请

US20150192316A1 MANAGEMENT OF AIRFLOW PROVISIONING TO MEET A COOLING INFLUENCE REDUNDANCY LEVEL 审中-公开
标题翻译：空气流量管理满足冷却影响的冗余水平
公开(公告)号：US20150192316A1
公开(公告)日：2015-07-09
申请号：US14408673
申请日：2012-07-06
申请人： Rongliang Zhou , Cullen E. Base , Tahir Cader , Zhiki Wang
发明人： Rongliang Zhou , Cullen E. Base , Tahir Cader , Zhiki Wang
IPC分类号： F24F11/00 , G05B15/02
CPC分类号： G05B15/02 , F24F11/30 , F24F11/62 , G06F1/206 , H05K7/20836
摘要： In an implementation, airflow provisioning in an area by a plurality of fluid moving devices is managed through assignment of the fluid moving devices to monitor and regulate conditions at respective subsets of a plurality of locations based upon determined influence levels of the fluid moving devices on the respective locations to meet a predefined cooling influence redundancy level. The predefined cooling influence redundancy level for a particular location identifies a number of the fluid moving devices that are to monitor and regulate a condition at the particular location.
摘要翻译：在一个实施方案中，通过分配流体移动装置来管理在多个流体移动装置的区域中的气流供应，以基于所确定的流体移动装置的影响水平来监测和调节多个位置的各个子集的条件各个位置以满足预定义的冷却影响冗余级别。特定位置的预定义的冷却影响冗余级别识别要监视和调节特定位置处的状况的流体移动装置的数量。

39. 发明申请

US20150003009A1 RACK COOLING SYSTEM WITH A COOLING SECTION 审中-公开
标题翻译：具有冷却段的机架冷却系统
公开(公告)号：US20150003009A1
公开(公告)日：2015-01-01
申请号：US14376137
申请日：2012-03-12
申请人： David A. Moore , Michael L. Sabotta , John P. Franz , Tahir Cader
发明人： David A. Moore , Michael L. Sabotta , John P. Franz , Tahir Cader
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20736 , G06F1/20 , H05K7/20754 , H05K7/20781
摘要： Examples of the present disclosure may include methods and systems for cooling electronic components housed in a rack. An example system for cooling a rack may include a frame (100, 200a, 200b, 200c, 300a, 300b, 300c, 450, 452, 454) including a number of dividers (108-1, 208-1, 308-1, 408-1) internal to the rack that define a plurality of sections (104, 106, 112, 204, 206, 212, 304, 306, 312, 404-1, 404-2, 406-1, 406-2, 412-1, 412-2) within the rack. Moreover, an example system for cooling electronic components housed in a rack may further include a number of electronics sections (104, 106, 204, 206, 304, 306, 404-1, 404-2, 406-1, 406-2, 412-2) including at least a first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414), and a number of cooling sections (112, 212, 312, 412-1) including at least a first cooling system (102, 202, 402) that cools at least the first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414) via heat transfer through the number of dividers(108-1, 208-1, 308-1, 408-1).
摘要翻译：本公开的示例可以包括用于冷却容纳在机架中的电子部件的方法和系统。用于冷却机架的示例性系统可以包括包括多个分配器（108-1,208-1,308-1,40）的框架（100,200a，200b，200c，300a，300b，300c，450,452,454）（104,106,112,204,206,212,304,306,312,404-1,404-2,406-1,406-2,412）的所述机架内部定位多个部分 -1,412-2）。此外，用于冷却容纳在机架中的电子部件的示例性系统还可以包括多个电子部分（104,106,204,206,304,306,404-1,404-2,406-1,406-2，包括至少第一数量的电子部件（114-1,114-2,214-1,214-2,214-3,214-4,214-5,214-6,214-7，包括至少冷却至少第一冷却系统（102,202,402）的冷却部分（112,212,312,412-1）第一数量的电子部件（114-1,114-2,214-1,214-2,214-3,214-4,214-5,214-6,214-7,214-8,314-1），314-2,414），经由分配器（108-1,208-1,308-1,408-1）的数量的热传递。

40. 发明申请

US20130174597A1 ADIABATIC COOLING UNIT 有权
标题翻译： ADIABATIC冷却单元
公开(公告)号：US20130174597A1
公开(公告)日：2013-07-11
申请号：US13347958
申请日：2012-01-11
申请人： Tahir Cader , Ernesto Ferrer , Matthew R. Slaby , Wade D. Vinson
发明人： Tahir Cader , Ernesto Ferrer , Matthew R. Slaby , Wade D. Vinson
IPC分类号： F25B13/00
CPC分类号： F24F13/04 , F24F11/84 , F24F13/08 , F24F13/15 , F24F2013/221 , H05K7/20145 , H05K7/20745 , Y02B30/542 , Y10T137/0318
摘要： Mixing gases within an adiabatic cooling unit can include allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. Mixing gases within an adiabatic cooling unit can also include allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. Furthermore, mixing gases within an adiabatic cooling unit can include creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.
摘要翻译：绝热冷却单元内的混合气体可包括允许第一温度下的第一气体进入绝热冷却介质的未暴露侧的混合室，并利用第一挡板将第一气体沿远离绝热的方向引导冷却介质。绝热冷却单元内的混合气体还可以包括允许在第二温度下的第二气体进入绝热冷却介质的暴露侧上的混合室，并允许第一气体和第二气体在混合室中混合，形成混合加油站。此外，在绝热冷却单元内混合气体可包括产生具有第一挡板的入口和第二挡板以将混合气体引导离开绝热冷却介质并允许混合气体通过绝热冷却介质的暴露侧进入。

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