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31. 发明申请

US20100140782A1 PRINTED CIRCUIT BOARD HAVING BUILT-IN INTEGRATED CIRCUIT PACKAGE AND FABRICATION METHOD THEREFOR 有权
标题翻译：具有内置集成电路封装的印刷电路板及其制造方法
公开(公告)号：US20100140782A1
公开(公告)日：2010-06-10
申请号：US12633433
申请日：2009-12-08
申请人： Sang-Hyun Kim , Shi-Yun Cho , Young-Min Lee , Kyu-sub Kwak , Youn-Ho Choi
发明人： Sang-Hyun Kim , Shi-Yun Cho , Young-Min Lee , Kyu-sub Kwak , Youn-Ho Choi
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H05K1/188 , H01L23/5383 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K3/4602 , H05K3/4652 , H05K2201/0355 , H05K2201/10674 , H05K2203/0554
摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.
摘要翻译：提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。导电凸块通过形成在接触孔中的导体层电连接。

32. 发明申请

US20090308074A1 APPARATUS FOR GENERATING ENERGY USING A SENSIBLE HEAT DURING MANUFACTURING OF MOLTEN IRON AND METHOD FOR GENERATING ENERGY USING THE SAME 有权
标题翻译：用于在制造钢铁时使用敏感热量产生能量的装置和使用其产生能量的方法
公开(公告)号：US20090308074A1
公开(公告)日：2009-12-17
申请号：US12519739
申请日：2007-12-17
申请人： Myoung-Kyun Shin , Sang-Hyun Kim , Min-Chul Park , Sang-Hoon Joo , Robert Millner
发明人： Myoung-Kyun Shin , Sang-Hyun Kim , Min-Chul Park , Sang-Hoon Joo , Robert Millner
IPC分类号： F01K13/00 , F01K9/00 , F04B17/00 , F01K3/00
CPC分类号： C21B13/143 , C21B13/002 , C21B2100/44 , C21B2100/62 , C21C2100/06
摘要： An apparatus for generating energy using sensible heat of an offgas during manufacture of molten iron and a method for generating energy using the same are provided. The method for generating energy includes i) providing an offgas discharged from an apparatus for manufacturing molten iron including a reduction reactor that provides reduced iron that is reduced from iron ore and a melter-gasifier that melts the reduced iron to manufacture molten iron; ii) converting cooling water into high pressure steam by contacting the cooling water with the offgas; and iii) generating energy from at least one steam turbine by supplying the high pressure steam to the steam turbine and rotating the steam turbine.
摘要翻译：提供一种在制造铁水期间利用排气的显热产生能量的装置以及使用该装置产生能量的方法。用于产生能量的方法包括：i）提供从用于制造铁水的设备排出的废气，其包括还原反应器，所述还原反应器提供从铁矿石还原的还原铁和熔化还原铁来制造铁水的熔炉 - 气化器; ii）通过使冷却水与废气接触将冷却水转化成高压蒸汽; 以及iii）通过将高压蒸汽供应到所述蒸汽涡轮机并且旋转所述蒸汽轮机来从至少一个蒸汽轮机产生能量。

33. 发明授权

US07488612B2 Liquid crystal display device and fabricating method thereof 有权
标题翻译：液晶显示装置及其制造方法
公开(公告)号：US07488612B2
公开(公告)日：2009-02-10
申请号：US11907945
申请日：2007-10-18
申请人： Joon-Young Yang , Yong-In Park , Sang-Hyun Kim
发明人： Joon-Young Yang , Yong-In Park , Sang-Hyun Kim
IPC分类号： H01L21/00
CPC分类号： G02F1/1368 , G02F2001/13629
摘要： A method for fabricating a liquid crystal display (LCD) device comprises forming an active pattern and a data line on a substrate, the active pattern including a source, a drain, and a channel regions; a first insulation film on a portion of the substrate; forming a gate electrode in a portion of the active pattern where the first insulation film is formed; a second insulation film on the substrate; forming a plurality of first contact holes exposing a portion of the source and drain regions and a second contact hole exposing a portion of the data line; forming a source electrode from a transparent conductive material connected to a source region within the respective first contact hole and a data line within the second contact hole; and forming a pixel and a drain electrodes from the transparent conductive material connected to a drain region within the respective first contact hole.
摘要翻译：一种用于制造液晶显示器（LCD）器件的方法，包括在衬底上形成有源图案和数据线，所述有源图案包括源极，漏极和沟道区域; 在所述基板的一部分上的第一绝缘膜; 在形成第一绝缘膜的有源图案的一部分中形成栅电极; 基板上的第二绝缘膜; 形成暴露所述源极和漏极区域的一部分的多个第一接触孔和暴露所述数据线的一部分的第二接触孔; 从连接到相应的第一接触孔内的源极区域的透明导电材料和第二接触孔内的数据线形成源电极; 以及从连接到相应的第一接触孔内的漏极区域的透明导电材料形成像素和漏电极。

34. 发明申请

US20090031351A1 Apparatus and Method for Setting Broadcasting Program as a Background Image, and Portable Device Using the Same 审中-公开
标题翻译：将广播节目设置为背景图像的装置和方法，以及使用其的便携式设备
公开(公告)号：US20090031351A1
公开(公告)日：2009-01-29
申请号：US12224431
申请日：2007-02-20
申请人： Sang-Hyun Kim
发明人： Sang-Hyun Kim
IPC分类号： H04N5/445
CPC分类号： H04N21/443 , H04N21/41407 , H04N21/42653 , H04N21/4312 , H04N21/4314 , H04N21/4854
摘要： A method of providing a background image in a portable device includes extracting broadcasting signals of broad-casting channels in a given order on the basis of a background image setting information, and displaying broadcasting images corresponding to the broadcasting signals as the background image on corresponding displaying areas of the portable device. In the method, broadcasting image(s) of predetermined broadcasting channels are used as the background image of the portable device, and thus a moving image as well as a still image may be set as the background image of the portable device.
摘要翻译：一种在便携式设备中提供背景图像的方法包括：基于背景图像设置信息以给定的顺序提取广播信道的广播信号，并且在相应的显示上显示与广播信号相对应的广播图像作为背景图像便携式设备的区域。在该方法中，使用预定广播频道的广播图像作为便携式设备的背景图像，因此可以将运动图像和静止图像设置为便携式设备的背景图像。

35. 发明申请

US20080143257A1 Plasma display panel 审中-公开
标题翻译：等离子显示面板
公开(公告)号：US20080143257A1
公开(公告)日：2008-06-19
申请号：US12000628
申请日：2007-12-14
申请人： Young-Gil Yoo , Sang-Hyun Kim
发明人： Young-Gil Yoo , Sang-Hyun Kim
IPC分类号： H01J17/49
CPC分类号： H01J11/42 , C09K11/7734 , H01J11/12
摘要： A plasma display panel (PDP) includes front and rear substrates spaced apart and facing each other, barrier ribs between the front and rear substrates to define a plurality of discharge cells, a plurality of electrodes between the front and rear substrates to generate a discharge, a light transmitting layer including a blue pigment, and at least one blue phosphor layer in the discharge cells, the phosphor layer including a phosphor material represented by Ba1-x-ySryMgpAlqOr:Eux, where 0.001≦x≦0.1, 0.021≦y≦0.3, p=1, q=10 or 14, and r=17 or 23.
摘要翻译：等离子体显示面板（PDP）包括间隔开并且彼此面对的前基板和后基板，前基板和后基板之间的阻挡肋限定多个放电单元，在前基板和后基板之间形成多个电极以产生放电，包括蓝色颜料的透光层和放电单元中的至少一个蓝色荧光体层，所述荧光体层包括由Ba 1-xy Sr y y表示的荧光体材料， Eu x，其中0.001 <= x <= 0.1,0.021 y = 0.3，p = 1，q = 10或14，r = 17或23。

36. 发明申请

US20080073797A1 Semiconductor die module and package and fabricating method of semiconductor package 审中-公开
标题翻译：半导体芯片模块及半导体封装的制造方法
公开(公告)号：US20080073797A1
公开(公告)日：2008-03-27
申请号：US11899902
申请日：2007-09-06
申请人： Sang-Hyun Kim , Shi-Yun Cho , Ho-Seong Seo , Youn-Ho Choi
发明人： Sang-Hyun Kim , Shi-Yun Cho , Ho-Seong Seo , Youn-Ho Choi
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0657 , H01L2224/24227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01033 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： A semiconductor die module, a semiconductor package, and a fabrication method of the semiconductor package. A method for manufacturing a semiconductor package includes the steps of: preparing a printed circuit board in which a hole is formed to extend through a core, and an insulation layer and a circuit pattern are formed on a surface of the core, the printed circuit board having an open surface; forming conductive bumpers on some of the electric pads of each semiconductor die; forming a semiconductor die module in which the electric pads of each semiconductor die are connected to one another; inserting the semiconductor die module into the hole of the core so as to safely seat the semiconductor die module on the insulation layer and the circuit pattern; and forming the insulation layer and the circuit patterns on an open upper surface of the core.
摘要翻译：半导体管芯模块，半导体封装以及半导体封装的制造方法。一种制造半导体封装的方法包括以下步骤：制备其中形成有孔的印刷电路板延伸穿过芯，并且在芯的表面上形成绝缘层和电路图案，印刷电路板具有开放的表面; 在每个半导体管芯的一些电焊盘上形成导电缓冲器; 形成其中每个半导体管芯的电焊盘彼此连接的半导体管芯模块; 将半导体模具模块插入芯的孔中，以便将半导体管芯模块安全地安置在绝缘层和电路图案上; 以及在所述芯的开放的上表面上形成所述绝缘层和所述电路图案。

37. 发明申请

US20080073771A1 Semiconductor package and semiconductor system in package using the same 有权
标题翻译：半导体封装和半导体系统封装使用相同
公开(公告)号：US20080073771A1
公开(公告)日：2008-03-27
申请号：US11894338
申请日：2007-08-21
申请人： Ho-Seong Seo , Shi-Yun Cho , Young-Min Lee , Sang-Hyun Kim
发明人： Ho-Seong Seo , Shi-Yun Cho , Young-Min Lee , Sang-Hyun Kim
IPC分类号： H01L23/48 , H01L21/02 , H01L23/02
CPC分类号： H01L25/105 , H01L21/56 , H01L23/3128 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2224/83101 , H01L2224/83851 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00012 , H01L2224/29075 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are a semiconductor package and semiconductor system in package using the same. The semiconductor package includes: a printed circuit board (PCB); a semiconductor die disposed on the PCB and having conductive posts formed on an upper surface of the semiconductor die; and a molding formed on the PCB to cover the semiconductor die, wherein the conductive posts have a surface exposed out of an upper surface of the molding. The semiconductor system in package includes: a first semiconductor package having a semiconductor die on which conductive posts are formed, and a molding formed so that upper surfaces of the conductive posts are exposed; and a second semiconductor package disposed on the first semiconductor package and electrically connected to the conductive posts.
摘要翻译：公开了使用其的半导体封装和封装的半导体系统。半导体封装包括：印刷电路板（PCB）; 半导体管芯，其设置在所述PCB上并具有形成在所述半导体管芯的上表面上的导电柱; 以及形成在PCB上以覆盖半导体管芯的模制件，其中导电柱具有从模制件的上表面露出的表面。封装中的半导体系统包括：第一半导体封装，其具有形成有导电柱的半导体管芯，以及形成为使得导电柱的上表面露出的模制件; 以及第二半导体封装，其设置在所述第一半导体封装上并电连接到所述导电柱。

38. 发明申请

US20080061404A1 Electronic circuit package and fabricating method thereof 审中-公开
标题翻译：电子电路封装及其制造方法
公开(公告)号：US20080061404A1
公开(公告)日：2008-03-13
申请号：US11895430
申请日：2007-08-24
申请人： Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi , Ho-Seong Seo , Sang-Hyun Kim
发明人： Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi , Ho-Seong Seo , Sang-Hyun Kim
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L23/552 , H01L23/3121 , H01L23/66 , H01L24/48 , H01L25/165 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： An electronic circuit package and fabricating method thereof. The method includes: integrating a radio frequency circuit device and a semiconductor die on a printed circuit board; forming a bumper pad of metal on the printed circuit board around the radio frequency circuit device; forming a molding on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; and forming one or more grooves on a portion of the molding and inserting a can into the grooves. The electronic circuit package includes: a printed circuit board; a radio frequency circuit device and a semiconductor die integrated on the printed circuit board; a molding formed on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; one or more grooves formed in the molding to enclose the radio frequency circuit device; and a can inserted into the grooves.
摘要翻译：一种电子电路封装及其制造方法。该方法包括：在印刷电路板上集成射频电路器件和半导体管芯; 在射频电路装置周围的印刷电路板上形成金属缓冲垫; 在所述印刷电路板上形成模具，以将所述射频电路器件和所述半导体管芯包括在其中; 以及在所述模制件的一部分上形成一个或多个凹槽并将罐插入所述槽中。电子电路封装包括：印刷电路板; 集成在印刷电路板上的射频电路器件和半导体管芯; 在印刷电路板上形成的包括射频电路器件和半导体管芯的模制件; 在模制件中形成的一个或多个凹槽以封闭射频电路装置; 并且可以插入槽中的罐。

39. 发明授权

US07316248B2 Apparatus and method of dispensing liquid crystal 失效
标题翻译：分配液晶的装置和方法
公开(公告)号：US07316248B2
公开(公告)日：2008-01-08
申请号：US10988834
申请日：2004-11-16
申请人： Jae-Gyu Jeong , Sang-Hyun Kim , Soo-Min Kwak , Yong-Keun Kwak
发明人： Jae-Gyu Jeong , Sang-Hyun Kim , Soo-Min Kwak , Yong-Keun Kwak
IPC分类号： B65B1/04
CPC分类号： B05B12/02 , B05B1/02 , B05B15/52 , B05B15/555 , G02F1/1341 , G02F2001/13415
摘要： A liquid crystal dispensing apparatus includes a container containing liquid crystal material; a discharge pump drawing in and discharging the liquid crystal material; a nozzle dispensing, onto a substrate, liquid crystal material discharged by the discharge pump; and a detector arranged near the nozzle to detect the presence of residual liquid crystal material accumulated on the surface of the nozzle. When the presence of residual liquid crystal material is detected, a dummy dispensing operation and/or a cleaning operation may be performed to remove the residual liquid crystal material.
摘要翻译：液晶分配装置包括容纳液晶材料的容器; 排出液体材料的排出泵; 在基板上喷射由排出泵排出的液晶材料的喷嘴; 以及设置在喷嘴附近的检测器，用于检测在喷嘴表面上积存的剩余液晶材料的存在。当检测到残留液晶材料的存在时，可以进行虚拟分配操作和/或清洁操作以去除残留的液晶材料。

40. 发明申请

US20060264238A1 Cradle for portable communication device 审中-公开
标题翻译：摇篮用于便携式通信设备
公开(公告)号：US20060264238A1
公开(公告)日：2006-11-23
申请号：US11437062
申请日：2006-05-19
申请人： Gyoo-Hong Jung , Sang-Hyun Kim
发明人： Gyoo-Hong Jung , Sang-Hyun Kim
IPC分类号： H04B1/38 , H04M1/00
CPC分类号： B60R11/02 , B60R11/0241 , B60R11/0252 , B60R2011/0056 , F16B47/006
摘要： Disclosed is a cradle for a portable communication device in which a sticking prevention member is provided between a support member and an absorption plate. The cradle includes a support member; an absorption plate engaged with a lower portion of the support member; a pressing lever provided at an upper portion of the support member and pressing against the absorption plate to move the support member as the pressing lever is rotated about a hinge axis; a rotation means providing the hinge axis and rotatably engaging the pressing lever with the absorption plate; and a sticking prevention member provided between the support member and the absorption plate, for preventing the support member and the absorption plate from sticking to each other when the support member and the absorption plate are pressed together.
摘要翻译：公开了一种用于便携式通信装置的支架，其中在支撑构件和吸收板之间设置防粘接构件。支架包括支撑构件; 吸收板，其与所述支撑构件的下部接合; 设置在所述支撑构件的上部的按压杆，并且随着所述按压杆围绕铰链轴线旋转而按压所述吸收板以移动所述支撑构件; 旋转装置提供铰链轴线并将压力杆与吸收板可旋转地接合; 以及设置在所述支撑构件和所述吸收板之间的防粘部件，用于当所述支撑构件和所述吸收板被压在一起时，用于防止所述支撑构件和所述吸收板彼此粘合。

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