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    • 31. 发明授权
    • Methods of forming fine patterns in the fabrication of semiconductor devices
    • 在半导体器件的制造中形成精细图案的方法
    • US08686563B2
    • 2014-04-01
    • US12639542
    • 2009-12-16
    • Sang-Yong ParkJae-Hwang SimYoung-Ho LeeKyung-Lyul MoonJae-Kwan Park
    • Sang-Yong ParkJae-Hwang SimYoung-Ho LeeKyung-Lyul MoonJae-Kwan Park
    • H01L23/48H01L23/52
    • H01L23/528H01L21/0337H01L21/0338H01L21/32139H01L21/76838H01L21/823456H01L27/115H01L2924/0002H01L2924/00
    • In a method of forming a semiconductor device, a feature layer is provided on a substrate and a mask layer is provided on the feature layer. A portion of the mask layer is removed in a first region of the semiconductor device where fine features of the feature layer are to be located, the mask layer remaining in a second region of the semiconductor device where broad features of the feature layer are to be located. A mold mask pattern is provided on the feature layer in the first region and on the mask layer in the second region. A spacer layer is provided on the mold mask pattern in the first region and in the second region. An etching process is performed to etch the spacer layer so that spacers remain at sidewalls of pattern features of the mold mask pattern, and to etch the mask layer in the second region to provide mask layer patterns in the second region. The feature layer is etched using the mask layer patterns as an etch mask in the second region and using the spacers as an etch mask in the first region to provide a feature layer pattern having fine features in the first region and broad features in the second region.
    • 在形成半导体器件的方法中,在衬底上提供特征层,并且在特征层上设置掩模层。 掩模层的一部分在半导体器件的第一区域被去除,其中特征层的精细特征将被定位,掩模层保留在半导体器件的第二区域中,其中特征层的广泛特征将是 位于。 模具掩模图案设置在第一区域中的特征层和第二区域中的掩模层上。 间隔层设置在第一区域和第二区域中的模具掩模图案上。 执行蚀刻工艺以蚀刻间隔层,使得间隔物保留在模具掩模图案的图案特征的侧壁处,并且蚀刻第二区域中的掩模层以在第二区域中提供掩模层图案。 使用掩模层图案作为第二区域中的蚀刻掩模蚀刻特征层,并且在第一区域中使用间隔物作为蚀刻掩模来提供在第一区域中具有精细特征的特征层图案,并且在第二区域中具有广泛特征 。
    • 36. 发明授权
    • Method of forming active region structure
    • 形成有源区结构的方法
    • US08187935B2
    • 2012-05-29
    • US12795025
    • 2010-06-07
    • Young-Ho LeeKeon-Soo KimJae-Hwang SimJin-Hyun ShinKyung-Hoon Min
    • Young-Ho LeeKeon-Soo KimJae-Hwang SimJin-Hyun ShinKyung-Hoon Min
    • H01L21/8247
    • H01L21/76229H01L21/823481H01L27/1052
    • A method of forming an active region structure includes preparing a semiconductor substrate having a cell array region and a peripheral circuit region, forming upper cell mask patterns having a line shape in the cell array region, forming first and second peripheral mask patterns in the peripheral circuit region, the first and second peripheral mask patterns being stacked in sequence and covering the peripheral circuit region, and upper surfaces of the upper cell mask patterns forming a step difference with an upper surface of the second peripheral mask pattern, forming spacers on sidewalls of the upper cell mask patterns to expose lower portions of the upper cell mask patterns and the second peripheral mask pattern, and removing the lower portions of the upper cell mask patterns using the spacers and the first and second peripheral mask patterns as an etch mask.
    • 形成有源区域结构的方法包括制备具有单元阵列区域和外围电路区域的半导体衬底,在单元阵列区域中形成具有线状的上层单元掩模图案,在外围电路中形成第一和第二外围掩模图案 区域,第一外围掩模图案和第二外围掩模图案依次堆叠并覆盖外围电路区域,并且上部单元掩模图案的上表面与第二外围掩模图案的上表面形成阶梯差,在第二外围掩模图案的侧壁上形成间隔物 上部单元掩模图案以暴露上部单元掩模图案和第二外围掩模图案的下部,并且使用间隔件和第一外围掩模图案和第二外围掩模图案作为蚀刻掩模去除上部单元掩模图案的下部。
    • 40. 发明申请
    • METHODS OF FORMING FINE PATTERNS IN INTEGRATED CIRCUIT DEVICES
    • 在集成电路设备中形成精细图案的方法
    • US20100096719A1
    • 2010-04-22
    • US12418023
    • 2009-04-03
    • Young-Ho LeeJae-Kwan ParkJae-Hwang SimSang-Yong Park
    • Young-Ho LeeJae-Kwan ParkJae-Hwang SimSang-Yong Park
    • H01L29/06H01L21/762H01L23/544
    • H01L27/0207H01L21/0332H01L21/0337H01L21/3081H01L21/3086H01L21/32139H01L21/76229H01L23/544H01L27/1052H01L27/11519H01L27/11526H01L27/11529H01L2924/0002H01L2924/14H01L2924/00
    • A method of fabricating an integrated circuit device includes forming first and second mask structures on respective first and second regions of a feature layer. Each of the first and second mask structures includes a dual mask pattern and an etch mask pattern thereon having an etch selectivity relative to the dual mask pattern. The etch mask patterns of the first and second mask structures are isotropically etched to remove the etch mask pattern from the first mask structure while maintaining at least a portion of the etch mask pattern on the second mask structure. Spacers are formed on opposing sidewalls of the first and second mask structures. The first mask structure is selectively removed from between the spacers in the first region using the portion of the etch mask pattern on the second mask structure as a mask to define a first mask pattern including the opposing sidewall spacers with a void therebetween in the first region, and a second mask pattern including the opposing sidewall spacers with the second mask structure therebetween in the second region. The feature layer may be patterned using the first mask pattern as a mask to define a first feature on the first region, and using the second mask pattern as a mask to define a second feature on the second region having a greater width than the first feature.
    • 制造集成电路器件的方法包括在特征层的相应的第一和第二区域上形成第一和第二掩模结构。 第一和第二掩模结构中的每一个包括双掩模图案和其上具有相对于双掩模图案的蚀刻选择性的蚀刻掩模图案。 各向同性蚀刻第一和第二掩模结构的蚀刻掩模图案以从第一掩模结构去除蚀刻掩模图案,同时将蚀刻掩模图案的至少一部分保持在第二掩模结构上。 间隔件形成在第一和第二掩模结构的相对侧壁上。 使用第二掩模结构上的蚀刻掩模图案的部分作为掩模,第一掩模结构从第一区域中的间隔物之间​​选择性地移除,以限定第一掩模图案,其包括在第一区域中具有空隙的相对的侧壁间隔物 以及第二掩模图案,其包括在第二区域中具有第二掩模结构的相对的侧壁间隔物。 可以使用第一掩模图案作为掩模来对特征层进行图案化,以在第一区域上限定第一特征,并且使用第二掩模图案作为掩模来限定具有比第一特征宽的宽度的第二区域上的第二特征 。