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    • 34. 发明申请
    • METHOD FOR MANUFACTURING SOI SUBSTRATE AND SEMICONDUCTOR DEVICE
    • 制造SOI衬底和半导体器件的方法
    • US20090261449A1
    • 2009-10-22
    • US12410649
    • 2009-03-25
    • Shunpei YamazakiEriko NishidaTakashi Shimazu
    • Shunpei YamazakiEriko NishidaTakashi Shimazu
    • H01L27/12H01L21/762
    • H01L21/76254H01L21/84H01L29/458H01L29/66772H01L29/78621
    • An object is to provide an SOI substrate with excellent characteristics even in the case where a single crystal semiconductor substrate having crystal defects is used. Another object is to provide a semiconductor device using such an SOI substrate. A single crystal semiconductor layer is formed by an epitaxial growth method over a surface of a single crystal semiconductor substrate. The single crystal semiconductor layer is subjected to first thermal oxidation treatment to form a first oxide film. A surface of the first oxide film is irradiated with ions, whereby the ions are introduced to the single crystal semiconductor layer. The single crystal semiconductor layer and a base substrate are bonded with the first oxide film interposed therebetween. The single crystal semiconductor layer is divided at a region where the ions are introduced by performing thermal treatment, so that the single crystal semiconductor layer is partly left over the base substrate. The single crystal semiconductor layer left over the base substrate is irradiated with laser light. The single crystal semiconductor layer left over the base substrate is subjected to second thermal oxidation treatment to form a second oxide film. Then, the second oxide film is removed.
    • 目的是提供具有优异特性的SOI衬底,即使在使用具有晶体缺陷的单晶半导体衬底的情况下也是如此。 另一个目的是提供一种使用这种SOI衬底的半导体器件。 通过外延生长法在单晶半导体衬底的表面上形成单晶半导体层。 对单晶半导体层进行第一热氧化处理以形成第一氧化物膜。 用离子照射第一氧化膜的表面,由此将离子引入单晶半导体层。 单晶半导体层和基底基板与第一氧化膜接合。 通过进行热处理,将单晶半导体层分割在引入离子的区域,使得单晶半导体层部分残留在基底基板上。 用激光照射留在基底基板上的单晶半导体层。 留在基底基板上的单晶半导体层进行第二次热氧化处理,形成第二氧化膜。 然后,除去第二氧化膜。