专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20120018757A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE COMPRISING THE SAME AND LIGHTING SYSTEM 有权
标题翻译：发光装置，包含其的发光装置包装和照明系统
公开(公告)号：US20120018757A1
公开(公告)日：2012-01-26
申请号：US13189226
申请日：2011-07-22
申请人： Hwan Hee JEONG , Kwang Ki Choi , June O Song , Sang Youl Lee
发明人： Hwan Hee JEONG , Kwang Ki Choi , June O Song , Sang Youl Lee
IPC分类号： H01L33/40
CPC分类号： H01L33/38 , H01L33/0025 , H01L33/06 , H01L33/145 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/387 , H01L33/40 , H01L33/405 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a light emitting device including a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a first electrode disposed on the first conductive semiconductor layer, a reflective electrode disposed on the second conductive semiconductor layer, a channel layer disposed on the light emitting structure and surrounds the reflective electrode, and a support substrate connected to the channel layer through an adhesive layer.
摘要翻译：公开了一种发光器件，其包括发光结构，其包括第一导电半导体层，有源层和第二导电半导体层，设置在第一导电半导体层上的第一电极，设置在第二导电半导体层上的反射电极，设置在所述发光结构上并且包围所述反射电极的沟道层，以及通过粘合剂层连接到所述沟道层的支撑衬底。

32. 发明申请

US20110291140A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 审中-公开
标题翻译：发光装置和发光装置包装
公开(公告)号：US20110291140A1
公开(公告)日：2011-12-01
申请号：US13116192
申请日：2011-05-26
申请人： Kwang Ki Choi , Ji hyung Moon , June O Song , Sang Youl Lee , Tae Yeon Seong , Se Yeon Jung , Joon Woo Jeon , Seong Han Park
发明人： Kwang Ki Choi , Ji hyung Moon , June O Song , Sang Youl Lee , Tae Yeon Seong , Se Yeon Jung , Joon Woo Jeon , Seong Han Park
IPC分类号： H01L33/10 , H01L33/26
CPC分类号： H01L33/40 , H01L33/0079 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/405 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Provided is a light emitting device. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a gallium barrier layer on the light emitting structure layer, and a metal electrode layer on the gallium barrier layer.
摘要翻译：提供了一种发光装置。发光器件包括发光结构层，该发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层，发光结构层上的镓阻挡层，以及镓势垒上的金属电极层层。

33. 发明申请

US20110193123A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM 有权
标题翻译：发光装置，发光装置包装和照明系统
公开(公告)号：US20110193123A1
公开(公告)日：2011-08-11
申请号：US13024874
申请日：2011-02-10
申请人： Ji Hyung MOON , Hwan Hee Jeong , Sang Youl Lee , June O. Song , Kwang Ki Choi
发明人： Ji Hyung MOON , Hwan Hee Jeong , Sang Youl Lee , June O. Song , Kwang Ki Choi
IPC分类号： H01L33/42 , H01L33/46
CPC分类号： H01L33/382 , H01L33/385 , H01L33/486 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, an active layer under the first conductive type semiconductor layer, and a second conductive type semiconductor layer under the active layer; a conductive layer under the second conductive type semiconductor layer; an adhesive layer under the conductive layer; a support member under the adhesive layer; a contact electrode connected to the first conductive type semiconductor layer; a first lead electrode under the support member; a first electrode connecting the contact electrode to the first lead electrode on a first region of the support member; a second electrode connected to at least one of the conductive layer and the adhesive layer on a second region of the support member; a second lead electrode connected to the second electrode under the support member; and a first insulating layer between the contact electrode and the light emitting structure layer.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括发光结构层，该发光结构层包括第一导电类型半导体层，第一导电类型半导体层下面的有源层和有源层下面的第二导电类型半导体层; 第二导电类型半导体层下的导电层; 导电层下方的粘合剂层; 在粘合剂层下面的支撑构件; 连接到所述第一导电类型半导体层的接触电极; 在支撑构件下方的第一引线电极; 在所述支撑构件的第一区域上将所述接触电极连接到所述第一引线电极的第一电极; 在所述支撑构件的第二区域上连接到所述导电层和所述粘合剂层中的至少一个的第二电极; 第二引线电极，其在所述支撑构件的下方连接到所述第二电极; 以及在所述接触电极和所述发光结构层之间的第一绝缘层。

34. 发明授权

US08552452B2 Light emitting device and lighting instrument including the same 有权
标题翻译：发光装置和照明器具等
公开(公告)号：US08552452B2
公开(公告)日：2013-10-08
申请号：US13213767
申请日：2011-08-19
申请人： Hwan Hee Jeong , Sang Youl Lee , Young kyu Jeong , Chung song Kim , June O Song , Kwang Ki Choi , Eun Joo Kim
发明人： Hwan Hee Jeong , Sang Youl Lee , Young kyu Jeong , Chung song Kim , June O Song , Kwang Ki Choi , Eun Joo Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/387 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a light emitting device including, a second electrode layer, a light emitting structure that includes a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer and that is provided on the second electrode layer, a first electrode layer that includes a pad part and an electrode part connected to the pad part and that is provided on the light emitting structure, and a current blocking layer arranged between the second electrode layer and the light emitting structure in such a way that a part of the current block layer overlaps to correspond to the first electrode layer, wherein a width of the current blocking layer corresponding to the electrode part is different depending upon a clearance with the pad part.
摘要翻译：公开了一种发光器件，包括第二电极层，发光结构，其包括第二导电半导体层，有源层和第一导电半导体层，并且设置在第二电极层上，第一电极层包括焊盘部分和连接到焊盘部分并且设置在发光结构上的电极部分以及布置在第二电极层和发光结构之间的电流阻挡层，使得当前阻挡层的一部分重叠以对应于第一电极层，其中对应于电极部分的电流阻挡层的宽度根据与焊盘部分的间隙而不同。

35. 发明授权

US08324649B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08324649B2
公开(公告)日：2012-12-04
申请号：US13216932
申请日：2011-08-24
申请人： Sang Youl Lee , Hwan Hee Jeong , Ji Hyung Moon , Young Kyu Jeong , Kwang Ki Choi , June O Song
发明人： Sang Youl Lee , Hwan Hee Jeong , Ji Hyung Moon , Young Kyu Jeong , Kwang Ki Choi , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/145 , H01L33/22 , H01L33/382 , H01L33/46 , H01L2224/48247 , H01L2924/12032 , H01L2924/00
摘要： A light emitting device is provided that includes a light emitting structure (including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer), a conductive layer, an insulation layer, and a current blocking layer. The conductive layer may have a first conductive portion that passes through the second conductive type semiconductor layer and the active layer to contact the first conductive type semiconductor layer. The insulation layer may have a first insulation portion that surrounds the first conductive portion of the conductive layer. The current blocking layer may substantially surround the first insulation portion of the insulation layer, the first insulation portion provided between the current blocking layer and the first conductive portion.
摘要翻译：提供一种发光器件，其包括发光结构（包括第一导电类型半导体层，有源层和第二导电类型半导体层），导电层，绝缘层和电流阻挡层。导电层可以具有穿过第二导电类型半导体层和有源层以接触第一导电类型半导体层的第一导电部分。绝缘层可以具有围绕导电层的第一导电部分的第一绝缘部分。电流阻挡层可以基本上围绕绝缘层的第一绝缘部分，设置在电流阻挡层和第一导电部分之间的第一绝缘部分。

36. 发明授权

US08179039B2 Light emitting device, method of manufacturing the same, light emitting device package, and illumination system 有权
标题翻译：发光器件，其制造方法，发光器件封装和照明系统
公开(公告)号：US08179039B2
公开(公告)日：2012-05-15
申请号：US13028686
申请日：2011-02-16
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H05B33/00 , F21V1/00
CPC分类号： H01L33/62 , H01L33/08 , H01L33/20 , H01L33/42 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and an illumination system. The light emitting device includes a transmissive substrate, an ohmic layer on the transmissive substrate, a light emitting structure on the ohmic layer and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers, a electrode layer on a bottom surface of the transmissive substrate, and a conductive via electrically connecting the light emitting structure with the electrode layer through the transmissive substrate wherein an area of the transmissive substrate is increased toward an upper portion thereof from a lower portion.
摘要翻译：公开了发光器件，其制造方法，发光器件封装和照明系统。发光器件包括透射衬底，透射衬底上的欧姆层，欧姆层上的发光结构，并且包括第一和第二半导体层之间的第一导电半导体层，第二导电半导体层和有源层，透射基板的底面上的电极层，以及通过透射基板将发光结构与电极层电连接的导电通孔，其中透射基板的面积从下部向其上部增加。

37. 发明申请

US20120061704A1 LIGHT EMITTING DEVICE AND LIGHTING INSTRUMENT INCLUDING THE SAME 有权
标题翻译：发光装置和包括其的照明装置
公开(公告)号：US20120061704A1
公开(公告)日：2012-03-15
申请号：US13213767
申请日：2011-08-19
申请人： Hwan Hee Jeong , Sang Youl LEE , Young kyu JEONG , Chung song KIM , June O SONG , Kwang Ki Choi , Eun Joo KIM
发明人： Hwan Hee Jeong , Sang Youl LEE , Young kyu JEONG , Chung song KIM , June O SONG , Kwang Ki Choi , Eun Joo KIM
IPC分类号： H01L33/44 , H01L33/60
CPC分类号： H01L33/387 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a light emitting device including, a second electrode layer, a light emitting structure that includes a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer and that is provided on the second electrode layer, a first electrode layer that includes a pad part and an electrode part connected to the pad part and that is provided on the light emitting structure, and a current blocking layer arranged between the second electrode layer and the light emitting structure in such a way that a part of the current block layer overlaps to correspond to the first electrode layer, wherein a width of the current blocking layer corresponding to the electrode part is different depending upon a clearance with the pad part.
摘要翻译：公开了一种发光器件，包括第二电极层，发光结构，其包括第二导电半导体层，有源层和第一导电半导体层，并且设置在第二电极层上，第一电极层包括焊盘部分和连接到焊盘部分并且设置在发光结构上的电极部分以及布置在第二电极层和发光结构之间的电流阻挡层，使得当前阻挡层的一部分重叠以对应于第一电极层，其中对应于电极部分的电流阻挡层的宽度根据与焊盘部分的间隙而不同。

38. 发明申请

US20120025249A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置和发光装置包装
公开(公告)号：US20120025249A1
公开(公告)日：2012-02-02
申请号：US13192142
申请日：2011-07-27
申请人： Hwan Hee JEONG , Sang Youl Lee , Jung Hyeok Bae , Kwang Ki Choi , June O. Song
发明人： Hwan Hee JEONG , Sang Youl Lee , Jung Hyeok Bae , Kwang Ki Choi , June O. Song
IPC分类号： H01L33/60 , H01L33/52
CPC分类号： H01L27/15 , H01L33/0079 , H01L33/405 , H01L33/44 , H01L2224/48227 , H01L2924/12032 , H01L2924/00
摘要： Provided are a light emitting device and a light emitting device package. According to the light emitting device, a light emitting part and an electro-static discharge (ESD) protection part are disposed on a conductive support member. A connection layer electrically connects a first conducitve type semiconductor layer of the light emitting part to a second conductive type semiconductor layer of the ESD protection part. A ptrtection member is disposed on the connection layer and the ESD protection layer.
摘要翻译：提供了一种发光器件和发光器件封装。根据发光装置，发光部和静电放电（ESD）保护部设置在导电性支撑部件上。连接层将发光部的第一导通型半导体层与ESD保护部的第二导电型半导体层电连接。保护构件设置在连接层和ESD保护层上。

39. 发明申请

US20120007121A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20120007121A1
公开(公告)日：2012-01-12
申请号：US13216932
申请日：2011-08-24
申请人： Sang Youl LEE , Hwan Hee Jeong , Ji Hyung Moon , Young Kyu Jeong , Kwang Ki Choi , June O. Song
发明人： Sang Youl LEE , Hwan Hee Jeong , Ji Hyung Moon , Young Kyu Jeong , Kwang Ki Choi , June O. Song
IPC分类号： H01L33/60
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/145 , H01L33/22 , H01L33/382 , H01L33/46 , H01L2224/48247 , H01L2924/12032 , H01L2924/00
摘要： A light emitting device is provided that includes a light emitting structure (including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer), a conductive layer, an insulation layer, and a current blocking layer. The conductive layer may have a first conductive portion that passes through the second conductive type semiconductor layer and the active layer to contact the first conductive type semiconductor layer. The insulation layer may have a first insulation portion that surrounds the first conductive portion of the conductive layer. The current blocking layer may substantially surround the first insulation portion of the insulation layer, the first insulation portion provided between the current blocking layer and the first conductive portion.
摘要翻译：提供一种发光器件，其包括发光结构（包括第一导电类型半导体层，有源层和第二导电类型半导体层），导电层，绝缘层和电流阻挡层。导电层可以具有穿过第二导电类型半导体层和有源层以接触第一导电类型半导体层的第一导电部分。绝缘层可以具有围绕导电层的第一导电部分的第一绝缘部分。电流阻挡层可以基本上围绕绝缘层的第一绝缘部分，设置在电流阻挡层和第一导电部分之间的第一绝缘部分。

40. 发明申请

US20110220942A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置和发光装置包装
公开(公告)号：US20110220942A1
公开(公告)日：2011-09-15
申请号：US13014390
申请日：2011-01-26
申请人： Kwang Ki Choi , Hwan Hee JEONG , Sang Youl Lee , June O. Song , Ji Hyung Moon
发明人： Kwang Ki Choi , Hwan Hee JEONG , Sang Youl Lee , June O. Song , Ji Hyung Moon
IPC分类号： H01L33/58 , H01L33/36
CPC分类号： H01L33/44 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/0002 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.
摘要翻译：公开了一种发光器件和发光器件封装。发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层上的有源层和有源层上的第二导电半导体层，与第一导电半导体层的顶表面接触的粘合层与第一导电半导体的顶表面和粘合剂层的顶表面接触的第一电极和与第二导电半导体层接触的第二电极，其中与第一电极接触的粘合剂层与第二电极间隔开。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式