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    • 33. 发明授权
    • EMI feedthrough filter terminal assembly having surface mounted, internally grounded hybrid capacitor
    • EMI馈通滤波器端子组件具有表面安装的内部接地混合电容器
    • US06765780B2
    • 2004-07-20
    • US10377272
    • 2003-02-27
    • Richard L. BrendelRobert A. StevensonChristine A. FryszHaitong Zeng
    • Richard L. BrendelRobert A. StevensonChristine A. FryszHaitong Zeng
    • H01G435
    • H01G4/35A61N1/3754
    • An EMI feedthrough filter terminal assembly includes a capacitor having first and second sets of electrode plates, a first passageway having a first termination surface coupling the first set of electrode plates, a second passageway having a second termination surface coupling the second set of electrode plates, and a third termination surface exteriorly coupling the second set of electrode plates. A ferrule is adjacent to the capacitor and includes an oxide resistant biostable conductive pad, i.e., a noble metal pad, on a surface thereof coupled to the third termination surface. A conductive terminal pin extends through the first passageway in conductive relation with the first set of electrode plates. A conductive ground lead extends through the second passageway in conductive relation with the second set of electrode plates. An insulator is fixed to the ferrule for supporting the terminal pin in conductive isolation from the ferrule.
    • EMI馈通滤波器端子组件包括具有第一和第二组电极板的电容器,第一通道具有耦合第一组电极板的第一端接表面,具有耦合第二组电极板的第二端接表面的第二通道, 以及外部联接第二组电极板的第三端接表面。 套圈与电容器相邻,并且在耦合到第三端接表面的表面上包括耐氧化生物稳定的导电焊盘,即贵金属焊盘。 导电端子销与第一组电极板以导电关系延伸穿过第一通道。 导电接地引线与第二组电极板以导电关系延伸穿过第二通道。 绝缘体固定到套圈上,用于将端子销与套圈导电隔离。
    • 34. 发明授权
    • Chip capacitors and chip capacitor electromagnetic interference filters
    • 片式电容器和片式电容电磁干扰滤波器
    • US5973906A
    • 1999-10-26
    • US40222
    • 1998-03-17
    • Robert A. StevensonDonald K. HaskellRichard L. BrendelJason WoodsMike Louder
    • Robert A. StevensonDonald K. HaskellRichard L. BrendelJason WoodsMike Louder
    • A61N1/375H01G2/22H01G4/232H01G4/35H03H1/00
    • H01G4/232A61N1/3754H01G2/22H01G4/35H03H1/0007
    • An electromagnetic interference (EMI) filter capacitor assembly is provided for shielding and decoupling a conductive terminal pin or lead of the type used, for example, in an implantable medical device against passage of external interference signals. The EMI filter is constructed of relatively inexpensive ceramic chip capacitors which replace relatively expensive feedthrough capacitors as found in the prior art. The chip capacitors are mounted directly onto a hermetic feedthrough terminal in groups of two or more which vary in physical size, dielectric material and capacitance value so that they self-resonate at different frequencies. This "staggering" of resonant frequencies and direct installation at the hermetic terminal provides the EMI filter with sufficient broadband frequency attenuation. In one preferred form, multiple chip capacitor groupings are mounted onto a common base structure, with each capacitor grouping associated with a respective terminal pin. In another preferred form, a non-conductive substrate is provided with metalized circuit traces to better accommodate the mounting of the chip capacitors. Additionally, novel chip capacitor geometry/termination-metallization is provided which significantly reduces the internal inductance of the capacitor to improve its high frequency performance as an EMI filter. Such reduced inductance chip capacitor designs are readily adaptable to incorporate multiple electrically isolated active plate sets within a single monolithic casing.
    • 提供电磁干扰(EMI)滤波电容器组件,用于屏蔽和解耦用于例如在可植入医疗装置中的类型的导电端子引脚或引线,以抵抗外部干扰信号的通过。 EMI滤波器由相对廉价的陶瓷芯片电容器构成,其代替现有技术中发现的相对昂贵的馈通电容器。 芯片电容器直接安装在两个或更多个组合的密封馈通端子上,其在物理尺寸,电介质材料和电容值上变化,使得它们在不同频率下自谐振。 谐振频率的“惊人”和密封端的直接安装为EMI滤波器提供了足够的宽带频率衰减。 在一个优选形式中,多个片式电容器组被安装在公共基座结构上,每个电容器分组与相应的端子引脚相关联。 在另一优选形式中,非导电衬底设置有金属化电路迹线,以更好地适应片式电容器的安装。 另外,提供了新颖的芯片电容器几何/端接金属化,这显着降低了电容器的内部电感,以提高其作为EMI滤波器的高频性能。 这种减小的电感芯片电容器设计容易适用于在单个整体式壳体内并入多个电隔离的有源板组。
    • 40. 发明授权
    • Process for manufacturing an EMI filter feedthrough terminal assembly
    • 制造EMI滤波器馈通端子组件的方法
    • US06643903B2
    • 2003-11-11
    • US09812371
    • 2001-03-16
    • Robert A. StevensonDonald K. HaskellRichard L. Brendel
    • Robert A. StevensonDonald K. HaskellRichard L. Brendel
    • H01G700
    • H01G4/35A61N1/3754Y10T29/43Y10T29/435Y10T29/49002Y10T29/4913Y10T29/49139Y10T29/49147
    • A process for manufacturing an EMI filter feedthrough terminal assembly is provided for mating a feedthrough filter capacitor with an hermetic terminal assembly including a ferrule and one or more lead wires which extend through the ferrule in non-conductive relation. The process includes the steps of placing the hermetic terminal assembly, having a capture flange, into a holding fixture, and forming a seat of non-conductive thermal-setting material onto the terminal assembly within the capture flange. A feedthrough filter capacitor is loaded into the capture flange on top of the seat, and then the seat is cured. A conductive thermal-setting material is dispensed between an outer diameter of the feedthrough filter capacitor and the capture flange. The assembly is then centrifuged to pack the conductive thermal-setting material. The conductive thermal-setting material is then cured between the outer diameter of the feedthrough filter capacitor and the capture flange. Preferably, the height of the capture flange is one-quarter to three-quarters of an axial thickness of the capacitor.
    • 提供了一种用于制造EMI滤波器馈通端子组件的方法,用于将馈通滤波电容器与包括套圈和一个或多个引线的密封端子组件配合,该导线以非导电关系延伸穿过套圈。 该方法包括以下步骤:将具有捕获凸缘的密封端子组件放置到保持夹具中,以及在捕获凸缘内的终端组件上形成非导电热固化材料座。 馈通滤波电容器装载到座椅顶部的捕获法兰中,然后固定座椅。 导通热固化材料分配在馈通滤波电容器的外径与捕获凸缘之间。 然后将组件离心以包装导电热定型材料。 导电热固化材料然后在馈通滤波电容器的外径和捕获凸缘之间固化。 优选地,捕获凸缘的高度是电容器的轴向厚度的四分之三到四分之三。