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31. 发明申请

US20110036174A1 Molded Differential PRT Pressure Sensor 有权
标题翻译：成型差压PRT压力传感器
公开(公告)号：US20110036174A1
公开(公告)日：2011-02-17
申请号：US12539853
申请日：2009-08-12
申请人： Stephen R. Hooper , James D. MacDonald , William G. McDonald
发明人： Stephen R. Hooper , James D. MacDonald , William G. McDonald
IPC分类号： G01L9/06 , H01L21/50
CPC分类号： B81B7/0061 , B81B2201/0264 , B81C2203/0154 , G01L19/0084 , G01L19/141 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method and apparatus are described for fabricating an exposed differential pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a differential pressure sensor transducer die (31) from corrosive particles using a molding compound (39), but which vents both sides of a piezoresistive transducer sensor diaphragm (33) through a first vent hole (42) formed in an exposed die flag (36) and a second vent hole (38) formed in an exposed cap structure (33), enabling the sensor diaphragm (33) to sense differential pressure variations directly or indirectly through a protective gel.
摘要翻译：描述了一种用于制造暴露的差压传感器（30）的方法和装置，其使用模制化合物（39）将形成在差压传感器传感器模头（31）的顶侧表面上的内部电气部件（37）与腐蚀性颗粒保护，但是通过形成在暴露的盖标志（36）中的第一通气孔（42）和形成在暴露的盖结构（33）中的第二通气孔（38），通过压阻换能器传感器隔膜（33）的两侧通风，使得能够传感器隔膜（33）通过保护性凝胶直接或间接地感测差压变化。

32. 发明授权

US07859068B2 Integrated circuit encapsulation and method therefor 有权
标题翻译：集成电路封装及其方法
公开(公告)号：US07859068B2
公开(公告)日：2010-12-28
申请号：US12611586
申请日：2009-11-03
申请人： Stephen R. Hooper , David E. Heeley
发明人： Stephen R. Hooper , David E. Heeley
IPC分类号： H01L29/78
CPC分类号： G01L19/141 , G01L19/147 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00012
摘要： A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).
摘要翻译：设备（12）可以具有受到压力传递材料（20）的防腐蚀的压力敏感部分（17）。压力传递材料（20）也可用于将压力传递到压敏部分（17）。掩模材料（22）可用于在封装材料（24）中限定开口（26）。

33. 发明申请

US20160075553A1 Sensor Protective Coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US20160075553A1
公开(公告)日：2016-03-17
申请号：US14949869
申请日：2015-11-23
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A microelectromechanical system (MEMS) sensor device includes a substrate, a support structure supported by the substrate, a membrane supported by the support structure and spaced from the substrate, and a polymer layer covering the membrane.
摘要翻译：微机电系统（MEMS）传感器装置包括基板，由基板支撑的支撑结构，由支撑结构支撑并与基板间隔开的膜以及覆盖膜的聚合物层。

34. 发明授权

US08841758B2 Semiconductor device package and method of manufacture 有权
标题翻译：半导体器件封装及其制造方法
公开(公告)号：US08841758B2
公开(公告)日：2014-09-23
申请号：US13537392
申请日：2012-06-29
申请人： Dwight L. Daniels , Stephen R. Hooper , Alan J. Magnus , Justin E. Poarch
发明人： Dwight L. Daniels , Stephen R. Hooper , Alan J. Magnus , Justin E. Poarch
IPC分类号： H01L23/495
CPC分类号： H01L23/49537 , H01L21/4842 , H01L23/3107 , H01L23/3114 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L23/49586 , H01L24/97 , H01L2924/181 , Y10T29/49121 , H01L2924/00
摘要： A structure and method to improve saw singulation quality and wettability of integrated circuit packages (140) assembled with lead frames (112) having half-etched recesses (134) in leads. A method of forming a semiconductor device package includes providing a lead frame strip (110) having a plurality of lead frames. Each of the lead frames includes a depression (130) that is at least partially filled with a material (400) prior to singulating the strip.
摘要翻译：一种用于提高组装在引线框架（112）中的集成电路封装（140）的锯切质量和润湿性的结构和方法，所述引线框架（112）在引线中具有半蚀刻凹槽（134）。形成半导体器件封装的方法包括提供具有多个引线框架的引线框条（110）。引导框架中的每一个包括在分割条带之前至少部分地填充有材料（400）的凹陷（130）。

35. 发明授权

US08476087B2 Methods for fabricating sensor device package using a sealing structure 有权
标题翻译：使用密封结构制造传感器装置封装的方法
公开(公告)号：US08476087B2
公开(公告)日：2013-07-02
申请号：US13092001
申请日：2011-04-21
申请人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
IPC分类号： H01L21/66
CPC分类号： B81C1/0023 , B81B2201/0264 , G01L19/141 , G01L19/148 , H01L2224/48247
摘要： Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
摘要翻译：为传感器装置提供制造方法。示例性的制造方法包括使用密封结构粘合传感器结构和另一结构。密封结构围绕传感器结构的隔膜区域，并且在传感器结构和另一结构之间提供气密密封，以在隔膜区域的一侧上建立固定的参考压力。

36. 发明授权

US08307714B1 Dual port pressure sensor 有权
标题翻译：双口压力传感器
公开(公告)号：US08307714B1
公开(公告)日：2012-11-13
申请号：US13151404
申请日：2011-06-02
申请人： Stephen R. Hooper , William G. McDonald
发明人： Stephen R. Hooper , William G. McDonald
IPC分类号： G01L7/00
CPC分类号： G01L19/141 , G01L13/025 , G01L19/0038
摘要： A dual port pressure sensor has a lead frame having a flag having a first opening and a second opening. The lead frame has a flag having a first opening and a second opening. An encapsulant holds the lead frame. The encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag, and a second opening in the encapsulant is aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag and covers the first opening in the flag and provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag and is electrically coupled to the pressure sensor. A lid forming an enclosure with the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure.
摘要翻译：双端口压力传感器具有带有具有第一开口和第二开口的标志的引线框架。引线框架具有具有第一开口和第二开口的标志。密封剂保持引线框架。密封剂在标志的顶部之上，标志的底部被封装剂覆盖。密封剂中的第一开口与标志中的第一开口对准并且大于标志中的第一开口，并且密封剂中的第二开口与标记中的第二开口对齐。压力传感器传感器连接到标志的底部并覆盖标志中的第一开口，并且基于在其顶侧接收的第一压力和在其底侧上接收的第二压力而提供与压力差的电可检测的相关性。集成电路连接到标志的底部并且电耦合到压力传感器。盖子形成与旗子底部的封闭物。压力传感器传感器通过密封剂中的第一开口和标志中的第一开口接收第一压力，并且通过密封剂中的第二开口，标志中的第二开口和外壳接收通过第二压力的第一压力。

37. 发明申请

US20100199777A1 Exposed Pad Backside Pressure Sensor Package 有权
标题翻译：裸露的背面压力传感器封装
公开(公告)号：US20100199777A1
公开(公告)日：2010-08-12
申请号：US12368402
申请日：2009-02-10
申请人： Stephen R. Hooper , James D. MacDonald , William G. McDonald
发明人： Stephen R. Hooper , James D. MacDonald , William G. McDonald
IPC分类号： G01L9/06 , B65B11/00
CPC分类号： G01L19/141 , G01L19/0084 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/1461 , H01L2924/15747 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.
摘要翻译：描述了一种用于制造暴露的背侧压力传感器（30）的方法和装置，其利用保护性凝胶层（38）保护形成在压力传感器传感器模具（31）的顶侧表面上的内部电气部件（37）免受腐蚀性颗粒的影响，模制化合物（39），但是通过形成在暴露的模具标记（36）中的通气孔（42）通向形成在压力传感器传感器模头（31）的背面上的压阻换能器传感器膜片（33），使得传感器隔膜（33）直接感应压力变化而不受保护凝胶的影响。

38. 发明授权

US09510495B2 Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture 有权
标题翻译：具有腔型，可渗透材料填充包装的电子设备及其制造方法
公开(公告)号：US09510495B2
公开(公告)日：2016-11-29
申请号：US13686102
申请日：2012-11-27
申请人： Stephen R. Hooper , Darrel R. Frear , William C. Stermer, Jr.
发明人： Stephen R. Hooper , Darrel R. Frear , William C. Stermer, Jr.
IPC分类号： H05K1/03 , H05K13/04 , G01L19/06 , B81B7/00 , H01L23/053 , H01L23/24 , H01L23/498
CPC分类号： H05K13/0469 , B81B7/0038 , G01L19/0654 , H01L23/053 , H01L23/24 , H01L23/49861 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , Y10T156/10 , H01L2924/00014 , H01L2924/00
摘要： Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor circuit), a first material, and a second material. The package housing includes a cavity that is partially defined by a cavity bottom surface, and the cavity bottom surface includes a mounting area and a non-mounting area. The at least one electronic circuit is attached to the cavity bottom surface over the mounting area. The first material has a relatively high, first modulus of elasticity, and covers the non-mounting area. The second material has a relatively low, second modulus of elasticity, and is disposed over the first material within the cavity.
摘要翻译：实施例包括其制造的装置和方法。器件实施例包括封装壳体，至少一个电子电路（例如，传感器电路），第一材料和第二材料。包装壳体包括由腔底表面局部限定的空腔，腔体底面包括安装区域和非安装区域。所述至少一个电子电路在所述安装区域上附接到所述空腔底表面。第一种材料具有相对高的第一弹性模量，并且覆盖非安装区域。第二材料具有相对低的第二弹性模量，并且设置在腔内的第一材料之上。

39. 发明申请

US20160084722A1 Differential Pressure Sensor Assembly 有权
标题翻译：差压传感器组件
公开(公告)号：US20160084722A1
公开(公告)日：2016-03-24
申请号：US14495095
申请日：2014-09-24
申请人： Stephen R. Hooper , Darrel R. Frear , Thomas C. Speight
发明人： Stephen R. Hooper , Darrel R. Frear , Thomas C. Speight
IPC分类号： G01L9/00
CPC分类号： G01L9/0052 , G01L13/025 , G01L19/04 , G01L19/069 , H01L2224/48145 , H01L2924/1815 , H01L2924/00012
摘要： A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.
摘要翻译：差压传感器组件包括具有第一感测表面和第二感测表面的换能器。第二感测表面包含在腔中。集成电路（IC）与传感器气密耦合。 IC具有与空腔对准的第一孔。引线框架耦合到IC。引线框具有与IC的第一孔对准的第二孔。封装封装了传感器，IC和引线框架。该封装具有暴露于第一感测表面的第三孔。该包装包括在封装的第三孔和IC的第一孔之间提供密封的模塑料。模塑料通过侵入距离与换能器分离。

40. 发明授权

US09285422B2 Tester and method for testing a strip of devices 有权
标题翻译：用于测试一条设备的测试仪和方法
公开(公告)号：US09285422B2
公开(公告)日：2016-03-15
申请号：US13465651
申请日：2012-05-07
申请人： Chad S. Dawson , Stephen R. Hooper , Peter T. Jones , Mark E. Schlarmann
发明人： Chad S. Dawson , Stephen R. Hooper , Peter T. Jones , Mark E. Schlarmann
IPC分类号： G01R31/317 , B81C99/00 , G01R31/06 , G01R31/28
CPC分类号： G01R31/31718 , B81B2207/03 , B81C99/0045 , B81C99/005 , G01R31/06 , G01R31/2829 , G01R31/2844
摘要： A tester configured to test a strip of devices is provided. The tester may include a communications system, a plurality of communication lines, a plurality of multiplexors, each multiplexor having at least two outputs, wherein each multiplexor is configured to receive a signal generated by the communications system via one of the plurality of communication lines, and each multiplexor may be selectably coupled to at least two of the devices in the strip of devices. The tester may be configured to index the plurality of communication lines to a first subset of the devices, initiate at least one test, command the devices to generate data for each of the at least one tests, retrieve data from a first set of the devices, and retrieve data from a second set of the devices.
摘要翻译：提供了一种配置成测试一条设备的测试仪。测试器可以包括通信系统，多个通信线路，多个多路复用器，每个多路复用器具有至少两个输出，其中每个多路复用器被配置为经由多条通信线路之一接收由通信系统产生的信号，并且每个多路复用器可以可选地耦合到设备条带中的至少两个设备。测试器可以被配置为将多个通信线路索引到设备的第一子集，启动至少一个测试，命令设备为每个测试生成数据，从第一组设备检索数据并且从第二组设备检索数据。

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