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    • 31. 发明授权
    • High selectivity etch using an external plasma discharge
    • 使用外部等离子体放电的高选择性蚀刻
    • US06387288B1
    • 2002-05-14
    • US09556951
    • 2000-04-21
    • Claes BjorkmanHongching ShanMichael Welch
    • Claes BjorkmanHongching ShanMichael Welch
    • H01L21302
    • H01J37/32871
    • An apparatus and method for scavenging etchant species from a plasma formed of etchant gas prior to the etchant gas entering a primary processing chamber of a plasma reactor. There is at least one scavenging chamber, each of which is connected at an inlet thereof to an etchant gas source and at an outlet thereof to a gas distribution device of the primary processing chamber. Each scavenging chamber has a radiation applicator that irradiates the interior of the scavenging chamber and creates a plasma therein from etchant gas flowing through the chamber from the etchant gas source to the gas distribution apparatus of the primary processing chamber. The applicator uses either an inductive discharge, capacitive discharge, direct current (DC) discharge or microwave discharge to irradiate the interior of the scavenging chamber and ignite the plasma. An etchant species scavenging source is also disposed within the scavenging chamber. This source provides scavenging material that interacts with the plasma to scavenge etchant species created by the dissociation of the etchant gas in the plasma and form etch by-products comprised of substances from both the etchant species and the scavenging source. The scavenging chambers can be employed, as is or in a modified form, as excitation chambers to excite gases at optimal conditions and feed the modified gases into the primary chamber. The scavenging chamber is modified by removing its scavenging source if this source would adversely interact with the gas being excited.
    • 在蚀刻剂气体进入等离子体反应器的初级处理室之前,从蚀刻剂气体形成的等离子体中清除蚀刻剂物质的装置和方法。 至少有一个清除室,每个清除室在其入口处连接到蚀刻剂气体源,并在其出口连接到主处理室的气体分配装置。 每个清扫室具有辐射施加器,其辐射扫气室的内部,并从流化床中的蚀刻剂气体从蚀刻剂气体源到主处理室的气体分配装置产生等离子体。 施加器使用感应放电,电容放电,直流(DC)放电或微波放电来照射扫气室的内部并点燃等离子体。 清扫室内还设有一种蚀刻物质清除源。 该源提供与等离子体相互作用的清除材料,以清除由等离子体中的蚀刻剂气体解离产生的蚀刻剂物质,并形成由来自蚀刻剂物质和清除源的物质构成的蚀刻副产物。 清除室可以按原样或以改进形式用作激发室,以在最佳条件下激发气体并将改性气体进料到主室中。 如果该源与被激发的气体不利地相互作用,则通过去除其清除源来改进扫气室。
    • 33. 发明授权
    • Apparatus for interface measurement in a storage tank
    • 用于存储罐中界面测量的装置
    • US5400651A
    • 1995-03-28
    • US252142
    • 1994-06-01
    • Michael Welch
    • Michael Welch
    • G01F23/26G01F23/28G01F23/284
    • G01F23/284
    • An apparatus and method for measuring the water level at the bottom of a storage tank, the water level being the product-water interface between product and water within the storage tank. The apparatus includes a sensor assembly which is located at the tank bottom. The assembly has a plurality of measurement sensors arranged in a housing having slots for product and water to enter and leave the housing. Each measurement sensor is an open-circuited co-axial transmission line with a probe at its open end which functions as a monopole antenna. In preferred embodiments, the transmission lines are quarter wavelength open-circuited coaxial transmission lines. Each probe is located at a different distance from the tank bottom to cover a measurement range. The transmission lines are excited with signals which are reflected by the probes. As the level of the product-water interface changes on the probes, the capacitance of the probes also change which, in turn, change the amplitude or voltage level of the reflected signals. The voltage measurements are converted to level by a microprocessor.
    • 用于测量储罐底部水位的装置和方法,水位是储罐内产品与水之间的产品 - 水界面。 该装置包括位于罐底部的传感器组件。 组件具有多个测量传感器,其布置在壳体中,该壳体具有用于产品和水进入和离开壳体的槽。 每个测量传感器是一个开路的同轴传输线,其开口端具有探头,用作单极天线。 在优选实施例中,传输线是四分之一波长的开路同轴传输线。 每个探头位于与罐底部不同的距离以覆盖测量范围。 传输线被由探针反射的信号激发。 随着探针上产品 - 水界面的水平变化,探针的电容也会发生变化,从而改变了反射信号的幅度或电压电平。 电压测量由微处理器转换为电平。
    • 38. 发明申请
    • Enhanced separation process for (76Br, 77Br and 124I) preparation and recovery of each
    • (76Br,77Br和124I)的分离过程加强了每个的准备和回收
    • US20050201505A1
    • 2005-09-15
    • US10913950
    • 2004-08-07
    • Michael WelchLucie TangDouglas Rowland
    • Michael WelchLucie TangDouglas Rowland
    • B01D20060101G21G1/06
    • H05H6/00G21G1/10
    • An automated process for preparing and recovering 76Br, 77Br and 124I comprises (I) bombarding enriched 76 or 77Se or enriched 124Te with a beam of protons on a targeted disk respectively to produce 76Br, 77Br and 124I respectively wherein the target is selected from (a) a round tungsten disk with a depression at its center and (b) an inclined target having about a 20° inclination with respect to the beam direction and (II) recovering the 76Br, 77Br and 124I in an automated process comprising by placing the irradiated target face up in a quartz tube in the center of a high temperature furnace utilizing a target holder and heating the irradiated target sufficient to release and recover 76Br, 77Br and 124I therefrom.
    • 用于制备和回收76 Br,76 Br和124的自动化方法包括(I)轰击富集的76或77 / 在目标盘上分别具有一束质子束的SUP> Se或富集的124 Te,以产生76 Br Br,以及< 其目标选自(a)在其中心具有凹陷的圆形钨盘,(b)相对于光束方向具有大约20度倾斜的倾斜目标,(II)回收 在自动化过程中包括通过将照射的目标物体朝上放置在石英管的中心位置的自动化过程中,将76 Br,77 Br和124 I 高温炉利用目标保持器并加热照射的靶足以释放并从其中回收和/或从其中回收和/或从其中回收。
    • 40. 发明授权
    • Dual independent robot blades with minimal offset
    • 双独立机器人刀片,最小偏移
    • US06267549B1
    • 2001-07-31
    • US09088965
    • 1998-06-02
    • William BrownMichael Welch
    • William BrownMichael Welch
    • B25J1804
    • B25J9/107H01L21/67742
    • A wafer handling robot system (10) operates in a wafer chamber (40) and comprises two independent robot blades, an upper blade (18) surmounting a lower blade (26). A pair of wafers (28, 32) are supported and positioned at the outer ends (78) of the upper and lower blades (18, 26). The upper robot blade (18) keeps an upper wafer (28) at a level just above the level at which the lower robot blade (26) keeps a lower wafer (32). Because the wafers are virtually at the same level, the same wafer lift mechanism can be used in the wafer chamber to lift and remove or replace the wafers on the two blades. By offsetting the height of the wafers by minimal amounts, the throughput of the system can be increased by up to a factor of two over a single robot blade system, particularly if the robot is the limiting factor on throughput. This throughput enhancement represents a substantial gain with a relatively simple and inexpensive addition to the equipment.
    • 晶片处理机器人系统(10)在晶片室(40)中操作并且包括两个独立的机器人刀片,上部刀片(18),其覆盖下部刀片(26)。 一对晶片(28,32)被支撑并定位在上和下叶片(18,26)的外端(78)处。 上部机器人刀片(18)将上部晶片(28)保持在刚好在下部机器人刀片(26)保持下部晶片(32)的水平面上方的水平面上。 因为晶片实际上处于相同的水平,所以可以在晶片室中使用相同的晶片提升机构来提升和移除或更换两个叶片上的晶片。 通过将晶片的高度最小化,通过单个机器人刀片系统可以将系统的吞吐量提高高达2倍,特别是如果机器人是吞吐量的限制因素。 这种吞吐量增加代表了相当大的增益,相对简单和便宜的设备添加。