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    • 36. 发明授权
    • Image sensors
    • 图像传感器
    • US08633557B2
    • 2014-01-21
    • US13599960
    • 2012-08-30
    • Sang-Hoon KimChang-Rok Moon
    • Sang-Hoon KimChang-Rok Moon
    • H01L31/0232
    • H01L27/14636H01L27/1464H01L27/14689
    • Image sensors include a first insulation interlayer structure on a first surface of a substrate and having a multi-layered structure. A first wiring structure is in the first insulation interlayer structure. A via contact plug extends from a second surface of the substrate and penetrates the substrate to be electrically connected to the first wiring structure. Color filters and micro lenses are stacked on the second surface in a first region of the substrate. A second insulation interlayer structure is on the second surface in a second region of the substrate. A second wiring structure is in the second insulation interlayer structure to be electrically connected to the via contact plug. A pad pattern is electrically connected to the second wiring structure and having an upper surface through which an external electrical signal is applied. Photodiodes are between the first and second wiring structures in the first region.
    • 图像传感器包括在基板的第一表面上的具有多层结构的第一绝缘夹层结构。 第一布线结构处于第一绝缘夹层结构中。 通孔接触插塞从基板的第二表面延伸并穿透基板以电连接到第一布线结构。 彩色滤光器和微透镜在衬底的第一区域中的第二表面上堆叠。 第二绝缘层间结构位于衬底的第二区域中的第二表面上。 第二布线结构在第二绝缘层间结构中,以电连接到通孔接触插塞。 焊盘图案电连接到第二布线结构,并且具有施加外部电信号的上表面。 光电二极管位于第一区域中的第一和第二布线结构之间。
    • 39. 发明申请
    • Printed circuit board
    • 印刷电路板
    • US20110007999A1
    • 2011-01-13
    • US12923143
    • 2010-09-03
    • Sang-Hoon KimJe-Gwang YooJoon-Sung KimJae-Hyun JungHan-Seo Cho
    • Sang-Hoon KimJe-Gwang YooJoon-Sung KimJae-Hyun JungHan-Seo Cho
    • G02B6/12
    • G02B6/12002G02B6/13G02B6/43H05K1/0274H05K3/4652H05K3/4691
    • A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.
    • 一种印刷电路板,包括具有电路图案的第一光波导和埋在其一侧的焊盘,堆叠在所述第一光波导的一侧上的第一绝缘层,堆叠在所述第一绝缘层上的第一绝缘材料, 布线层堆叠在第一绝缘材料上,具有电路图案和埋在其一侧的焊盘的第二光波导,堆叠在第二光波导的一侧上的第二绝缘层,堆叠在第二绝缘层上的第二绝缘材料 层叠在所述第二绝缘材料上的第二电布线层,插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层,使得附接所述第一光波导和所述第二光波导;以及 穿过第一光波导和第二光波导的通孔。