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    • 40. 发明授权
    • Board for printed wiring
    • 印刷线路板
    • US06914183B2
    • 2005-07-05
    • US10669018
    • 2003-09-24
    • Shinji InazawaHiroshi TakadaAkihisa HosoeKouji Nitta
    • Shinji InazawaHiroshi TakadaAkihisa HosoeKouji Nitta
    • H05K1/02H05K9/00
    • H05K1/0233Y10T428/24917
    • A board for printed wiring comprises an electromagnetic wave absorbing laminate (EM) provided on a surface of a substrate (1) with the intervention of an adhesive layer (2) of a metal oxide, the electromagnetic wave absorbing laminate (EM) comprising: (a) a magnetic layer (3) comprising a plurality of magnetic particles (31) having an average particle diameter of 1 to 150 nm and isolated from each other by an electrically insulative material (32); and (b) an electrically insulative layer (4), being alternately stacked in a multi-layer structure, the board for printed wiring has a reduced thickness and an improved electromagnetic wave absorbing characteristic in a high frequency band of not lower than gigahertz, as compared with a conventional one which has an electromagnetic wave absorbing layer of a composite material including fine magnetic particles simply dispersed in a resin binder.
    • 用于印刷布线的板包括设置在基板(1)的表面上的电磁波吸收叠层(EM),介于金属氧化物的粘合剂层(2)之间,所述电磁波吸收叠层体(EM)包括: a)包含平均粒径为1〜150nm并通过电绝缘材料(32)彼此隔离的多个磁性颗粒(31)的磁性层(3); 和(b)以多层结构交替堆叠的电绝缘层(4),印刷布线板具有不低于千兆赫兹的高频带中的厚度减小和电磁波吸收特性的改善,如 与传统的具有简单分散在树脂粘合剂中的复合材料的电磁波吸收层相比,其具有细小的磁性颗粒。