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31. 发明授权

US07589354B2 Light emitting diode package and process of making the same 有权
标题翻译：发光二极管封装和制造过程相同
公开(公告)号：US07589354B2
公开(公告)日：2009-09-15
申请号：US11194630
申请日：2005-08-02
申请人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/483 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73265 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.
摘要翻译：发光二极管（LED）封装包括至少一个LED芯片，载体，光反射元件和至少一个外部连接电极。 LED芯片设置在载体上，并且使用导线或倒装芯片方法将LED芯片的电极连接到外部连接电极。透明材料用于固定光反射元件和载体，并形成透镜。

32. 发明授权

US07544524B2 Alternating current light-emitting device 有权
标题翻译：交流发光装置
公开(公告)号：US07544524B2
公开(公告)日：2009-06-09
申请号：US11432366
申请日：2006-05-12
申请人： Ming-Te Lin , Hsi-Hsuan Yen , Wen-Yung Yeh , Ming-Yao Lin , Sheng-Pan Huang
发明人： Ming-Te Lin , Hsi-Hsuan Yen , Wen-Yung Yeh , Ming-Yao Lin , Sheng-Pan Huang
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , H01L2924/0002 , H05B33/0803 , H05B33/0821 , H01L2924/00
摘要： An alternating current light-emitting device and the fabrication method thereof is disclosed. The alternating current light-emitting device includes at least one alternating current micro-die light-emitting module formed on a substrate and composed of at least two micro-dies connected to one another. The micro-dies, each includes at least two active layers, are electrically connected by a conductive structure, such that the active layers of the micro-dies take turns emitting light during positive and negative half cycles of alternating current, thereby providing a full-scale light-emitting area for all-time light emission.
摘要翻译：公开了一种交流发光器件及其制造方法。交流发光装置包括至少一个形成在基板上并由至少两个彼此连接的微模组成的交流微模发光模块。微管芯每个包括至少两个有源层，通过导电结构电连接，使得微管的有源层在交流电的正半周期和负半周期内轮流发光，规模发光面积全面发光。

33. 发明申请

US20070069219A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20070069219A1
公开(公告)日：2007-03-29
申请号：US11429235
申请日：2006-05-08
申请人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
发明人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L2224/16 , H01L2224/48091 , H01L2924/01068 , H01L2924/01079 , H01L2924/00014
摘要： A light emitting device is proposed, which emits light while connected to the power. The light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection. The light emitting device of the present invention has advantages of short current path, low series thermal resistance and low cost. In addition, the depth of the recess can further be increased to improve light collecting efficiency.
摘要翻译：提出了一种发光装置，其在连接到电源时发光。发光装置包括发光元件，其具有设置在其光输出表面侧的至少两个电极; 以及具有凹部的基座部件和与电极对应的引线部，所述发光元件安装在所述基座部件上并被容纳在所述凹部中，其中，所述光输出面朝向所述凹部的开口，所述凹部在接近所述光输出时变小表面，并且电极分别与从基座的连接位置延伸到外缘的引线部分电连接以进行电力连接。本发明的发光器件具有电流路短，串联热阻低，成本低的优点。此外，可以进一步增加凹部的深度，以提高聚光效率。

34. 发明申请

US20060145173A1 Light emitting diode package and process of making the same 有权
公开(公告)号：US20060145173A1
公开(公告)日：2006-07-06
申请号：US11194630
申请日：2005-08-02
申请人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/483 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73265 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

35. 发明授权

US06797984B1 Light-emitting diode packaging structure having rectification circuit 有权
标题翻译：具有整流电路的发光二极管封装结构
公开(公告)号：US06797984B1
公开(公告)日：2004-09-28
申请号：US10658330
申请日：2003-09-10
申请人： Ming-Te Lin , Ming-Yao Lin
发明人： Ming-Te Lin , Ming-Yao Lin
IPC分类号： H01L3112
CPC分类号： H05B33/0821 , H01L25/167 , H01L2224/48091 , H01L2224/48247 , H05B33/0803 , H01L2924/00014
摘要： A light emitting diode (LED) packaging structure with built-in rectification circuit is disclosed. The LED packaging structure includes an LED and a rectification circuit is formed inside the LED. Thus, the LED packaging structure is capable to receive an alternate current from an electrical main by the rectification circuit which converts the alternate current into a direct current for the LED whereby the LED can be directly connected to the electrical main and powered thereby without use of additional and external rectification device.
摘要翻译：公开了一种具有内置整流电路的发光二极管（LED）封装结构。 LED封装结构包括LED，LED内部形成整流电路。因此，LED封装结构能够通过整流电路接收来自电主机的交流电流，该整流电路将交流电流转换为LED的直流电流，由此LED可以直接连接到电主机并由此供电，而不使用附加和外部整流装置。

36. 发明授权

US08931924B2 Heat sink for LED lamp 有权
标题翻译： LED灯泡散热片
公开(公告)号：US08931924B2
公开(公告)日：2015-01-13
申请号：US13270582
申请日：2011-10-11
申请人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
发明人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
IPC分类号： F21V29/00 , F21K99/00 , F21V3/02 , F21V3/00
CPC分类号： F21K9/23 , F21V3/02 , F21V29/506 , F21V29/777 , F21V29/83 , F21V29/86 , F21V29/89 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A LED lamp is disclosed which is composed of a plurality of light unit, each of the light unit has metal its leads inserted into a heat sink for heat dissipation. A circuit board is optionally to use for electrically coupling the metal leads of each light unit to a control circuit for controlling the on/off of each of the light units.
摘要翻译：公开了一种LED灯，其由多个光单元组成，每个灯单元具有金属引线，其插入散热器中用于散热。电路板可选地用于将每个光单元的金属引线电耦合到用于控制每个光单元的开/关的控制电路。

37. 发明授权

US06637100B1 Method for mounting external heat dissipater to light emitting diode 失效
标题翻译：将外部散热器安装到发光二极管的方法
公开(公告)号：US06637100B1
公开(公告)日：2003-10-28
申请号：US10236950
申请日：2002-09-09
申请人： Ming-Te Lin , Ming-Yao Lin
发明人： Ming-Te Lin , Ming-Yao Lin
IPC分类号： H01R4300
CPC分类号： H01R43/0427 , Y10T29/49121 , Y10T29/4913 , Y10T29/49828 , Y10T29/53174 , Y10T29/53187
摘要： A method for mounting an external heat dissipater to a light emitting diode is disclosed. The heat dissipater is comprised of at least one heat dissipation board. A long metal strip is conveyed through a working platform and is punched to form a number of heat dissipation boards connected thereto by connection sections. Light emitting diodes are positioned on the heat dissipation boards and the heat dissipation boards are cut and separated from the metal strip to form finished products of light emitting diodes to which a heat dissipater comprised of the heat dissipation board is mounted.
摘要翻译：公开了一种将外部散热器安装到发光二极管的方法。散热器由至少一个散热板组成。长条状的金属带通过工作平台被输送，并且被冲孔以形成通过连接部连接到其上的多个散热板。发光二极管位于散热板上，并且散热板与金属条切割并分离，以形成由散热板组成的散热器的发光二极管成品。

38. 发明授权

US08708523B2 Panorama lamp with 360 degree peripheral illumination 有权
标题翻译：全景灯具360度周边照明
公开(公告)号：US08708523B2
公开(公告)日：2014-04-29
申请号：US13435081
申请日：2012-03-30
申请人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
发明人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
IPC分类号： F21V1/00 , F21V11/00 , B60Q1/26
CPC分类号： F21V5/04 , F21K9/232 , F21K9/60 , F21V3/00 , F21V5/048 , F21V13/02 , F21Y2115/10
摘要： A panorama lamp with 360 degree peripheral illumination with reference to an axis of the lamp is disclosed. Each of the light units mounted on a heat sink has a light chip facing outward from the lamp. Either a protection cap or a circular wall lens can be optionally adopted to cap the top of the lamp. The protection cap provides protection to the chips of the lamp from being damaged. The circular wall lens modifies the beam profile of the lamp to meet various market requests.
摘要翻译：公开了一种相对于灯的轴线具有360度周边照明的全景灯。安装在散热器上的每个灯单元具有从灯向外的光芯片。可以选择使用保护盖或圆形壁透镜来盖住灯的顶部。保护盖可以保护灯泡的芯片免受损坏。圆形壁透镜改变灯的光束轮廓以满足各种市场要求。

39. 发明授权

US08632199B2 Lamp apparatuses 有权
标题翻译：灯具
公开(公告)号：US08632199B2
公开(公告)日：2014-01-21
申请号：US12550337
申请日：2009-08-28
申请人： Wen-Yung Yeh , Jui-Ying Lin , Yu-Chen Yu , Ming-Te Lin , Yu-Chun Lin , Ta-Wei Chien
发明人： Wen-Yung Yeh , Jui-Ying Lin , Yu-Chen Yu , Ming-Te Lin , Yu-Chun Lin , Ta-Wei Chien
IPC分类号： F21V33/00
CPC分类号： F21S6/003 , A47G29/10 , A61L9/12 , F21S8/035 , F21Y2115/10 , Y10T307/951
摘要： A lamp apparatus include a lamp body, at least an alternating current light-emitting diode and a plug. The alternating current light-emitting diode is disposed on a lamp body. The plug is electrically connected to the alternating current light-emitting diode. In lamp apparatuses utilizing AC LED, heat generated thereby is almost concentrated on chips. Compared with conventional lamp apparatuses utilizing DC LEDs, heat generated thereby is distributed on chips and outer rectifier. In lamp apparatuses utilizing AC LEDs, heat generated thereby is almost concentrated on chips because AC LEDs operate directly with AC electric power, omitting a rectifier and preventing power loss during operation of power rectification. Therefore, the heat accumulated on the chips of the AC LEDs is enough to be used to evaporate essential oil. In another embodiment, the invention utilizes low-resistance pure water surrounding the AC LED to dissipate its heat.
摘要翻译：一种灯具包括：灯体，至少一个交流发光二极管和一个插头。交流发光二极管配置在灯体上。插头电连接到交流发光二极管。在使用AC LED的灯具中，由此产生的热几乎集中在芯片上。与使用DC LED的传统灯具相比，由此产生的热量分布在芯片和外部整流器上。在使用AC LED的灯具中，由于AC LED直接用AC电力进行动作，省略整流器并且防止功率整流运转时的功率损耗，因此产生的热量几乎集中在芯片上。因此，积聚在AC LED的芯片上的热量足以用于蒸发精油。在另一个实施例中，本发明利用围绕AC LED的低电阻纯水来散热。

40. 发明授权

US08279621B2 AC—LED system in single chip with three metal contacts 有权
标题翻译： AC-LED系统采用单芯片三金属触点
公开(公告)号：US08279621B2
公开(公告)日：2012-10-02
申请号：US13083142
申请日：2011-04-08
申请人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
发明人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
IPC分类号： G11C11/00
CPC分类号： H05B33/0803 , H05B33/0809 , H05B33/0821
摘要： A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.
摘要翻译：多个AC_LED单元耦合并设置在单个芯片上以在单芯片中形成AC_LED系统。或者，还公开了具有四个金属触点的单芯片中的AC LED系统。

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