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    • 34. 发明申请
    • Objective lens holder, objective lens driving device including same and optical disk read/write device
    • 物镜支架,物镜驱动装置及光盘读/写装置
    • US20060119933A1
    • 2006-06-08
    • US11292904
    • 2005-12-01
    • Toshiharu InuiTakashi Kawano
    • Toshiharu InuiTakashi Kawano
    • G02B13/14
    • G11B7/0935
    • An objective lens holder of the present invention includes: (i) a cavity, having an entrance and an exit, which guides, to an objective lens, an incident light beam entering the entrance, the exit being provided on a side of the cavity where the objective lens is housed; and (ii) beam diameter limiting means having an opening for limiting, to an effective diameter of the objective lens, a beam diameter of the incident light beam passing through the cavity. The cavity is surrounded with internal wall surfaces facing each other so that space between the internal wall surfaces gradually increases from the opening of the aperture toward the entrance or the exit. This makes it possible to provide a highly rigid objective lens holder that allows high-speed read/write operations.
    • 本发明的物镜保持器包括:(i)具有入口和出口的空腔,其引导到物镜进入入口的入射光束,该出口设置在腔的一侧, 容纳物镜; 和(ii)光束直径限制装​​置,其具有用于限制通过该腔的入射光束的光束直径的物镜的有效直径的开口。 空腔被彼此面对的内壁表面围绕,使得内壁表面之间的空间从孔的开口朝向入口或出口逐渐增加。 这使得可以提供允许高速读/写操作的高度刚性的物镜保持器。
    • 36. 发明授权
    • Carrier system positioning method
    • 载波系统定位方法
    • US06510365B1
    • 2003-01-21
    • US09830363
    • 2001-04-25
    • Yasuhiko NishinakayamaShigeru IshizawaHiroaki SaekiTakashi KawanoTetsu Osawa
    • Yasuhiko NishinakayamaShigeru IshizawaHiroaki SaekiTakashi KawanoTetsu Osawa
    • G06F700
    • H01L21/681G05B19/4015G05B19/402G05B2219/37339G05B2219/45031G05B2219/49299H01L21/67745Y10S414/136
    • The invention is a method for positioning a conveying mechanism having a holding portion for semiconductor wafers. Respective provisional position coordinates of an orienting teaching standard position and a container teaching standard positions are inputted into a controlling unit in advance. A wafer to be conveyed precisely positioned with respect to and held by the holding portion is conveyed and placed on the rotating orienting device according a control based on the provisional coordinates of the orienting teaching standard position. A posture detector then detects the eccentric volume and eccentric direction of the wafer. Appropriate position coordinates are made by amending the provisional coordinates. Then, a wafer to be conveyed precisely positioned with respect to the container teaching standard position is conveyed and placed on the rotating orienting device according a control based on the provisional coordinates of the orienting teaching standard position. A posture detector then detects the eccentric volume and eccentric direction of the wafer. Appropriate position coordinates are made by amending the provisional coordinates.
    • 本发明是用于定位具有用于半导体晶片的保持部分的输送机构的方法。 定向教学标准位置和容器教学标准位置的各个临时位置坐标被预先输入到控制单元中。 根据定向教学标准位置的临时坐标的控制,将要被输送的精确定位的晶片相对于保持部分保持并被放置在旋转定向装置上。 然后姿势检测器检测晶片的偏心体积和偏心方向。 通过修改临时坐标来进行适当的位置坐标。 然后,基于定向教学标准位置的临时坐标的控制,将要相对于容器教导标准位置精确定位的晶片输送并放置在旋转取向装置上。 然后姿势检测器检测晶片的偏心体积和偏心方向。 通过修改临时坐标来进行适当的位置坐标。
    • 38. 发明授权
    • Seed-covering agent and seed covered with seed-covering agent
    • 种子覆盖剂和种子覆盖有种子覆盖剂
    • US09107339B2
    • 2015-08-18
    • US13884032
    • 2011-11-10
    • Takashi KawanoMasashi Fujinaga
    • Takashi KawanoMasashi Fujinaga
    • A01C1/06A01H4/00
    • A01C1/06A01H4/006
    • A seed-covering agent, which covers a seed surface and contains an iron powder and a binder, is specified such that, in the above-described iron powder, the mass ratio of an iron powder having a particle size of 63 μm or less to a total mass of the iron powder is 0% or more and 75% or less, the mass ratio of an iron powder having a particle size of more than 63 μm and 150 μm or less to the total mass of the iron powder is 25% or more and 100% or less, and the mass ratio of an iron powder having a particle size of more than 150 μm to a total mass of the iron powder is 0% or more and 50% or less, and the average particle size of the above-described binder is 1 to 150 μm.
    • 规定覆盖种子表面并含有铁粉和粘合剂的种子覆盖剂,使得在上述铁粉中,粒径为63μm以下的铁粉与 铁粉的总质量为0%以上且75%以下,粒径为63μm以上且150μm以下的铁粉与铁粉的总质量的质量比为25质量% 以上且100%以下,粒径为150μm以上的铁粉与铁粉的总质量的质量比为0%以上且50%以下,平均粒径 上述粘合剂为1〜150μm。