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    • 31. 发明授权
    • Optical transmission component and production method thereof
    • 光传输部件及其制造方法
    • US07510337B2
    • 2009-03-31
    • US11955026
    • 2007-12-12
    • Homare TakedaRyo Yamamoto
    • Homare TakedaRyo Yamamoto
    • G02B6/36G02B6/38
    • G02B6/3865G02B6/29361G02B6/32G02B6/34G02B6/3636G02B6/3652G02B6/3696G02B6/3861G02B6/3885
    • An aspect according to the invention provides a method of producing an optical transmission component in which peel-off and a bubble are not generated within a keeping temperature range in a bonding agent with which a space between an optical function portion and an end face of an optical transmission line is filled while a holder portion for holding the optical transmission line such as an optical fiber and the optical function portion such as a lens array are integrally molded. An optical function array is disposed across the space from a fiber holder, and the optical function array including lenses and a lower-side holder portion are integrally molded by a transparent resin. Fiber cores are placed in V-shape grooves of the lower-side holder portion, and an upper-side holder portion is put on the fiber cores. End faces of the fiber cores face the space, and the space is filled with the bonding agent. When a linear expansion coefficient of the bonding agent is smaller (or larger) than the linear expansion coefficient of the connection portion that connects the optical function array and the lower-side holder portion, the bonding agent is cured at an atmosphere temperature higher than an upper limit (or lower than a lower limit) of a keeping temperature of the optical transmission component.
    • 根据本发明的一个方面提供了一种制造光传输部件的方法,其中在光学功能部分和光学功能部分的端面之间的间隔的粘合剂中,在保持温度范围内不产生剥离和气泡 填充光传输线,同时用于保持诸如光纤的光传输线的保持器部分和诸如透镜阵列的光学功能部分被整体模制。 光纤功能阵列跨越光纤保持器的空间设置,包括透镜和下侧保持器部分的光学功能阵列通过透明树脂一体模制。 纤维芯被放置在下侧保持器部分的V形槽中,并且将上侧保持器部分放置在纤维芯上。 纤维芯的端面面向空间,并且用粘合剂填充空间。 当接合剂的线膨胀系数比连接光学功能阵列和下侧保持器部分的连接部分的线性膨胀系数小(或更大)时,粘合剂在高于 光传输部件的保持温度的上限(或低于下限)。
    • 37. 发明申请
    • Electronic device
    • 电子设备
    • US20050117291A1
    • 2005-06-02
    • US10970289
    • 2004-10-21
    • Yohei FukumaRyo YamamotoToru Karashima
    • Yohei FukumaRyo YamamotoToru Karashima
    • G06F1/16G06F1/20H01L23/40H05K7/20
    • G06F1/1656G06F1/1616G06F1/203H01L2924/0002H01L2924/00
    • The object of the present invention is to provide an electronic device which is thin and whose heat-generating components are cooled efficiently. The electronic device of the present invention is characterized by heat-transmitting sheets 72 and 47 being stuck to inside surfaces of a lower section 27 and an upper section 28 of the electronic device's case and being in contact with heat-generating components 58 and 60, which are semiconductor components such as an image processor and a central processor mounted on both sides of a motherboard 30 provided in the case, and elastic sheets 83 and 48, which are laid between the portions, contacting the heat-generating components 58 and 60, of the heat-transmitting sheets 72 and 47 and the inside surfaces of the sections 27 and 28.
    • 本发明的目的是提供一种薄的电子器件,其发热部件被有效地冷却。 本发明的电子装置的特征在于,将热传递片72和47粘贴在电子装置的壳体的下部部分27和上部部分28的内表面上并与发热部件58和60接触, 这些半导体部件例如安装在设置在壳体中的母板30的两侧的图像处理器和中央处理器以及布置在部分之间的与发热部件58和60接触的弹性片83和48, 的透热片72和47以及部分27和28的内表面。