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    • 32. 发明授权
    • Molds for casting with customized internal structure to collapse upon cooling and to facilitate control of heat transfer
    • 用于具有定制内部结构的铸造模具在冷却时塌陷并且便于控制热传递
    • US06629559B2
    • 2003-10-07
    • US10131001
    • 2002-04-24
    • Emanuel M. SachsWon B. BangMichael J. Cima
    • Emanuel M. SachsWon B. BangMichael J. Cima
    • B22C902
    • B22C9/00B22C9/04B33Y80/00
    • A new mold solves problems that arise from differential changes in geometry inherent to casting metal in a ceramic mold, by control of the internal morphology between the surfaces of the mold that face the casting, and that face the external environment. Layered fabrication techniques are used to create a ceramic mold. For example, an internal geometry composed of a cellular arrangement of voids may be created within the mold wall. Structures may be designed and fabricated so that the ceramic mold fails at an appropriate time during the solidification and/or cooling of the casting. Thus, the casting itself is not damaged. The mold fails to avoid rupture, or even distortion, of the casting. A thin shell of ceramic defines the casting cavity. This shell must be thin enough to fail due to the stresses induced (primarily compressive) by the metal next to it and partly adherent to it. A support structure is provided with a morphology that supports the thin shell that defines the casting geometry, yet that also fails as the casting solidifies and/or cools. Typically, the support structure is a skeletal network with voids therebetween. The skeletal elements may be struts, or sheets or both. At least the following two failure mechanisms may be exploited in the design of the support structure: bending in the structure; and under compressive loads, either by buckling of a support member or, breakage under compressive loading. The failure of the support structure may also be due to a combination of bending and compression.
    • 一种新的模具解决了陶瓷模具中铸造金属固有几何差异变化的问题,通过控制模具表面之间的内部形态以及面对外部环境的内部形态。 使用分层制造技术来制造陶瓷模具。 例如,可以在模具壁内形成由空隙的细胞布置构成的内部几何形状。 可以设计和制造结构,使得陶瓷模具在铸件的凝固和/或冷却期间在适当的时间失效。 因此,铸件本身不会损坏。 模具不能避免铸件的破裂或甚至变形。陶瓷的薄壳体限定铸造腔体。 这种外壳必须足够薄以致由于紧邻其上的金属(部分粘附在其上)的应力引起(主要是压缩)的应力而失效。 支撑结构具有支撑限定铸造几何形状的薄壳的形态,但是当铸件固化和/或冷却时也会失效。 通常,支撑结构是其间具有空隙的骨架网络。 骨架元件可以是支柱或片材或两者。至少在支撑结构的设计中可以利用以下两种故障机构:在结构中弯曲; 并且在压缩载荷下,通过支撑构件的弯曲或在压缩载荷下断裂。 支撑结构的故障也可能是由于弯曲和压缩的组合。
    • 33. 发明授权
    • Thermally-activated microchip chemical delivery devices
    • 热敏微芯片化学输送装置
    • US06527762B1
    • 2003-03-04
    • US09638109
    • 2000-08-11
    • John T. Santini, Jr.Michael J. CimaScott Albert Uhland
    • John T. Santini, Jr.Michael J. CimaScott Albert Uhland
    • A61K911
    • B01L3/50853A61K9/0009A61K9/0024A61K9/0097B01L2300/0819B01L2400/0677
    • Microchip delivery devices are provided that control both the rate and time of release of molecules, wherein the device includes a substrate, at least one reservoir in the substrate containing the molecules, and a reservoir cap positioned on the reservoir over the molecules, wherein the molecules are released from the reservoir upon heating or cooling the device or a portion thereof sufficient to rupture the reservoir cap. In a preferred embodiment, the device includes a resistor integrated into the reservoir or mounted near the reservoir, which upon application of an electric current through the resistor, causes at least one of the contents of the reservoir to thermally expand, vaporize, phase change, or undergo a thermally driven reaction, such that the reservoir cap ruptures due to mechanical stress. In another preferred embodiment, application of an electric current to a resistor located on or near the reservoir cap causes the cap to expand, contract, or undergo a phase change that results in the rupture of the reservoir cap. The reservoirs can contain multiple drugs or other molecules in variable dosages. Each of the reservoirs of a single microchip can contain different molecules and/or different amounts and concentrations, which can be released independently.
    • 提供Microchip输送装置,其控制释放分子的速率和时间,其中所述装置包括底物,所述基质中含有所述分子的至少一个储存器和位于所述分子上的所述储存器上的储存器盖,其中所述分子 在加热或冷却装置或其一部分足以破坏储存器盖时从储存器释放。 在优选实施例中,该装置包括集成在储存器中或安装在储存器附近的电阻器,当施加电流通过电阻器时,储存器的至少一个内容物热膨胀,蒸发,相变, 或经历热驱动反应,使得储存器盖由于机械应力而破裂。 在另一个优选实施例中,将电流施加到位于储存器盖上或附近的电阻器使得盖膨胀,收缩或经历相变,导致储存器盖的破裂。 储层可以含有多种药物或其他可变剂量的分子。 单个微芯片的每个储存器可以包含不同的分子和/或不同的量和浓度,其可以独立释放。