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31. 发明授权

US07450385B1 Liquid-based cooling apparatus for an electronics rack 失效
标题翻译：用于电子机架的液体冷却装置
公开(公告)号：US07450385B1
公开(公告)日：2008-11-11
申请号：US11763678
申请日：2007-06-15
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20781 , F28F9/0275 , H05K7/20772 , Y10T29/5313
摘要： A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate swivel connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.
摘要翻译：提供了一种用于促进电子机架的电子抽屉的冷却的冷却装置。该装置包括构造成用于安装到电子机架的双折门组件。门组件包括第一门和第二门，每个门被配置为单独地铰接安装到电子机架上。该装置还包括冷却剂分配装置，其中冷却剂供应歧管安装到第一门，并且其冷却剂返回歧管安装到第二门。单独的旋转连接件与冷却剂供应和返回歧管流体连通地联接，以便于冷却剂供给和从歧管返回并且用于促进门相对于电子机架的枢转运动。多个冷却剂分配端口设置在供应和返回歧管内，并且设置成便于冷却剂供应和返回到电子抽屉。

32. 发明授权

US07408776B2 Conductive heat transport cooling system and method for a multi-component electronics system 失效
标题翻译：导电热传输冷却系统和多组件电子系统的方法
公开(公告)号：US07408776B2
公开(公告)日：2008-08-05
申请号：US11539905
申请日：2006-10-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Randall G. Kemink , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Randall G. Kemink , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20509 , H01L23/473 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H05K7/20009 , H05K7/20772 , H01L2224/0401
摘要： A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.
摘要翻译：提供导电热传输冷却系统和方法来冷却电子系统的一次和二次发热部件。冷却系统包括液体冷却子系统，其包括物理耦合到电子系统的至少一个主要发热部件的至少一个液体冷却冷却板，以及耦合到流体连通的流体传导冷却剂管至少一个液冷冷板。导热辅助结构耦合到冷却剂承载管和电子系统的至少一个二次发热部件。当使用时，导热辅助结构提供从至少一个二次发热部件到耦合到其上的至少一个导热冷却剂输送管的导热传输，并且因此通过对流通过其中的液体冷却剂。

33. 发明授权

US07362574B2 Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus 失效
标题翻译：喷射孔板，具有用于直接冲击冷却装置的突出喷射孔结构
公开(公告)号：US07362574B2
公开(公告)日：2008-04-22
申请号：US11462735
申请日：2006-08-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , H01L23/24 , F28D15/00
CPC分类号： H01L23/4735 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , Y10S165/908 , H01L2224/0401
摘要： A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.
摘要翻译：提供冷却装置和直接冷却冲击模块，以及其制造方法。冷却装置和直接冲击冷却模块包括歧管结构和用于将冷却剂喷射到待冷却表面上的喷射孔板。喷射孔板包括用于在要冷却的表面引导冷却剂的多个喷射孔，其是配置有多个喷射孔结构的整体板。每个喷射孔结构从喷射孔板的下表面朝向要冷却的表面突出，并且包括相应的喷射孔。喷射孔结构被间隔开以限定其间的冷却剂流出物去除区域，其有助于将冷却剂流出物从被冷却到其周边区域的电子部件的中心区域上方移除，从而减少喷射孔板上的压降。

34. 发明授权

US07301770B2 Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins 失效
标题翻译：冷却装置，冷却电子模块及其制造方法采用导热的引线引脚散热片
公开(公告)号：US07301770B2
公开(公告)日：2007-11-27
申请号：US11009935
申请日：2004-12-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , F28F3/022 , H01L23/433 , H01L23/473 , H01L2224/78301 , H01L2924/10253 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

35. 发明授权

US07286351B2 Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system 有权
标题翻译：用于使用闭环热交换系统的电子机架的冷却的装置和方法
公开(公告)号：US07286351B2
公开(公告)日：2007-10-23
申请号：US11124525
申请日：2005-05-06
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing a closed loop heat exchange system. The closed loop heat exchange system includes a first heat exchanger, a second heat exchanger, and a coolant distribution loop connecting the first heat exchanger and the second heat exchanger. When operational, the coolant distribution loop allows coolant to circulate between the first heat exchanger and the second heat exchanger. The closed loop heat exchange system couples to the electronics rack with the first heat exchanger disposed at an air inlet side of the electronics rack, and the first heat exchanger and the second heat exchanger disposed in different inlet-to-outlet air flow paths through the electronics rack to reduce an imbalance in air flow temperature of the different inlet-to-outlet air flow paths through the electronics rack.
摘要翻译：提供了设备和方法，以便于采用闭环热交换系统的电子机架的冷却。闭环热交换系统包括第一热交换器，第二热交换器和连接第一热交换器和第二热交换器的冷却剂分配回路。当操作时，冷却剂分配回路允许冷却剂在第一热交换器和第二热交换器之间循环。闭环热交换系统与设置在电子机架的空气入口侧的第一热交换器耦合到电子机架，并且第一热交换器和第二热交换器设置在不同的入口到出口的气流通道中电子机架，以减少通过电子机架的不同入口到出口气流路径的空气流温度不平衡。

36. 发明授权

US08020298B2 Method of fabricating a heat exchanger with angled secondary fins extending from primary fins 失效
标题翻译：制造具有从主翅片延伸的成角度的辅助翅片的热交换器的方法
公开(公告)号：US08020298B2
公开(公告)日：2011-09-20
申请号：US12246545
申请日：2008-10-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： B21D53/06 , B23P15/26
CPC分类号： F28F1/126 , F28D2001/0266 , F28D2021/0031 , F28F1/30 , F28F1/32 , F28F2009/228 , G06F1/20 , G06F2200/201 , H01L23/3672 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49359 , Y10T29/49377 , Y10T29/49378 , Y10T29/4938 , H01L2924/00
摘要： A method of fabricating a heat exchanger which includes: obtaining multiple coolant-carrying conduit sections, each having a non-circular cross-section, and first and second main surfaces; providing multiple primary folded fins secured to the conduit sections. Each folded fin includes a solid fin surface with multiple bends defining alternating, U-shaped air-passage channels, and a base surface and a top surface. Each folded fin is secured at the base or top surface to a main surface of a conduit section, and the folded fins have leading and trailing edges relative to airflow direction. The method includes forming a plurality of sets of secondary fins, each set extending from the leading or trailing edge of a respective folded fin at an angle other than 0. At least one conduit section has a first folded fin secured to its first main surface, and a second folded fin secured to its second main surface thereof.
摘要翻译：一种制造热交换器的方法，包括：获得多个具有非圆形横截面的冷却剂承载管段，以及第一和第二主表面; 提供固定到导管部分的多个主折叠翼片。每个折叠翅片包括具有限定交替的U形通气通道的多个弯曲的固体翅片表面，以及基部表面和顶部表面。每个折叠的翅片在基部或顶部表面固定到导管部分的主表面，并且折叠的翅片具有相对于气流方向的前缘和后缘。该方法包括形成多组辅助散热片，每组二次散热片各自以相应的折叠翅片的前缘或后缘以不同于0的角度延伸。至少一个导管段具有固定到其第一主表面上的第一折叠翅片，以及固定到其第二主表面的第二折叠翅片。

37. 发明授权

US07948757B2 Multi-fluid cooling of an electronic device 失效
标题翻译：电子设备的多流体冷却
公开(公告)号：US07948757B2
公开(公告)日：2011-05-24
申请号：US12850099
申请日：2010-08-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00 , H01B9/06 , F25D23/12 , B05B7/06
CPC分类号： H01L23/4735 , H01L23/427 , H01L2924/0002 , Y10S165/908 , Y10T29/49002 , H01L2924/00
摘要： A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.
摘要翻译：提供了一种制造多流体冷却系统的方法，用于从一个或多个电子设备去除热量。冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

38. 发明授权

US07518871B2 Liquid-based cooling system for cooling a multi-component electronics system 有权
标题翻译：液体冷却系统，用于冷却多组件电子系统
公开(公告)号：US07518871B2
公开(公告)日：2009-04-14
申请号：US12168267
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
摘要翻译：提供了一种用于冷却电子系统的系统。冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂供给管分配到冷板以除去由各自的电子元件。

39. 发明申请

US20080310104A1 LIQUID-BASED COOLING APPARATUS FOR AN ELECTRONICS RACK 审中-公开
标题翻译：一种用于电子机架的基于液体的冷却装置
公开(公告)号：US20080310104A1
公开(公告)日：2008-12-18
申请号：US12174826
申请日：2008-07-17
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20781 , F28F9/0275 , H05K7/20772 , Y10T29/5313
摘要： A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.
摘要翻译：提供了一种用于促进电子机架的电子抽屉的冷却的冷却装置。该装置包括构造成用于安装到电子机架的双折门组件。门组件包括第一门和第二门，每个门被配置为单独地铰接安装到电子机架上。该装置还包括冷却剂分配装置，其中冷却剂供应歧管安装到第一门，并且其冷却剂返回歧管安装到第二门。单独的连接与冷却剂供应和返回歧管流体连通地联接，以便于冷却剂供给和从歧管返回并且用于促进门相对于电子机架的枢转运动。多个冷却剂分配端口设置在供应和返回歧管内，并且设置成便于冷却剂供应和返回到电子抽屉。

40. 发明授权

US07420808B2 Liquid-based cooling system for cooling a multi-component electronics system 有权
标题翻译：液体冷却系统，用于冷却多组件电子系统
公开(公告)号：US07420808B2
公开(公告)日：2008-09-02
申请号：US11539910
申请日：2006-10-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
摘要翻译：提供了一种用于冷却电子系统的系统。冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂输送管分配到冷板以除去由各自的电子元件。

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