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31. 发明授权

US07511957B2 Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled 失效
标题翻译：用于制造冷却的电子模块的方法，该冷却电子模块采用密封到待冷却表面的周边的导热返回歧管结构
公开(公告)号：US07511957B2
公开(公告)日：2009-03-31
申请号：US11420241
申请日：2006-05-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： F28C3/08 , F28F7/00 , H01L23/4735 , H01L2224/73253 , Y10S165/908
摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.
摘要翻译：使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面其中基面被密封到待冷却的表面。

32. 发明授权

US07486514B2 Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled 失效
标题翻译：冷却装置具有设置在模块外壳和要冷却的电子部件之间的分立冷板
公开(公告)号：US07486514B2
公开(公告)日：2009-02-03
申请号：US12054944
申请日：2008-03-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

33. 发明授权

US07477514B2 Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations 失效
标题翻译：促进采用多个冷却站的数据中心电子机架冷却的方法
公开(公告)号：US07477514B2
公开(公告)日：2009-01-13
申请号：US11744269
申请日：2007-05-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： A cooling method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.
摘要翻译：提供冷却方法来冷却离开数据中心的一个或多个电子机架的空气。冷却系统包括与数据中心的至少一个相应的电子机架分离和独立的至少一个冷却站，并且被配置为用于设置与其相邻的电子机柜的空气出口侧，用于冷却从电子机架排出空气。冷却站包括从相应的电子机架分离和独立的框架结构，以及由框架结构支撑的空气对液体热交换组件。热交换组件包括入口和出口，其构造成分别耦合到冷却剂供应源和冷却剂返回管线，以便于冷却剂通过其中。空气 - 液体热交换组件的尺寸设定为在排出到数据中心之前冷却从相应的电子机架的空气出口侧排出的空气。

34. 发明授权

US07400504B2 Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled 有权
标题翻译：冷却装置和方法采用分散的冷板，其顺应地耦合在待冷却的组件的公共歧管和电子部件之间
公开(公告)号：US07400504B2
公开(公告)日：2008-07-15
申请号：US11870667
申请日：2007-10-11
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/2079
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保良好的热界面。

35. 发明授权

US07397661B2 Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow 有权
标题翻译：冷却电子系统和方法采用空气 - 液体热交换和分叉空气流
公开(公告)号：US07397661B2
公开(公告)日：2008-07-08
申请号：US11467245
申请日：2006-08-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20754
摘要： Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.
摘要翻译：使用冷却液增强电子系统的空气冷却，以冷却进入系统的空气，并消除由电子设备消散的热量。冷却的电子系统包括具有抽屉的框架，其中包含要冷却的电子元件。框架包括一个带空气入口的前部和一个带有空气出口的后部。框架包围框架，并且包括位于空气入口上方的前盖，位于空气出口上方的后盖，并且第一和第二侧空气在框架的相对侧返回。至少一个空气移动装置在电子抽屉之间建立空气流。空气流在后盖处分叉并经由第一和第二侧面空气返回和前盖返回到进气口。空气对液体的热交换器冷却流过电子抽屉的空气。

36. 发明授权

US07349213B2 Coolant control unit, and cooled electronics system and method employing the same 有权
标题翻译：冷却液控制单元，冷却电子系统及采用该方法的方法
公开(公告)号：US07349213B2
公开(公告)日：2008-03-25
申请号：US11427465
申请日：2006-06-29
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079
摘要： A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and second control valve coupling the external coolant inlet and outlet to the internal coolant loop; a heat exchanger connected between the first and second control valves; and control logic for controlling operation of the coolant control unit in one of an external coolant mode and an internal coolant mode. In the external coolant mode, the first and second control valves allow passage of external coolant through the internal coolant loop to the electronics system, and in the internal coolant mode, the first and second control valves isolate coolant within the internal coolant loop from the external coolant inlet and outlet, and pass the coolant therein through the heat exchanger.
摘要翻译：提供了一种用于液冷电子系统的冷却剂控制单元，其包括用于接收和返回外部冷却剂的外部冷却剂入口和出口; 用于将冷却剂循环到电子系统的内部冷却剂回路; 将外部冷却剂入口和出口连接到内部冷却剂回路的第一和第二控制阀; 连接在第一和第二控制阀之间的热交换器; 以及用于控制冷却剂控制单元在外部冷却剂模式和内部冷却剂模式之一中的操作的控制逻辑。在外部冷却剂模式中，第一和第二控制阀允许外部冷却剂通过内部冷却剂回路到电子系统，并且在内部冷却剂模式中，第一和第二控制阀将内部冷却剂回路内的冷却剂与外部冷却剂入口和出口，并使冷却剂通过热交换器。

37. 发明授权

US07298618B2 Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled 有权
公开(公告)号：US07298618B2
公开(公告)日：2007-11-20
申请号：US11258316
申请日：2005-10-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/2079
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

38. 发明授权

US07277283B2 Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold 有权
标题翻译：冷却装置，冷却电子模块及其制造方法采用集成冷却剂入口和出口歧管
公开(公告)号：US07277283B2
公开(公告)日：2007-10-02
申请号：US11124513
申请日：2005-05-06
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes an integrated coolant inlet and outlet manifold having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. A plurality of exit openings are also provided on at least one edge surface of the manifold. These exit openings are in fluid communication through the manifold with the outlet openings to facilitate exhausting of coolant through the outlet openings and minimize pressure drop through the manifold. At least one surface plane projection of the at least one edge surface intersects a surface plane projection of the common surface.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括具有多个用于将冷却剂喷射到待冷却表面上的多个入口孔的集成冷却剂入口和出口歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。入口孔和出口开口散布在集成歧管的共同表面中。多个出口也设置在歧管的至少一个边缘表面上。这些出口通过歧管与出口开口流体连通，以便冷却剂通过出口开口排出并使通过歧管的压降最小化。所述至少一个边缘表面的至少一个表面平面突起与所述公共表面的表面平面投影相交。

39. 发明授权

US06973801B1 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack 有权
标题翻译：在电子机架的电子子系统内使用闭环冷却剂路径和微型冷却结构的冷却系统和方法
公开(公告)号：US06973801B1
公开(公告)日：2005-12-13
申请号：US11008711
申请日：2004-12-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D23/12 , H01L23/473 , H05K7/20
CPC分类号： H05K7/2079 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.
摘要翻译：为电子机架的一个或多个子系统提供冷却方法。冷却方式采用冷却液分配单元和散热单元。冷却剂分配单元具有第一热交换器，第一冷却回路和第二冷却回路。第一冷却回路使设备冷却剂通过第一热交换器，并且第二冷却回路将系统冷却剂提供给电子子系统，并将第一热交换器中的热量从子系统排出到设备冷却剂。散热单元与电子子系统相关联并且包括第二热交换器，第二冷却回路和第三冷却回路。第二冷却回路为第二热交换器提供系统冷却剂，第三冷却回路将调节后的冷却剂循环在电子子系统内，并将第二热交换器中的热量从电子系统排出到系统冷却剂。

40. 发明授权

US08953320B2 Coolant drip facilitating partial immersion-cooling of electronic components 有权
标题翻译：冷却液滴液促进电子部件的部分浸没冷却
公开(公告)号：US08953320B2
公开(公告)日：2015-02-10
申请号：US13613873
申请日：2012-09-13
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , H01L23/427
CPC分类号： H05K7/20809 , F28D15/02 , F28D15/046 , F28F3/048 , H05K7/203
摘要： Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.
摘要翻译：提供冷却装置和方法用于多个电子部件的部分浸没冷却。冷却装置包括至少部分围绕部件周围并形成隔室的壳体以及设置在隔间内的流体。第一和第二电子部件至少部分地不浸在流体内，其中第一部件是与第二部件不同的构造的不同类型的电子部件。蒸汽冷凝器设置有设置在隔间内的蒸汽冷凝表面，用于冷凝流体蒸气，并且冷凝物重新导向结构设置在蒸气冷凝器和第一和第二部件之间的隔间内。与第二电子部件相比，重定向结构在第一电子部件上被不同地配置，并且与第二部件相比，在第一部件上提供了不同的冷凝物滴落模式。

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