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31. 发明授权

US07212028B2 Signal receiving circuit 失效
标题翻译：信号接收电路
公开(公告)号：US07212028B2
公开(公告)日：2007-05-01
申请号：US11038436
申请日：2005-01-21
申请人： Osamu Shibata , Toru Iwata , Yoshiyuki Saito , Satoshi Takahashi , Wataru Itoh
发明人： Osamu Shibata , Toru Iwata , Yoshiyuki Saito , Satoshi Takahashi , Wataru Itoh
IPC分类号： H03K17/16 , H03K19/003
CPC分类号： H04L25/0278 , H04L25/0292
摘要： First and second transmission lines and are connected to each other in series. A first terminator is connected to the first transmission line in parallel, and is provided externally of a semiconductor device. A second terminator is connected to the second transmission line in parallel, and is provided inside the semiconductor device. The values of the first and second terminator are adjusted so that the combined resistance value of first and second terminator and the second transmission line matches with the impedance of the first transmission line. Impedance matching of the entire transmission line can be achieved with this simple construction, thus, a stable, high quality signal can be transmitted.
摘要翻译：第一和第二传输线并且彼此串联连接。第一终端器并联连接到第一传输线，并且设置在半导体器件的外部。第二终端器并联连接到第二传输线，并且设置在半导体器件的内部。调节第一和第二终端器的值，使得第一和第二终端器和第二传输线的组合电阻值与第一传输线的阻抗匹配。可以通过这种简单的结构实现整个传输线的阻抗匹配，从而可以传输稳定的高质量信号。

32. 发明申请

US20050184381A1 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US20050184381A1
公开(公告)日：2005-08-25
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R13/24 , H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/34 , H05K3/36 , H05K3/40 , H01R27/02 , H01L23/48 , H01R12/00 , H01R25/00 , H01R31/00 , H01R33/88 , H01R33/90 , H01R33/92 , H01R33/94
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.
摘要翻译：提供了可以在没有通孔形成步骤的情况下制造的连接构件。连接构件100包括绝缘基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面。

33. 发明申请

US20060071320A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20060071320A1
公开(公告)日：2006-04-06
申请号：US11242955
申请日：2005-10-05
申请人： Osamu Shibata , Yoshiyuki Saito
发明人： Osamu Shibata , Yoshiyuki Saito
IPC分类号： H01L23/52
CPC分类号： H01L23/60 , H01L23/552 , H01L23/66 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/4813 , H01L2224/484 , H01L2224/48599 , H01L2224/4911 , H01L2224/49113 , H01L2224/49174 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00
摘要： Fine-pitch first and second bonding pads are formed on a chip along its perimeter. The first bonding pads are formed at the peripheral parts on the chip, while the second bonding pads are formed inside the peripheral parts. An ESD protection circuit is connected to the first bonding pad, and an I/O circuit is connected to the second bonding pad. First and second bonding wires connect the first and second bonding pads to the same package pin, respectively. The second bonding wire is configured to be sufficiently longer than the first bonding wire, regardless of the pitch of the first bonding pads.
摘要翻译：细间距第一和第二接合焊盘沿其周边形成在芯片上。第一接合焊盘形成在芯片的周边部分，而第二接合焊盘形成在周边部分内部。 ESD保护电路连接到第一焊盘，并且I / O电路连接到第二接合焊盘。第一和第二接合线分别将第一和第二接合焊盘连接到相同的封装引脚。第二接合线被配置为比第一接合线充分长，而与第一接合焊盘的间距无关。

34. 发明申请

US20050162184A1 Signal receiving circuit 失效
标题翻译：信号接收电路
公开(公告)号：US20050162184A1
公开(公告)日：2005-07-28
申请号：US11038436
申请日：2005-01-21
申请人： Osamu Shibata , Toru Iwata , Yoshiyuki Saito , Satoshi Takahashi , Wataru Itoh
发明人： Osamu Shibata , Toru Iwata , Yoshiyuki Saito , Satoshi Takahashi , Wataru Itoh
IPC分类号： H03K19/003 , H04L25/02
CPC分类号： H04L25/0278 , H04L25/0292
摘要： First and second transmission lines and are connected to each other in series. A first terminator is connected to the first transmission line in parallel, and is provided externally of a semiconductor device. A second terminator is connected to the second transmission line in parallel, and is provided inside the semiconductor device. The values of the first and second terminator are adjusted so that the combined resistance value of first and second terminator and the second transmission line matches with the impedance of the first transmission line. Impedance matching of the entire transmission line can be achieved with this simple construction, thus, a stable, high quality signal can be transmitted.
摘要翻译：第一和第二传输线并且彼此串联连接。第一终端器并联连接到第一传输线，并且设置在半导体器件的外部。第二终端器并联连接到第二传输线，并且设置在半导体器件的内部。调整第一和第二终端器的值，使得第一和第二终端器与第二传输线的组合电阻值与第一传输线的阻抗匹配。可以通过这种简单的结构实现整个传输线的阻抗匹配，从而可以传输稳定的高质量信号。

35. 发明申请

US20120328304A1 OPTICAL TRANSMISSION SYSTEM 有权
标题翻译：光传输系统
公开(公告)号：US20120328304A1
公开(公告)日：2012-12-27
申请号：US13583102
申请日：2011-10-28
申请人： Tsuyoshi Ikushima , Osamu Shibata , Yoshiyuki Saito
发明人： Tsuyoshi Ikushima , Osamu Shibata , Yoshiyuki Saito
IPC分类号： H04B10/00
CPC分类号： H04B10/07 , H04B10/2503
摘要： An optical transmission system for optically transmitting information between apparatuses via an optical transmission path. The system includes: a sending unit that emits, to the optical transmission path, excitation light for detecting an inter-apparatus connection via the path; a responding unit that receives the excitation light from the path and emits detection light to the path using light energy of the excitation light; a response receiving unit that receives the detection light from the path and outputs a detection light current; a detecting unit that detects presence/absence of the inter-apparatus connection based on the detection light current; a light signal transmitting unit that emits, to the path, a light signal for optically transmitting the information based on the detection result by the detecting unit; and a light signal receiving unit that receives the light signal from the path.
摘要翻译：一种用于经由光传输路径在设备之间光学传输信息的光传输系统。该系统包括：发送单元，其向光传输路径发射用于检测经由路径的装置间连接的激励光; 响应单元，其从所述路径接收激发光，并且使用所述激发光的光能向所述路径发射检测光; 响应接收单元，其从所述路径接收所述检测光并输出检测光电流; 检测单元，其基于所述检测光电流来检测所述装置间连接的有无; 光信号发送单元，基于所述检测单元的检测结果向所述路径发射用于光信息发送的光信号; 以及从该路径接收光信号的光信号接收单元。

36. 发明授权

US07777687B2 Electronic device containing case, electromagnetic shield body, and electronic device containing structure 有权
标题翻译：电子装置容纳盒，电磁屏蔽体和电子装置的结构
公开(公告)号：US07777687B2
公开(公告)日：2010-08-17
申请号：US12064890
申请日：2006-09-21
申请人： Osamu Shibata , Yoshiyuki Saito
发明人： Osamu Shibata , Yoshiyuki Saito
IPC分类号： H01Q1/52 , H01Q1/24
CPC分类号： A47B81/06 , H01Q1/526
摘要： A main object of the present invention is to reliably perform radio communication in an electronic device containing case without spoiling an aesthetic aspect thereof. In order to achieve the object, an electromagnetic shield body is provided on a wall surface of the case for containing an electronic device capable of the radio communication.
摘要翻译：本发明的主要目的在于可靠地执行电子装置的电子装置的无线通信，而不损害其美学方面。为了实现该目的，电磁屏蔽体设置在壳体的壁表面上，用于容纳能够进行无线电通信的电子设备。

37. 发明授权

US07748110B2 Method for producing connection member 有权
标题翻译：连接部件的制造方法
公开(公告)号：US07748110B2
公开(公告)日：2010-07-06
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H05K3/36
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

38. 发明申请

US20090008131A1 Flexible printed-circuit board 审中-公开
标题翻译：柔性印刷电路板
公开(公告)号：US20090008131A1
公开(公告)日：2009-01-08
申请号：US11659131
申请日：2005-07-28
申请人： Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H05K1/02
CPC分类号： H05K1/0219 , H05K1/0237 , H05K1/118 , H05K2201/055 , H05K2201/09236 , H05K2201/09445 , H05K2201/09727
摘要： A flexible printed board that is adapted to high-speed transmission and can mount a plurality of connectors at low cost is provided. The board comprises a flexible printed board body 100 that has a first side 100a and a second side 100b opposed to each other, and an overlap portion 105 formed by bending its one end; a plurality of wiring lines 101 that are arranged on the first side 100a of the body substantially in parallel to each other; first pads 103 that are connected to respective ends of wiring lines, wider than the wiring lines and formed on the first-side surface 105a of the overlap potion; and second pads 104 that are located at respective ends of wiring lines, wider than the wiring lines and formed on the second-side surface 105b of the overlap potion. The wiring lines 101a with the first pads connected thereto and the wiring lines 101b with the second pads 104 connected thereto are alternatively arranged on the first side.
摘要翻译：提供了适用于高速传输并可以以低成本安装多个连接器的柔性印刷电路板。板包括具有彼此相对的第一侧100a和第二侧面100b的柔性印刷电路板主体100和通过使其一端弯曲形成的重叠部分105; 布置在主体的第一侧100a上的多个布线101基本上彼此平行; 第一焊盘103，其连接到布线的相应端部，比布线宽，并形成在重叠部分的第一侧表面105a上; 以及第二焊盘104，其位于布线的相应端部，比布线宽，并且形成在重叠部分的第二侧表面105b上。具有与其连接的第一焊盘的布线101a和与其连接的第二焊盘104的布线101b交替布置在第一侧上。

39. 发明授权

US06901343B2 MULTILAYER BOARD IN WHICH WIRING OF SIGNAL LINE THAT REQUIRES TAMPER-RESISTANCE IS COVERED BY COMPONENT OR FOIL, DESIGN APPARATUS, METHOD, AND PROGRAM FOR THE MULTILAYER BOARD, AND MEDIUM RECORDING THE PROGRAM 有权
标题翻译：组件或者硬盘所要求的防篡改信号线的多层板，多层板的设计，方法和程序，以及程序的中程记录
公开(公告)号：US06901343B2
公开(公告)日：2005-05-31
申请号：US10029571
申请日：2001-12-20
申请人： Eiji Takahashi , Yukihiro Fukumoto , Yoshiyuki Saito , Osamu Shibata , Shinichi Tanimoto , Takeshi Nakayama
发明人： Eiji Takahashi , Yukihiro Fukumoto , Yoshiyuki Saito , Osamu Shibata , Shinichi Tanimoto , Takeshi Nakayama
IPC分类号： G06F17/50 , H05K1/00 , H05K1/02 , H05K1/11 , H04L9/32
CPC分类号： G06F17/5068 , H05K1/0275 , H05K1/0298 , H05K1/114 , H05K2201/09627 , H05K2201/09772 , H05K2201/10151
摘要： A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.
摘要翻译：在组件101的六层板和连接端子102与元件114的端子115之间的信号线需要防篡改。信号线由外层的箔103，通孔104，第三层上的箔111，通孔105，第四层上的箔112，第106层和第六层上的箔113组成。存在于外层的信号线部分都隐藏在电路元件下面。箔103和通孔104的末端放置在第一层116上的部件101下方，通孔105的端部放置在层116上的部件107的下方，通孔106的端部放置在层116上的部件108的下方，另一端通孔104被放置在第六层121上的部件109的下方，通孔105的另一端被放置在层121上的部件110下方，并且箔113和通孔106的另一端放置在层121上的部件114下方。

40. 发明授权

US06629302B2 Circuit board design aiding apparatus, design aiding method, and storage medium storing design aiding program 有权
标题翻译：电路板设计辅助设备，设计辅助方法和存储设备辅助程序存储介质
公开(公告)号：US06629302B2
公开(公告)日：2003-09-30
申请号：US09746886
申请日：2000-12-22
申请人： Shinji Miura , Yukihiro Fukumoto , Hirokazu Uemura , Yoshiyuki Saito , Hiroshi Ikeda , Takeshi Nakayama , Osamu Shibata , Shinichi Tanimoto
发明人： Shinji Miura , Yukihiro Fukumoto , Hirokazu Uemura , Yoshiyuki Saito , Hiroshi Ikeda , Takeshi Nakayama , Osamu Shibata , Shinichi Tanimoto
IPC分类号： G06F945
CPC分类号： G06F17/5068
摘要： A design aiding apparatus and a method, and a storage medium storing a design aiding program enable the efficient layout design of components in a multilayer wiring board formed by laminating a plurality of wiring layers. The design aiding apparatus includes (a) a first acquiring unit for acquiring information showing a first location in a lamination direction of the wiring layers, (b) a second acquiring unit for acquiring information showing a second location on a two-dimensional plane that is orthogonal to the lamination direction, and (c) a placement unit for generating information showing a space to be occupied when the component is placed in such a manner that a placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location. According to the above construction, the present invention is capable of aiding layout design of components in the wiring board.
摘要翻译：设计辅助装置和方法以及存储设计辅助程序的存储介质使得能够通过层叠多个布线层而形成的多层布线板中的部件的有效布局设计。设计辅助装置包括：（a）第一获取单元，用于获取表示布线层的层叠方向上的第一位置的信息，（b）第二获取单元，用于获取表示二维平面上的第二位置的信息，与所述层叠方向正交，以及（c）放置单元，用于产生表示当所述部件以所述部件的放置基准点与所述第二位置的所述第二位置一致的方式配置时要占据的空间的信息，包括第一位置的三维平面。根据上述结构，本发明能够帮助布线板中部件的布局设计。

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