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    • 31. 发明授权
    • Semiconductor substrate and device with a surface layer structure
    • 具有表面层结构的半导体衬底和器件
    • US5396082A
    • 1995-03-07
    • US205771
    • 1994-03-04
    • Yoshinori WadaKazumi WadaTakahisa Ohno
    • Yoshinori WadaKazumi WadaTakahisa Ohno
    • H01L29/205H01L29/161
    • H01L29/205
    • The semiconductor device has a semiconductor substrate composed essentially of a III-V compound semiconductor containing Ga and As, and a surface layer structure provided on the semiconductor substrate and this layer has a composition different from that of the semiconductor substrate. The surface layer structure includes a strained layer epitaxially grown on the surface of the semiconductor substrate and composed essentially of at least one-element selected from the group consisting of indium, gallium, aluminum and boron, and at least one element selected from the group consisting of arsenic and phosphorus. The strained layer has a composition different from that of the semiconductor substrate The strained layer has a valence band maximum lower in energy than that of the valence band maximum of the semiconductor substrate.
    • 半导体器件具有基本上由包含Ga和As的III-V族化合物半导体构成的半导体衬底以及设置在半导体衬底上的表面层结构,该层具有不同于半导体衬底的组成。 表面层结构包括外延生长在半导体衬底的表面上并且基本上由选自铟,镓,铝和硼的至少一种元素组成的应变层,以及至少一种选自以下的元素: 的砷和磷。 应变层具有与半导体衬底的组成不同的组成。应变层具有与半导体衬底的价带最大值的能量最低的价带。