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    • 33. 发明授权
    • Ultrasonic imaging apparatus
    • 超声波成像装置
    • US08519998B2
    • 2013-08-27
    • US12170021
    • 2008-07-09
    • Shinichi HashimotoItsuki KugaEiichi Shiki
    • Shinichi HashimotoItsuki KugaEiichi Shiki
    • G06T15/08G09G5/02A61B8/06
    • A61B8/06A61B8/461A61B8/466G06T15/08G06T2210/41
    • A transmitter/receiver transmits and receives ultrasonic waves to and from a desired region of a subject via an ultrasonic probe. A signal processor obtains a plurality of physical quantities from signals outputted by the transmitter/receiver having received ultrasonic echoes from the subject. A voxel-value generator generates a voxel value containing the plurality of physical quantities. An image generator generates a three-dimensional image by using the plurality of physical quantities including any of the rate, power value or dispersion of a blood flow contained in the voxel value and sequentially executing a rendering process on each voxel. A display controller controls a display to display the generated three-dimensional image.
    • 发射机/接收机经由超声波探头向被摄体的期望区域发送超声波和从受检者的期望区域接收超声波。 信号处理器从已经从被摄体接收到超声回波的发射机/接收机输出的信号中获得多个物理量。 体素值生成器生成包含多个物理量的体素值。 图像生成器通过使用包含体素值中包含的血流速率,功率值或色散的多个物理量,并对每个体素依次执行渲染处理来生成三维图像。 显示控制器控制显示器以显示生成的三维图像。
    • 35. 发明申请
    • ULTRASONIC DIAGNOSIS APPARATUS AND ULTRASONIC IMAGE PROCESSING APPARATUS
    • 超声诊断装置和超声波图像处理装置
    • US20110087094A1
    • 2011-04-14
    • US12900888
    • 2010-10-08
    • Hiroyuki OhuchiYasuhiko AbeShinichi HashimotoMasahide Nishiura
    • Hiroyuki OhuchiYasuhiko AbeShinichi HashimotoMasahide Nishiura
    • A61B8/00
    • A61B8/08A61B8/0883A61B8/483A61B8/523G01S7/52074G01S15/8993
    • According to one embodiment, an ultrasonic diagnosis apparatus comprises a data acquisition unit configured to acquire a plurality of volume data over a predetermined period by executing ultrasonic scanning on a three-dimensional region including at least part of a heart of an object over the predetermined period, a detection condition setting unit configured to set detection conditions which are conditions used to detect a plurality of slices from the at least one volume data and include a detection accuracy associated with at least one slice and an angle defined between slices, a slice detection unit configured to detect the plurality of slices from the at least one volume data in accordance with the set detection conditions, an image generating unit configured to generate MPR images respectively corresponding to the plurality of detected slices, and a display unit configured to display the MPR images.
    • 根据一个实施例,一种超声波诊断装置包括:数据获取单元,被配置为通过在包括预定时段内的物体的心脏的至少一部分的三维区域上执行超声波扫描,在预定时段内获取多个体积数据 检测条件设置单元,被配置为设置作为用于从所述至少一个卷数据检测多个片段的条件的检测条件,并且包括与切片之间定义的至少一个切片和角度相关联的检测精度;切片检测单元 被配置为根据所设置的检测条件从所述至少一个卷数据检测所述多个片段;图像生成单元,被配置为生成分别对应于所述多个检测到的片段的MPR图像;以及显示单元,被配置为显示所述MPR图像 。
    • 36. 发明申请
    • IC Socket and IC Socket Assembly
    • IC插座和IC插座组件
    • US20090286417A1
    • 2009-11-19
    • US11995648
    • 2006-07-03
    • Hidenori TaguchiShinichi Hashimoto
    • Hidenori TaguchiShinichi Hashimoto
    • H01R13/62
    • H05K7/1007H01R13/2442
    • An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof is disclosed. The IC socket has an insulating housing that receives the IC package and a plurality of elastic contacts, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package. The IC socket also has a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.
    • 公开了一种用于接收在其底面上具有多个电触点的IC封装的IC插座。 IC插座具有绝缘壳体,其接收IC封装和多个弹性触点,每个固定在绝缘壳体上的一端,并且每个触头的剩余端接触IC底面上的至少一个电触头 包。 IC插座还具有由绝缘壳体承载的弹簧构件,其确定被接纳到绝缘壳体中的IC封装的接受位置,并且抑制由于弹性触点的弯曲引起的IC封装的水平移动量 IC封装被按下。
    • 37. 发明申请
    • ULTRASONIC IMAGING APPARATUS
    • 超声波成像设备
    • US20090015587A1
    • 2009-01-15
    • US12170021
    • 2008-07-09
    • Shinichi HashimotoItsuki KugaEiichi Shiki
    • Shinichi HashimotoItsuki KugaEiichi Shiki
    • G06T17/00A61B8/06
    • A61B8/06A61B8/461A61B8/466G06T15/08G06T2210/41
    • A transmitter/receiver transmits and receives ultrasonic waves to and from a desired region of a subject via an ultrasonic probe. A signal processor obtains a plurality of physical quantities from signals outputted by the transmitter/receiver having received ultrasonic echoes from the subject. A voxel-value generator generates a voxel value containing the plurality of physical quantities. An image generator generates a three-dimensional image by using the plurality of physical quantities including any of the rate, power value or dispersion of a blood flow contained in the voxel value and sequentially executing a rendering process on each voxel. A display controller controls a display to display the generated three-dimensional image.
    • 发射机/接收机经由超声波探头向被摄体的期望区域发送超声波和从受检者的期望区域接收超声波。 信号处理器从已经从被摄体接收到超声回波的发射机/接收机输出的信号中获得多个物理量。 体素值生成器生成包含多个物理量的体素值。 图像生成器通过使用包含体素值中包含的血流速率,功率值或色散的多个物理量,并对每个体素依次执行渲染处理来生成三维图像。 显示控制器控制显示器以显示生成的三维图像。
    • 39. 发明授权
    • IC socket assembly
    • IC插座总成
    • US07349217B2
    • 2008-03-25
    • US10837226
    • 2004-04-30
    • Shinichi Hashimoto
    • Shinichi Hashimoto
    • H05K7/20H01L23/34H01L21/82F28F7/00
    • H01L23/4093H01L2924/0002H01L2924/00
    • The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.
    • IC插座组件包括用于抵靠IC封装的上表面散热由此产生的热的散热器,以及用于将散热器固定到壳体的固定构件。 固定构件包括:框架,安装在电路板的表面上,壳体安装在框架上; 背板,安装在电路板的相对表面上,具有接合臂,其通过电路板的孔插入并接合框架; 一对固定在接合臂上的装载梁; 以及由加载梁轴向支撑的用于将散热器推向壳体的一对杆。