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31. 发明申请

US20100285411A1 MICRO-FLUID EJECTION DEVICES WITH A POLYMERIC LAYER HAVING AN EMBEDDED CONDUCTIVE MATERIAL 失效
标题翻译：具有嵌入式导电材料的聚合物层的微流体喷射装置
公开(公告)号：US20100285411A1
公开(公告)日：2010-11-11
申请号：US12842329
申请日：2010-07-23
申请人： Frank E. Anderson , Yimin Guan , Carl Edmond Sullivan , Timothy Lowell Strunk
发明人： Frank E. Anderson , Yimin Guan , Carl Edmond Sullivan , Timothy Lowell Strunk
IPC分类号： G03F7/20
CPC分类号： B41J2/14072 , B41J2202/03
摘要： Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.
摘要翻译：微流体喷射装置，用于制造微流体喷射装置的方法以及用于减小用于微流体喷射头的基底的尺寸的方法。一个这样的微流体喷射装置具有邻近基底的聚合物层和嵌入聚合物层中的至少一个导电层。聚合物层包含至少两层聚合材料。

32. 发明申请

US20100165056A1 Heater Stack In A Micro-Fluid Ejection Device And Method For Forming Floating Electrical Heater Element In The Heater Stack 有权
标题翻译：微流体喷射装置中的加热器堆叠和在加热器堆叠中形成浮动电加热器元件的方法
公开(公告)号：US20100165056A1
公开(公告)日：2010-07-01
申请号：US12345788
申请日：2008-12-30
申请人： Yimin Guan , Zachary Justin Reitmeier , Carl Edmond Sullivan
发明人： Yimin Guan , Zachary Justin Reitmeier , Carl Edmond Sullivan
IPC分类号： B41J2/14 , H01L21/3213
CPC分类号： B41J2/1412 , B41J2/1601 , B41J2/1629 , B41J2/1631
摘要： A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.
摘要翻译：一种用于形成浮动加热元件的方法包括处理硅衬底以形成具有在周边边缘部分的衬底上具有加热器元件的加热器堆叠，通过在其上沉积和图案化一层光致抗蚀剂或硬掩模来对加热器堆叠进行处理以基本上掩盖加热器堆叠并通过光致抗蚀剂或硬掩模形成沟槽，暴露沿着加热器元件的周边边缘部分延伸的衬底的表面区域，并且通过顺序地除去光致抗蚀剂和部分来处理掩模加热器堆叠和暴露的衬底表面区域在基板的暴露的表面区域，并且位于加热器元件的下面，以便在底板上形成一个凹槽，该底板使加热器元件沿其周缘部分开口，并且能够填充流体，从而产生浮动加热元件。

33. 发明申请

US20080165227A1 Micro-Fluid Ejection Devices, Methods For Making Micro-Fluid Ejection Heads, and Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters 失效
标题翻译：微流体喷射装置，制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头
公开(公告)号：US20080165227A1
公开(公告)日：2008-07-10
申请号：US11683572
申请日：2007-03-08
申请人： Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
发明人： Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2202/03 , B41J2202/11 , Y10T29/49401
摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.
摘要翻译：微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。

34. 发明申请

US20080079776A1 Micro-Fluid Ejection Heads with Chips in Pockets 有权
标题翻译：微型流体喷射头与芯片中的芯片
公开(公告)号：US20080079776A1
公开(公告)日：2008-04-03
申请号：US11536470
申请日：2006-09-28
申请人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
发明人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
IPC分类号： B41J2/04
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , Y10T29/49401
摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.
摘要翻译：提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。导电材料沉积在衬底的器件表面附近并与芯片电连通。

35. 发明授权

US06796019B2 Process for making a heater chip module 有权
标题翻译：制造加热器芯片模块的过程
公开(公告)号：US06796019B2
公开(公告)日：2004-09-28
申请号：US10166273
申请日：2002-06-10
申请人： Steven Robert Komplin , Ashok Murthy , Carl Edmond Sullivan
发明人： Steven Robert Komplin , Ashok Murthy , Carl Edmond Sullivan
IPC分类号： H05B300
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/1645 , B41J2/1646 , H01L2224/49171 , H01L2224/8592 , H01L2924/01019 , H01L2924/01021 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , Y10T29/49083 , Y10T29/4913 , Y10T29/49323 , Y10T29/49401 , H01L2924/00
摘要： A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
摘要翻译：提供了一种用于形成加热器芯片模块的方法，该加热器芯片模块包括适于固定到填充墨水的容器的载体，至少一个加热器芯片，其具有联接到载体的底部，以及耦合到加热器芯片的至少一个喷嘴板。载体包括具有至少一个通道的支撑基板，该通道限定油墨从容器行进到加热器芯片的路径。加热器芯片在其底部固定到支撑基板的一部分。至少所述支撑基板的所述部分由具有与所述加热器芯片基座基本上相同的热膨胀系数的材料形成。柔性电路例如通过TAB键合或引线键合耦合到加热器芯片模块。

36. 发明授权

US06629756B2 Ink jet printheads and methods therefor 有权
公开(公告)号：US06629756B2
公开(公告)日：2003-10-07
申请号：US09788479
申请日：2001-02-20
申请人： Qing-Ming Wang , Carl Edmond Sullivan , James Harold Powers
发明人： Qing-Ming Wang , Carl Edmond Sullivan , James Harold Powers
IPC分类号： B41J2045
CPC分类号： B41J2/1646 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1645 , B41J2002/14411
摘要： The invention provides a method for making piezoelectric printheads for ink jet The method includes applying an insulating layer to a first surface of a silicon wafer having a thickness ranging from about 200 to about 800 microns. A first conducting layer is applied to the insulating layer on the first surface and a piezoelectric layer is applied to the first conducting layer. The piezoelectric layer is patterned to provide piezoelectric elements on the first surface of the silicon wafer. A second conducting layer is applied to the piezoelectric layer and is patterned to provide conductors for applying an electric field across each of the piezoelectric elements. A photoresist layer is applied to a second surface of the silicon wafer, and the photoresist layer is imaged and developed to provide pressurizing chamber locations. The silicon wafer is then dry etched through the thickness of the wafer up to the insulating layer on the first surface of the wafer. A nozzle plate containing nozzle holes corresponding to the pressurizing chambers is applied and bonded to the second surface of the silicon wafer. As opposed to conventional wet chemical etching techniques, the method of the invention significantly decreases the manufacturing tolerances required and provides more reliable printheads for long term printer use.

37. 发明授权

US06357864B1 Tab circuit design for simplified use with hot bar soldering technique 有权
标题翻译： Tab电路设计，简化使用热棒焊接技术
公开(公告)号：US06357864B1
公开(公告)日：2002-03-19
申请号：US09464969
申请日：1999-12-16
申请人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
发明人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
IPC分类号： B41J205
CPC分类号： B41J2/14072 , B41J2/14024 , H05K3/3494 , H05K3/363 , H05K3/4084 , H05K2201/0394 , H05K2201/10681 , H05K2201/10977 , H05K2203/0195 , H05K2203/1311
摘要： The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.
摘要翻译：本发明提供了一种包含在喷墨打印机内的打印头墨盒体，其包含带状自动粘合（TAB）电路，其具有电连接到打印头加热器芯片和印刷电路板（PCB）的独特结构。此外，TAB电路架构可以通过各种方法容易地密封。 TAB电路包括细长孔，其具有垂直于穿过孔的电迹线对准的长度轴。每个迹线具有穿过孔的第一端，并且通过热棒焊接技术连接到PCB，并且迹线的第二端连接到打印头加热器芯片。密封剂层基本上包围矩形孔和防止墨雾接触连接的电连接。 TAB电路设计提供了制造过程的改进，并能够重新连接连接而不破坏TAB电路。

38. 发明授权

US06254214B1 System for cooling and maintaining an inkjet print head at a constant temperature 有权
标题翻译：用于在恒定温度下冷却和维护喷墨打印头的系统
公开(公告)号：US06254214B1
公开(公告)日：2001-07-03
申请号：US09330716
申请日：1999-06-11
申请人： Ashok Murthy , Carl Edmond Sullivan
发明人： Ashok Murthy , Carl Edmond Sullivan
IPC分类号： B41J2938
CPC分类号： B41J2/14153 , B41J1/00 , B41J2/1408
摘要： A system for cooling an inkjet print head with the print head having a nozzle plate and heater chip. The nozzle plate contains a series of firing chambers and nozzles. The heater chip contains several heating elements and cooling channels. Ink is heated in the firing chambers and forced through the nozzles onto paper. A pump is employed to pump the ink from an ink reservoir through the cooling channels in the heater chip in order to maintain the heater chip at a constant temperature. When the printer is actively printing, at least a portion of the ink is returned to the reservoir. When the printer is not actively printing, ink is still pumped through the cooling channels to maintain the heater chip at the proper temperature.
摘要翻译：一种用于具有喷嘴板和加热器芯片的打印头来冷却喷墨打印头的系统。喷嘴板包含一系列燃烧室和喷嘴。加热器芯片包含几个加热元件和冷却通道。油墨在燃烧室中被加热并被迫通过喷嘴到纸上。采用泵将墨水从墨水储存器中通过加热器芯片中的冷却通道进行泵送，以便将加热器芯片保持在恒定温度。当打印机正在主动打印时，至少一部分墨水返回到储存器。当打印机没有主动打印时，墨水仍然被泵送通过冷却通道，以将加热器芯片保持在适当的温度。

39. 发明授权

US08968527B2 Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters 有权
标题翻译：微流体喷射装置，用于制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头
公开(公告)号：US08968527B2
公开(公告)日：2015-03-03
申请号：US12690955
申请日：2010-02-16
申请人： Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
发明人： Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
IPC分类号： C23C14/34 , C23C16/00 , B41J2/14
CPC分类号： B41J2/14129 , B41J2202/03 , B41J2202/11 , Y10T29/49401
摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.
摘要翻译：微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。

40. 发明授权

US08070265B2 Heater stack in a micro-fluid ejection device and method for forming floating electrical heater element in the heater stack 有权
标题翻译：微流体喷射装置中的加热器堆叠和用于在加热器堆叠中形成浮动电加热器元件的方法
公开(公告)号：US08070265B2
公开(公告)日：2011-12-06
申请号：US12345788
申请日：2008-12-30
申请人： Yimin Guan , Zachary Justin Reitmeier , Carl Edmond Sullivan
发明人： Yimin Guan , Zachary Justin Reitmeier , Carl Edmond Sullivan
IPC分类号： B41J2/14 , B41J2/04 , H01L21/3213
CPC分类号： B41J2/1412 , B41J2/1601 , B41J2/1629 , B41J2/1631
摘要： A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.
摘要翻译：一种用于形成浮动加热元件的方法包括处理硅衬底以形成具有在周边边缘部分的衬底上具有加热器元件的加热器堆叠，通过在其上沉积和图案化一层光致抗蚀剂或硬掩模来对加热器堆叠进行处理以基本上掩盖加热器堆叠并通过光致抗蚀剂或硬掩模形成沟槽，暴露沿着加热器元件的周边边缘部分延伸的衬底的表面区域，并且通过顺序地除去光致抗蚀剂和部分来处理掩模加热器堆叠和暴露的衬底表面区域在基板的暴露的表面区域，并且位于加热器元件的下面，以便在底板上形成一个凹槽，该底板使加热器元件沿其周缘部分开口，并且能够填充流体，从而产生浮动加热元件。

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