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    • 31. 发明授权
    • Emboli capturing device
    • Emboli拍摄装置
    • US06547759B1
    • 2003-04-15
    • US10065194
    • 2002-09-25
    • John S. Fisher
    • John S. Fisher
    • A61M2900
    • A61M25/104A61B2017/2212A61F2/013A61F2/958A61F2002/018A61F2230/0006A61F2230/008A61M2025/0004
    • A balloon angioplasty or stenting apparatus includes a guide wire, a balloon catheter ensleeving the guide wire, and a guide catheter ensleeving the balloon catheter. The balloon catheter has slots formed in it to define elongate members between the slots. A joint is formed at the proximal, distal, and mid-point of each elongate member. Displacing the proximal and distal joints toward and away from one another causes the respective middle joints to displace radially outwardly and inwardly, respectively. A mesh that captures emboli while allowing blood perfusion partially overlies the jointed members is opened and closed when the jointed members are opened and closed. A guide wire having an outer coil and an inner rod slideably received within it has jointed members formed in the outer coil. The mesh is opened and closed by axially retracting and advancing the inner rod with respect to the outer coil, respectively.
    • 球囊血管成形术或支架置入装置包括引导线,包围引导线的气囊导管以及包围球囊导管的引导导管。 气囊导管具有形成在其中的槽,以在槽之间限定细长构件。 在每个细长构件的近端,远端和中点处形成接头。 将近端和远端关节朝着彼此和远离的方向放置时,各个中间的关节分别径向向外和向内移位。 当接合构件打开和关闭时,打开并关闭在允许血液灌注部分地覆盖接合构件的情况下捕获栓塞的网状物。 具有外线圈和可滑动地容纳在其中的内杆的导丝具有形成在外线圈中的接合构件。 通过分别相对于外部线圈轴向缩回和推进内杆来打开和关闭网状物。
    • 32. 发明授权
    • Dual channel microwave transmit/receive module for an active aperture of a radar system
    • 双通道微波发射/接收模块,用于雷达系统的主动孔径
    • US06278400B1
    • 2001-08-21
    • US09450905
    • 1999-11-29
    • John W. CassenEdward L. Rich, IIIGary N. BonadiesJohn S. FisherJohn W. GipprichJohn D. GorntoDaniel J. HeffernanDavid A. HerlihyScott C. TollePatrick K. RichardDavid W. StrackScott K. SukoTimothy L. EderChad E. WilsonGary L. FerrellStephanie A. Parks
    • John W. CassenEdward L. Rich, IIIGary N. BonadiesJohn S. FisherJohn W. GipprichJohn D. GorntoDaniel J. HeffernanDavid A. HerlihyScott C. TollePatrick K. RichardDavid W. StrackScott K. SukoTimothy L. EderChad E. WilsonGary L. FerrellStephanie A. Parks
    • G01S728
    • G01S7/03G01S7/032H01Q21/0025
    • Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package. The RF transmit power amplifiers which generate most of the heat in the module package are located in a first pair of cavities formed in the substrate directly behind the RF connector assembly and are mounted directly on a pair of flat heat sink plates which are secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate. A second pair of cavities in which are located the RF receive signal amplifiers and their respective receiver protector elements, is located beside the first pair of cavities directly behind the RF connector for reducing RF signal loss.
    • 在单个公共T / R模块封装中实现两个离散的发送/接收(T / R)信道,其具有提供组合功能,控制和功率调节的能力,同时利用单个多腔多层衬底,其包括高或 低温共烧陶瓷层。 陶瓷层具有包括接地面和带状线导体的相应金属化图案以及形成在其中的馈通或垂直通孔的外表面,用于提供屏蔽RF和DC电力和逻辑控制信号两者的三维布线,以便除其他外, 一对RF歧管信号耦合器,其嵌入在衬底中并且转变到封装前端处的多引脚盲配合压接RF连接器组件。 DC和逻辑输入/输出控制信号通过封装后部的弹簧接触焊盘连接到包括专用集成电路(ASIC)和单片微波集成电路芯片(MMIC)的多个有源电路部件。 用于将模块的发送和接收信号耦合到RF模块的RF连接器组件位于封装的前部。 在模块封装中产生大部分热量的RF发射功率放大器位于直接位于RF连接器组件后面的衬底中形成的第一对空腔中,并直接安装在一对平坦的散热板上, 并且用作与诸如冷板之类的外部热交换器的热界面。 位于RF接收信号放大器及其各自的接收器保护器元件的第二对空腔位于RF连接器正后方的第一对空腔旁边,用于减少RF信号损失。
    • 34. 发明授权
    • Method for constructing town houses and the like
    • 城镇建设方法等
    • US4194339A
    • 1980-03-25
    • US931307
    • 1978-08-07
    • John S. Fisher
    • John S. Fisher
    • E04B1/348E04B1/00
    • E04B1/34823
    • A modular building construction system having (a) a series of rectangular U-shaped in vertical cross-section modules, each having only two bearing walls opposite each other and joined by a floor panel and open on top, and (b) a series of rectangular tube-shaped in vertical cross-section modules, each having only two bearing walls opposite each other and joined by both a floor panel and a ceiling panel. The tube-shaped modules are used only on the top story, and the U-shaped modules are used generally as lower units. The modules on each level are installed end to end so as to form a continuous living space in the longitudinal direction and side by side so as to form a separate series of living spaces and double walls separating the living spaces in the transverse direction.
    • 一种模块化建筑施工系统,其具有(a)一系列矩形的U形垂直横截面模块,每个模块仅具有彼此相对的两个轴承壁,并通过底板连接并在顶部开口,以及(b)一系列 矩形管状的垂直横截面模块,每个仅具有彼此相对的两个轴承壁,并且通过地板镶板和天花板面板连接。 管状模块仅用于上层故障,U形模块通常用作较低单元。 各级的模块端对端地安装,以便在纵向和并排上形成连续的生活空间,以形成分开的一系列生活空间和在横向上分隔居住空间的双层壁。