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    • 35. 发明授权
    • System and method for reducing shorting in memory cells
    • 用于减少存储器单元短路的系统和方法
    • US07855085B2
    • 2010-12-21
    • US11535456
    • 2006-09-26
    • Joel A. DrewesJames G. Deak
    • Joel A. DrewesJames G. Deak
    • H01L21/70G11C11/15
    • H01L27/222H01L43/08H01L43/12
    • An MRAM device includes an array of magnetic memory cells having an upper conductive layer and a lower conductive layer separated by a barrier layer. To reduce the likelihood of electrical shorting across the barrier layers of the memory cells, spacers can be formed around the upper conductive layer and, after the layers of the magnetic memory cells have been etched, the memory cells can be oxidized to transform any conductive particles that are deposited along the sidewalls of the memory cells as byproducts of the etching process into nonconductive particles. Alternatively, the lower conductive layer can be repeatedly subjected to partial oxidation and partial etching steps such that only nonconductive particles can be thrown up along the sidewalls of the memory cells as byproducts of the etching process.
    • MRAM器件包括具有由阻挡层隔开的上导电层和下导电层的磁存储单元的阵列。 为了减少跨越存储器单元的阻挡层的电短路的可能性,可以在上导电层周围形成间隔物,并且在已经蚀刻了磁存储单元的层之后,可以将存储单元氧化以转换任何导电颗粒 沿着存储器单元的侧壁沉积作为蚀刻工艺的副产物而形成非导电颗粒。 或者,下导电层可以重复进行部分氧化和部分蚀刻步骤,使得只有非导电颗粒可以作为蚀刻工艺的副产物沿着存储器单元的侧壁被抛出。
    • 38. 发明申请
    • Methods of forming integrated circuitry
    • 形成集成电路的方法
    • US20080233700A1
    • 2008-09-25
    • US11724784
    • 2007-03-15
    • Eric R. BlomileyJoel A. DrewesD.V. Nirmal Ramaswamy
    • Eric R. BlomileyJoel A. DrewesD.V. Nirmal Ramaswamy
    • H01L21/336
    • H01L21/823425H01L21/823481H01L27/10873H01L27/1203
    • The invention includes semiconductor processing methods in which openings are formed to extend into a semiconductor substrate, and the substrate is then annealed around the openings to form cavities. The substrate is etched to expose the cavities, and the cavities are substantially filled with insulative material. The semiconductor substrate having the filled cavities therein can be utilized as a semiconductor-on-insulator-type structure, and transistor devices can be formed to be supported by the semiconductor material and to be over the cavities. In some aspects, the transistor devices have channel regions over the filled cavities, and in other aspects the transistor devices have source/drain regions over the filled cavities. The transistor devices can be incorporated into dynamic random access memory, and can be utilized in electronic systems.
    • 本发明包括半导体处理方法,其中形成开口以延伸到半导体衬底中,然后将衬底围绕开口退火以形成空腔。 蚀刻衬底以暴露空腔,并且空腔基本上用绝缘材料填充。 其中具有填充空穴的半导体衬底可以用作绝缘体上半导体型结构,并且晶体管器件可以形成为被半导体材料支撑并且在空腔之上。 在一些方面,晶体管器件在填充腔体上具有沟道区域,在其它方面,晶体管器件在填充腔体上具有源极/漏极区域。 晶体管器件可以并入到动态随机存取存储器中,并且可以在电子系统中使用。