专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US5483515A Apparatus and method for cancelling cross-talk in signals from optical data storage systems 失效
标题翻译：用于消除来自光学数据存储系统的信号中的串扰的装置和方法
公开(公告)号：US5483515A
公开(公告)日：1996-01-09
申请号：US308023
申请日：1994-09-16
申请人： David C. Cheng , Jerry E. Hurst, Jr. , Radley W. Olson , David A. Thompson
发明人： David C. Cheng , Jerry E. Hurst, Jr. , Radley W. Olson , David A. Thompson
IPC分类号： G11B7/005 , G11B7/00
CPC分类号： G11B7/005
摘要： A system is disclosed for canceling cross-talk in a data read signal from an optical data storage medium. The system includes three AD converters for receiving read signals from three read sensors, and the read signals respectively represent data from a center data track and its two adjacent side data tracks on an optical data storage disk. The digitized signals are sent to a skew compensator to remove time skew between the signals. Then, the amplitudes represented by the side track signals are adjusted, and the adjusted side track signals are subtracted from the center track signal to cancel cross-talk in the center track signal which is attributable to data contained in the side data tracks. The center track signal is then equalized to account for the frequency response of the center track read sensor.
摘要翻译：公开了一种用于消除来自光学数据存储介质的数据读取信号中的串扰的系统。该系统包括用于从三个读取传感器接收读取信号的三个AD转换器，并且读取信号分别表示来自光学数据存储盘上的中心数据轨道及其两个相邻侧面数据轨道的数据。数字化信号被发送到偏移补偿器以消除信号之间的时间偏差。然后，调整由侧轨道信号表示的幅度，并且从中心轨道信号中减去调整的侧轨迹信号，以消除可归因于侧面数据轨道中包含的数据的中心轨道信号中的串扰。然后将中心轨迹信号相等以考虑中心轨道读取传感器的频率响应。

32. 发明授权

US5171709A Laser methods for circuit repair on integrated circuits and substrates 失效
标题翻译：用于集成电路和基板的电路修复的激光方法
公开(公告)号：US5171709A
公开(公告)日：1992-12-15
申请号：US770838
申请日：1991-10-04
申请人： John J. Donelon , James P. Doyle , Jerry E. Hurst, Jr. , Stephen M. Rossnagel
发明人： John J. Donelon , James P. Doyle , Jerry E. Hurst, Jr. , Stephen M. Rossnagel
IPC分类号： H01L21/48 , H01L21/768 , H05K3/18 , H05K3/22
CPC分类号： H05K3/225 , H01L21/4846 , H01L21/76894 , H05K2203/107 , H05K2203/1136 , H05K2203/173 , H05K3/182
摘要： The present invention relates to a method of accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using a thin conductive layer formed within the surface of a substrate and laser plating techniques. What has been described is a maskless means of repairing discontinuities in a conductor disposed on the surface of a substrate wherein the surface is locally irradiated to form a reversible carbonaceous layer thereon. This reversible carbonaceous layer acts as a base for electrodeless deposition of a metal to form a bridge across the discontinuity by laser-enhanced exchange plating or other suitable methods. Further, a means of accessing and repairing a discontinuity buried by a cover layer of an insulating or passivating material is described, wherein access to the discontinuity is provided by ablating away the cover layer using a pulsed excimer laser at a first power level.
摘要翻译：本发明涉及使用形成在基板表面内的薄导电层和激光镀覆技术来访问和修复在半导体芯片或其它基板上的导电金属线路中的电气开口的方法。已经描述的是在设置在衬底的表面上的导体中修复不连续性的无掩模方法，其中局部照射表面以在其上形成可逆碳质层。这种可逆的碳质层用作金属的无电极沉积的基底，以通过激光增强交换电镀或其它合适的方法跨越不连续形成桥。此外，描述了访问和修复由绝缘或钝化材料的覆盖层掩埋的不连续性的方法，其中通过在第一功率水平下使用脉冲准分子激光器去除覆盖层来提供对不连续性的访问。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式