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31. 发明申请

US20170079165A1 MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME 审中-公开
标题翻译：模块化的机架式冷却组件及其组装方法
公开(公告)号：US20170079165A1
公开(公告)日：2017-03-16
申请号：US15362487
申请日：2016-11-28
申请人： Inertech IP LLC
发明人： Earl Keisling , John Costakis , Gerald McDonnell
IPC分类号： H05K7/20
CPC分类号： H05K7/20745 , H05K7/20736 , H05K7/20781 , H05K7/20827 , Y10T29/49826
摘要： A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.
摘要翻译：用于冷却数据中心组件的至少一个服务器机架中的至少一个服务器的模块化服务器机架冷却结构包括至少第一支撑构件和至少第一热交换器。第一热交换器联接到第一支撑构件，其构造成将第一热交换器与至少一个服务器的热传递关系定位。第一热交换器不连接到至少一个服务器机架。模块化服务器机架冷却结构还应用于包括至少第一机架和至少彼此相对设置的第二机架以形成热通道或冷通道的系统。公开了一种用于在模块化服务器机架冷却结构的支撑结构上安装附加热交换器以满足增加的冷却能力要求而不需要额外空间的方法。

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