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    • 35. 发明授权
    • Methods of manufacturing magnetoresistive random access memory devices
    • 制造磁阻随机存取存储器件的方法
    • US09159767B2
    • 2015-10-13
    • US14182316
    • 2014-02-18
    • Jong-Chul ParkGwang-Hyun BaekHyung-Joon KwonIn-Ho KimChang-Woo Sun
    • Jong-Chul ParkGwang-Hyun BaekHyung-Joon KwonIn-Ho KimChang-Woo Sun
    • H01L43/12H01L27/22
    • H01L27/228G11C11/161H01L43/12
    • In a method of an MRAM device, first and second patterns are formed on a substrate alternately and repeatedly in a second direction. Each first pattern and each second pattern extend in a first direction perpendicular to the second direction. Some of the second patterns are removed to form first openings extending in the first direction. Source lines filling the first openings are formed. A mask is formed on the first and second patterns and the source lines. The mask includes second openings in the first direction, each of which extends in the second direction. Portions of the second patterns exposed by the second openings are removed to form third openings. Third patterns filling the third openings are formed. The second patterns surrounded by the first and third patterns are removed to form fourth openings. Contact plugs filling the fourth openings are formed.
    • 在MRAM器件的方法中,第一和第二图案在第二方向上交替且重复地形成在衬底上。 每个第一图案和每个第二图案沿垂直于第二方向的第一方向延伸。 去除一些第二图案以形成沿第一方向延伸的第一开口。 形成填充第一开口的源极线。 在第一和第二图案和源极线上形成掩模。 掩模包括沿第一方向的第二开口,每个开口沿第二方向延伸。 由第二开口暴露的第二图案的部分被去除以形成第三开口。 形成填充第三开口的第三图案。 由第一图案和第三图案包围的第二图案被去除以形成第四开口。 形成填充第四开口的接触塞。
    • 37. 发明申请
    • METHODS OF MANUFACTURING A DRAM DEVICE
    • 制造DRAM器件的方法
    • US20130011989A1
    • 2013-01-10
    • US13540996
    • 2012-07-03
    • Jong-Chul ParkSang-Sup Jeong
    • Jong-Chul ParkSang-Sup Jeong
    • H01L21/8242
    • H01L27/10888H01L21/76897H01L27/10855H01L27/10876
    • In methods of manufacturing a DRAM device, a buried-type gate is formed in a substrate. A capping insulating layer pattern is formed on the buried-type gate. A conductive layer pattern filling up a gap between portions of the capping insulating layer pattern, and an insulating interlayer covering the conductive layer pattern and the capping insulating layer pattern are formed. The insulating interlayer, the conductive layer pattern, the capping insulating layer pattern and an upper portion of the substrate are etched to form an opening, and a first pad electrode making contact with a first pad region. A spacer is formed on a sidewall of the opening corresponding to a second pad region. A second pad electrode is formed in the opening. A bit line electrically connected with the second pad electrode and a capacitor electrically connected with the first pad electrode are formed.
    • 在制造DRAM器件的方法中,在衬底中形成掩埋型栅极。 掩埋型栅极上形成封盖绝缘层图案。 形成填充封盖绝缘层图案的部分之间的间隙的导电层图案,以及覆盖导电层图案和封盖绝缘层图案的绝缘夹层。 蚀刻绝缘中间层,导电层图案,封盖绝缘层图案和基板的上部以形成开口,以及与第一焊盘区域接触的第一焊盘电极。 间隔件形成在对应于第二垫区域的开口的侧壁上。 第二焊盘电极形成在开口中。 形成与第二焊盘电极电连接的位线和与第一焊盘电极电连接的电容器。