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    • 31. 发明授权
    • Underfilling efficiency by modifying the substrate design of flip chips
    • 通过修改倒装芯片的衬底设计,填充效率不足
    • US07075016B2
    • 2006-07-11
    • US10781169
    • 2004-02-18
    • Hsin-Hui LeeChao-Yuan Su
    • Hsin-Hui LeeChao-Yuan Su
    • H05K1/00
    • H01L21/563H01L23/13H01L2224/16225H01L2224/32225H01L2224/73203H01L2224/73204H01L2924/00
    • A substrate structure including a substrate with solder bumps on a main region and a peripheral region of a front side thereof; a solder mask is formed over the front side of the substrate; and a metal trace structure formed within the solder mask. The metal trace structure including a channel therein for the receipt of underfill. The metal trace structure further including a central portion with arms radiating outwardly therefrom, dividing the solder mask into separate areas. A method of underfilling a chip wherein a chip having a pattern of solder bumps formed on the underside of the chip is placed underside first onto the metal trace structure of the present invention. The solder bump pattern includes openings over the metal trace structure. Underfill is introduced into the metal trace structure so that the underfill flows from the metal trace structure and between the solder bumps to underfill the chip.
    • 一种基板结构,其包括在主区域上具有焊料凸块的基板和其前侧的周边区域; 在衬底的前侧形成焊料掩模; 以及形成在焊料掩模内的金属迹线结构。 金属迹线结构包括用于接收底部填充物的通道。 金属轨迹结构还包括具有从其向外辐射的臂的中心部分,将焊接掩模分成不同的区域。 一种底部填充芯片的方法,其中具有形成在芯片的下侧上的焊料凸块图案的芯片首先放置在本发明的金属迹线结构上。 焊料凸块图案包括金属迹线结构上的开口。 底部填充物被引入到金属迹线结构中,使得底部填充物从金属迹线结构和焊料凸块之间流动,从而在芯片下面填充。